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36results about How to "Unwanted contact" patented technology
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Enhanced Braided Sleeve and Method of Construction Thereof
ActiveUS20140220276A1Improve abilitiesIncrease contentEnvelopes/bags making machineryOrnamental textile articlesYarnEngineering
A braided protective sleeve and method of construction thereof is provided. The sleeve has a wall extending along a longitudinal axis of the sleeve. The wall includes a plurality of braided yarns forming inner and outer surfaces of the sleeve. The inner surface bounds an internal cavity and the outer surface is exposed to the surrounding environment. The yarns are braided with one another in a X / Y braid pattern with X and Y being different numerical values from one another. The numerical values of X and Y can be selected as desired to provide the sleeve with the enhanced physical performance characteristics desired. A plurality of yarns extending substantially parallel to the longitudinal axis can be interlaced with the braided yarns. The interlaced yarns can be exposed to the internal cavity and concealed from the environment; exposed to the environment and concealed from the internal cavity, or both.
Owner:FEDERAL MOGUL POWERTAIN LLC
Composite non-woven ink absorber
InactiveUS6809047B2Uniform and efficient absorption and transportFast absorptionSynthetic resin layered productsWoven fabricsHigh densityVolumetric Mass Density
Owner:BMP AMERICA
Pin driven flexible chamber abrading workholder
InactiveUS20140127976A1Increase vacuumIncrease speedPolishing machinesRevolution surface grinding machinesElastomerEngineering
Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a lug-pin device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
Owner:DUESCHER WAYNE O
Spreader spring
InactiveUS8393441B2Reduce resistanceIncrease expensesAxially engaging brakesSlack adjustersEngineeringBrake pad
Owner:AKEBONO BRAKE
Spreader spring
InactiveUS20120186917A1Reduce resistanceMovement is minimized and eliminatedAxially engaging brakesSlack adjustersEngineeringBrake pad
A brake assembly comprising: at least one brake spring that includes: a first arm; a second arm, the first arm and the second arm forming a first arm plane; and a body portion between and connecting to the first arm and the second arm, the body portion forming a body plane, the body plane being at an angle relative to the first arm plane; wherein the at least one brake spring is between and in communication with a pressure plate of at least two brake pads.
Owner:AKEBONO BRAKE
Bellows driven air floatation abrading workholder
InactiveUS20140120804A1Grinding speed is fastQuick changePolishing machinesRevolution surface grinding machinesIdler-wheelSemiconductor
Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The wafer carrier rotor is contained by a set of idlers that are attached to a stationary rotor housing to provide support against abrading forces that are imposed on the wafer by the moving abrasive coating on a rotary platen. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The system is also well suited for lapping optical devices and rotary seals and for chemical mechanical planarization (CMP) polishing of wafers using resilient pads. Pressurized air is injected into the bellows device to provide uniform abrading pressure across the full surface of the wafer. Wafers can be attached to the workpiece carrier with vacuum.
Owner:DUESCHER WAYNE O
Spider arm driven flexible chamber abrading workholder
InactiveUS20140120806A1Increase vacuumIncrease speedPolishing machinesRevolution surface grinding machinesElastomerEngineering
Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a circular flexible-arm device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial and lateral motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
Owner:DUESCHER WAYNE O
Sealing element for a brake cylinder of a vehicle braking system
ActiveUS7966813B2Easy to manufactureOverflow evenlyEngine sealsPiston ringsMechanical engineeringPiston
A sealing element seals a pressure piston which is movably arranged in a housing of a brake cylinder. The sealing element may be inserted into a ring-shaped groove which is provided in the housing. The sealing element includes an outer sealing lip for contact with a floor of the ring-shaped groove, an inner sealing lip for contact with the pressure piston, and a sealing element back. At least one non-sealing spacer element is provided on the sealing element back.
Owner:LUCAS AUTOMOTIVE GMBH
Bellows driven floatation-type abrading workholder
InactiveUS20140120805A1Grinding speed is fastQuick changeGrinding machine componentsPolishing machinesWaferingEngineering
Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The carrier rotor is also restrained by a rigid rotating housing to allow a limited lateral motion and also a limited angular motion. Air pressure within a sealed bellows chamber provides controlled abrading pressure for wafers or other workpieces. Vacuum can also be applied to the bellows chamber to quickly move the wafer away from the abrading surface. Wafers can be quickly attached to the workpiece carrier with vacuum.
Owner:DUESCHER WAYNE O
Flexible diaphragm combination floating and rigid abrading workholder
InactiveUS20140170938A1Increase speedQuick changePolishing machinesRevolution surface grinding machinesElastomerEngineering
Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating or rigid workpiece holder carrier that is supported by a pressurized-air flexible elastomer disk sealed air-chamber device and is rotationally driven by a flexible arm or a lug-pin device. The rotating wafer carrier rotor is horizontally restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. A wide range of abrading pressures are applied uniformly across the surface of the workpiece. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
Owner:DUESCHER WAYNE O
Wafer pads for fixed-spindle floating-platen lapping
InactiveUS20120270478A1Grinding speed is fastIncrease speedPolishing machinesRevolution surface grinding machinesCoolantEngineering
Three rotary wafer abrasive lapping spindles having attached wafers are mounted on the flat surface of a granite lapping machine base. A flexible raised island abrasive disk is attached to the annular abrading surface of an abrading platen that is rotated at high speeds to flat lap, or polish, the exposed surfaces of the rotating wafers. Resilient wafer pads are used to minimize the effects of the abraded surfaces of the wafers not being precisely parallel to the platen abrading surface due to misalignment of the spindle tops. The resilient pads also compensate for two opposed flat surfaces of wafers not precisely parallel with each other. A mixture of the same types of chemicals that are used in the conventional CMP polishing of wafers with applied coolant water can be used with this abrasive lapping or polishing system to enhance abrading and to continually wash abrading debris from the wafers.
Owner:DUESCHER WAYNE O
Sheet transport device
InactiveUS20070013125A1Avoid enteringReduce the overall diameterPile receiversPictoral communicationEngineeringPaper sheet
A sheet transport device according to this invention is provided with: a sheet tray on which a sheet to be transported is placed; a device main body provided with a transport path led from the sheet tray to a discharge outlet; a transport mechanism for transporting the sheet from the sheet tray to the discharge outlet via the transport path; shafts projecting from positions in the vicinity of opposite ends of the discharge outlet of the device main body to horizontal directions opposite to each other; a discharge tray having a main tray which retains the discharged sheet and is provided with bearings for the shafts; and locking members provided in the vicinity of the shafts of the device main body. The locking members lock the shafts of the discharge tray in the bending posture. This locking prevents the discharge tray in the bending posture from coming off the device main body. The locking members allow the bearings of the discharge tray in the bending posture to move toward the front ends of the shafts. The bearings come off the shafts when a load larger than a predetermined one is applied on the main tray.
Owner:BROTHER KOGYO KK
Tool for a knock-on sweep structure
InactiveUS6957476B2Easy to useReduce manufacturing costSoil-working equipmentsMetal working apparatusEngineeringExtreme position
A sweep removal tool includes a pair of claws with angled surfaces conforming to the top edge of the sweep stem to locate the tool and help distribute sweep removal impact forces. A retainer depressor centered below the claws moves the retainer to a release position and slides between the angled surfaces during sweep removal. The depressor shape assures desired tine contact, even when the sweep is at an extreme position in the range of possible mounted positions, while preventing damaging contact as the depressor moves relative to the retainer during sweep removal. A curved surface extends between the claws and the depressor and facilitates free pivoting of the tine about the claw contact points to depress the retainer. The tool bottoms against the sweep when the depressor is moved to the release position to prevent retained damage from removal impact forces.
Owner:DEERE & CO
Bellows driven air floatation abrading workholder
InactiveUS8845394B2Increase speedQuick changePolishing machinesRevolution surface grinding machinesEngineeringSemiconductor
Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The wafer carrier rotor is contained by a set of idlers that are attached to a stationary rotor housing to provide support against abrading forces that are imposed on the wafer by the moving abrasive coating on a rotary platen. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The system is also well suited for lapping optical devices and rotary seals and for chemical mechanical planarization (CMP) polishing of wafers using resilient pads. Pressurized air is injected into the bellows device to provide uniform abrading pressure across the full surface of the wafer. Wafers can be attached to the workpiece carrier with vacuum.
Owner:DUESCHER WAYNE O
Method and apparatus for making commercial crustless sandwiches and the crustless sandwich made thereby
InactiveUS20040180115A1Quality improvementPrevent undesired seepageConfectionerySweetmeatsMechanical engineeringManufacturing engineering
A method of making a crustless sandwich from two slices of bread with outer crusts, the method comprising: placing a first slice of bread on a platen; forming a mass of a first food spread onto the central portion of the first slice of bread in a position spaced inwardly from a marginal area where the mass is formed with an inner lower layer with an outer rim extending upwardly from the lower layer to define a closed pocket or receptacle recess in the mass; placing a second food spread in the receptacle recess; closing the receptacle recess with a layer of the first food spread generally coextensive with the mass and supported on the outer rim of the mass to encapsulate the second food spread into a center composite food layer; placing a second slice of bread over the first slice to cover the center composite food layer; cutting the bread slices in unison in a cut pattern to remove the crusts of the slices; and, pressing the two bread slices together by force through the slices against a pressure surface on the platen to crimp the slices into a crustless sandwich.
Owner:THE J M SMUCKER CO
Sheet transport device
InactiveUS7384038B2Avoid enteringReduce the overall diameterPile receiversPictoral communicationMechanical engineeringEngineering
A sheet transport device according to this invention is provided with: a sheet tray on which a sheet to be transported is placed; a device main body provided with a transport path led from the sheet tray to a discharge outlet; a transport mechanism for transporting the sheet from the sheet tray to the discharge outlet via the transport path; shafts projecting from positions in the vicinity of opposite ends of the discharge outlet of the device main body to horizontal directions opposite to each other; a discharge tray having a main tray which retains the discharged sheet and is provided with bearings for the shafts; and locking members provided in the vicinity of the shafts of the device main body. The locking members lock the shafts of the discharge tray in the bending posture. This locking prevents the discharge tray in the bending posture from coming off the device main body. The locking members allow the bearings of the discharge tray in the bending posture to move toward the front ends of the shafts. The bearings come off the shafts when a load larger than a predetermined one is applied on the main tray.
Owner:BROTHER KOGYO KK
Spider arm driven flexible chamber abrading workholder
InactiveUS8998678B2Increase speedQuick changePolishing machinesRevolution surface grinding machinesElastomerEngineering
Owner:DUESCHER WAYNE O
Disposable handle cover for a surgical lighthead
ActiveUS8789243B2Unwanted contactMechanical apparatusTravelling carriersLight headBiomedical engineering
The invention is a disposable cover handle cover for a surgical light head, and more particularly to a single-piece, integrally-formed disposable handle cover for a surgical light head and the like. The disposable cover includes a single-piece hollow member having a first open end adapted to receive the positioning handle of the surgical light head housing a camera and a second open end generally opposite the first end. The second end is closed off by a lens disposed within and integral with the hollow body.
Owner:ECOLAB USA INC
Leadframe
ActiveUS8133759B2Reduce exposureVertical offset of the package can be reduced or eliminatedSemiconductor/solid-state device detailsSolid-state devicesMechanical engineeringEngineering
Owner:MACRONIX INT CO LTD
Wafer pads for fixed-spindle floating-platen lapping
InactiveUS8647172B2Grinding speed is fastIncrease speedPolishing machinesRevolution surface grinding machinesEngineeringCoolant
Three rotary wafer abrasive lapping spindles having attached wafers are mounted on the flat surface of a granite lapping machine base. A flexible raised island abrasive disk is attached to the annular abrading surface of an abrading platen that is rotated at high speeds to flat lap, or polish, the exposed surfaces of the rotating wafers. Resilient wafer pads are used to minimize the effects of the abraded surfaces of the wafers not being precisely parallel to the platen abrading surface due to misalignment of the spindle tops. The resilient pads also compensate for two opposed flat surfaces of wafers not precisely parallel with each other. A mixture of the same types of chemicals that are used in the conventional CMP polishing of wafers with applied coolant water can be used with this abrasive lapping or polishing system to enhance abrading and to continually wash abrading debris from the wafers.
Owner:DUESCHER WAYNE O
Multi-chip semiconductor package structure
InactiveUS6844616B2Reducing circuit spaceLow production costSemiconductor/solid-state device detailsSolid-state devicesLead on chipSemiconductor package
A multi-chip semiconductor package structure. The structure includes two chips and two lead frames. The leads on one of the lead frames have inner leads at one end and joint sections at the other end. The joint sections are connected with another lead frame. Both lead frames use a common set of external leads. The two chips and two lead frames are joined together forming a lead-on-chip structure with the two chips facing each other back-to-back. The assembly except the external leads is enclosed by packaging material.
Owner:VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
Package for paste-like products
InactiveUS20110132927A1Facilitated releaseEasy to openFlexible coversWrappersEngineeringMechanical engineering
The inventive package for paste-like products is designed in the form of a flat packet which is made of a flexible material and has an opening line. The area adjacent to the opening line is provided with element the rigidity of which is greater than the rigidity of the package. The cross-section of the packet over the opening line is in the form of a narrow longitudinal aperture. The elements adjacent to the packet walls are in the form of stripes, the length of which corresponds to the length of the aperture formed when the packet is opened. The opening line is in the form of incisions and / or perforations. The closing element is made as a part of the packet which comprises the seam of the flat packet and is detachable when the packet is opened.
Owner:ANKUDINOV VLADIMIR ALEKSANDROVICH
Bellows driven floatation-type abrading workholder
InactiveUS8998677B2Increase speedQuick changePolishing machinesRevolution surface grinding machinesWaferingEngineering
Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The carrier rotor is also restrained by a rigid rotating housing to allow a limited lateral motion and also a limited angular motion. Air pressure within a sealed bellows chamber provides controlled abrading pressure for wafers or other workpieces. Vacuum can also be applied to the bellows chamber to quickly move the wafer away from the abrading surface. Wafers can be quickly attached to the workpiece carrier with vacuum.
Owner:DUESCHER WAYNE O
Pin driven flexible chamber abrading workholder
InactiveUS9039488B2Increase speedQuick changePolishing machinesRevolution surface grinding machinesElastomerEngineering
Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a lug-pin device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
Owner:DUESCHER WAYNE O
Flexible diaphragm combination floating and rigid abrading workholder
InactiveUS9011207B2Increase speedQuick changePolishing machinesRevolution surface grinding machinesElastomerEngineering
Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating or rigid workpiece holder carrier that is supported by a pressurized-air flexible elastomer disk sealed air-chamber device and is rotationally driven by a flexible arm or a lug-pin device. The rotating wafer carrier rotor is horizontally restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. A wide range of abrading pressures are applied uniformly across the surface of the workpiece. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.
Owner:DUESCHER WAYNE O
Enhanced braided sleeve and method of construction thereof
ActiveUS9394636B2Improve abilitiesIncrease contentOrnamental textile articlesPipe protection against damage/wearYarnEngineering
A braided protective sleeve and method of construction thereof is provided. The sleeve has a wall extending along a longitudinal axis of the sleeve. The wall includes a plurality of braided yarns forming inner and outer surfaces of the sleeve. The inner surface bounds an internal cavity and the outer surface is exposed to the surrounding environment. The yarns are braided with one another in a X / Y braid pattern with X and Y being different numerical values from one another. The numerical values of X and Y can be selected as desired to provide the sleeve with the enhanced physical performance characteristics desired. A plurality of yarns extending substantially parallel to the longitudinal axis can be interlaced with the braided yarns. The interlaced yarns can be exposed to the internal cavity and concealed from the environment; exposed to the environment and concealed from the internal cavity, or both.
Owner:FEDERAL MOGUL POWERTAIN LLC
Torque transmission device
InactiveUS20160215851A1Improve staminaReduce eliminateSpringsSprings/dampers design characteristicsTorque transmissionCentrifugal force
A torque transfer device having a spring damper and a centrifugal pendulum, the torque transfer device being rotatable around an axis of rotation, the centrifugal pendulum having a pendulum flange and at least one pendulum mass, the pendulum mass being connected to the pendulum flange by means of a sliding block guide, the sliding block guide prescribing an oscillation path of the pendulum mass, the pendulum mass being designed to oscillate along the oscillation path, the pendulum flange being torsionally connected to the spring damper, the spring damper being designed to transfer a torque, a switching device being provided, the switching device being coupled with the spring damper, the switching device being designed to reduce the oscillating motion of the pendulum mass along the oscillation path at least partially when a predefined threshold value of the torque is exceeded.
Owner:SCHAEFFLER TECH AG & CO KG
Coil system and housing
ActiveUS9202623B2Reduce riskUnwanted contactTransformersTransformers/inductances casingsManagement systemElectrical and Electronics engineering
A coil system for a burner management system and coil housing is provided having recessed terminals and a housing lid to cover the terminal recesses for reducing exposure of coil system terminals to air and unwanted contacts.
Owner:PROFIRE ENERGY
Coil component
ActiveUS20200005993A1Bonding areaBonding strengthTransformers/inductances coils/windings/connectionsTransformers/inductances magnetic coresMetal membraneMechanical engineering
A coil component in which a terminal electrode includes a bottom surface electrode portion that is positioned along a bottom surface of a flange part, an end surface electrode portion that is positioned along an outer end surface of the flange part, and a plating film that covers the bottom surface electrode portion and the end surface electrode portion in a continuous manner. The bottom surface electrode portion contains Ag and Si. The end surface electrode portion is composed of a metal film.
Owner:MURATA MFG CO LTD
Tool for a knock-on sweep structure
InactiveUS20050044681A1Easy to useReduce manufacturing costSoil-working equipmentsMetal working apparatusEngineeringExtreme position
A sweep removal tool includes a pair of claws with angled surfaces conforming to the top edge of the sweep stem to locate the tool and help distribute sweep removal impact forces. A retainer depressor centered below the claws moves the retainer to a release position and slides between the angled surfaces during sweep removal. The depressor shape assures desired tine contact, even when the sweep is at an extreme position in the range of possible mounted positions, while preventing damaging contact as the depressor moves relative to the retainer during sweep removal. A curved surface extends between the claws and the depressor and facilitates free pivoting of the tine about the claw contact points to depress the retainer. The tool bottoms against the sweep when the depressor is moved to the release position to prevent retained damage from removal impact forces.
Owner:DEERE & CO
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