The invention provides a LED
chip die-bonding method and a
package method of a display module having the same. The LED
chip die-bonding method comprises the steps of: S1, disposing a
welding materialon a circuit board for curing to obtain a
welding portion fixed on the circuit board; S2, detachably disposing a LED
chip on the first surface of the substrate, wherein the LED chip has an
electrode surface and a light emitting surface which are opposite, the light emitting surface is in contact with the first surface, and the
electrode surface is located on one side, far away from the substrate,of the light emitting surface; and S3, making the
welding portion and the surface of the
electrode contact, and allowing the portion, close to the surface of the electrode, of the welding portion to be melted, and fixing the LED chip on the circuit board through the melted welding portion. The LED chip die-bonding method cannot pull the LED chip and cannot cause short-circuit of positive and negative electrodes so as to improve the yield of the die-
bonding process; and compared to the prior art, the LED chip die-bonding method can perform die-bonding of hundreds of LED chips each time so as toimprove the die-bonding efficiency.