The invention discloses a
wafer photoetching device. The photoetching device structurally comprises a main body, a control panel, a feeding hole, a photolithographic block and a developing device, wherein the feeding hole is formed in the left side of the main body, the developing device comprises a
photoresist recycling box, a
wafer collecting box, a conveying belt, a carrying disc, a sliding rodand a spraying device, the material spraying device comprises a transverse sliding block, a limiting block, a rotating block, a
threaded rod, a material passing
pipe and a discharging device, the discharging device comprises a material passing groove, a material spraying head, a groove, a power spraying head and a
slag brushing device, the
slag brushing device comprises a material blocking device, a rotating rod and a
brush, and the material blocking device is arranged at a side end of the
slag brushing device. The photoetching device is advantaged in that the power
nozzle is used for vertically spraying the
photoresist, the slag brushing device installed in the middle of the groove is impacted, the material blocking device is impacted to rotate, and therefore the
brush fixedly embedded in the rotating rod rotates to
brush residues on a surface of a
wafer, and the situation that reacted residues are attached to the surface of the wafer, and development of the photoetching position ofthe post-reaction wafer is affected is avoided.