The invention discloses a pure
tin electroplating solution for inhibiting growth of
tin whiskers and an application thereof. A
mixed solution of methylsulphonic acid and
sulfuric acid is adopted as an acidic plating solution, a
mixed solution of
alkyl sulfonic acid tin salt and
hydrogen peroxide is adopted as tin salt, and antioxidants, adjuvants, brightening agents,
wetting agents, surface-active agents and the like are added to the mixed solutions. In the application process, an unique
electroplating solution preparing method and matters needing attention in use are adopted, and therefore the effect of inhibiting the growth of the tin
whiskers is obvious compared with the application of a traditional
electroplating solution; moreover, the
growth speed of the tin
whiskers is greatly reduced, and the growth of the tin whiskers on the surface of an electroplated part is reduced; moreover, plated
layers electroplated through the method is good in flexibility and
ductility, cracks of the plated
layers can be well reduced, the ability to bear the temperature is flexible, and the practical value is high.