36results about How to "Unwanted contact" patented technology

A composite non-woven needlefelt ink absorber that is particularly suited for use with an ink jet printer to absorb and disperse waste ink utilizes at least two distinct layers. The layer initially contacted by the ink is low density / course denier. The final ink receiving and retaining layer is high density / fine denier. Any intermediate layers are also intermediate in density and denier.

A brake assembly comprising: at least one brake spring that includes: a first arm; a second arm, the first arm and the second arm forming a first arm plane; and a body portion between and connecting to the first arm and the second arm, the body portion forming a body plane, the body plane being at an angle relative to the first arm plane; wherein the at least one brake spring is between and in communication with a pressure plate of at least two brake pads.

A sweep removal tool includes a pair of claws with angled surfaces conforming to the top edge of the sweep stem to locate the tool and help distribute sweep removal impact forces. A retainer depressor centered below the claws moves the retainer to a release position and slides between the angled surfaces during sweep removal. The depressor shape assures desired tine contact, even when the sweep is at an extreme position in the range of possible mounted positions, while preventing damaging contact as the depressor moves relative to the retainer during sweep removal. A curved surface extends between the claws and the depressor and facilitates free pivoting of the tine about the claw contact points to depress the retainer. The tool bottoms against the sweep when the depressor is moved to the release position to prevent retained damage from removal impact forces.

Flat-surfaced workpieces such as semiconductor wafers are attached to a rotatable floating workpiece holder carrier rotor that is supported by and rotationally driven by a bellows. The wafer carrier rotor is contained by a set of idlers that are attached to a stationary rotor housing to provide support against abrading forces that are imposed on the wafer by the moving abrasive coating on a rotary platen. The idlers allow low-friction operation of the abrading system to be provided at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The system is also well suited for lapping optical devices and rotary seals and for chemical mechanical planarization (CMP) polishing of wafers using resilient pads. Pressurized air is injected into the bellows device to provide uniform abrading pressure across the full surface of the wafer. Wafers can be attached to the workpiece carrier with vacuum.

A method of making a crustless sandwich from two slices of bread with outer crusts, the method comprising: placing a first slice of bread on a platen; forming a mass of a first food spread onto the central portion of the first slice of bread in a position spaced inwardly from a marginal area where the mass is formed with an inner lower layer with an outer rim extending upwardly from the lower layer to define a closed pocket or receptacle recess in the mass; placing a second food spread in the receptacle recess; closing the receptacle recess with a layer of the first food spread generally coextensive with the mass and supported on the outer rim of the mass to encapsulate the second food spread into a center composite food layer; placing a second slice of bread over the first slice to cover the center composite food layer; cutting the bread slices in unison in a cut pattern to remove the crusts of the slices; and, pressing the two bread slices together by force through the slices against a pressure surface on the platen to crimp the slices into a crustless sandwich.

Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a circular flexible-arm device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial and lateral motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.

The invention is a disposable cover handle cover for a surgical light head, and more particularly to a single-piece, integrally-formed disposable handle cover for a surgical light head and the like. The disposable cover includes a single-piece hollow member having a first open end adapted to receive the positioning handle of the surgical light head housing a camera and a second open end generally opposite the first end. The second end is closed off by a lens disposed within and integral with the hollow body.

A leadframe includes a die paddle and leads, in which the back side of the die paddle has a fillister. The fillister defines a rim surrounding a recess, and the recess accommodates protrusion of fusible material. Also, a package includes such a leadframe. Also, a method for making a leadframe includes patterning a sheet of metal to form a die paddle and leads, and forming a fillister in the back side of the die paddle.

Three rotary wafer abrasive lapping spindles having attached wafers are mounted on the flat surface of a granite lapping machine base. A flexible raised island abrasive disk is attached to the annular abrading surface of an abrading platen that is rotated at high speeds to flat lap, or polish, the exposed surfaces of the rotating wafers. Resilient wafer pads are used to minimize the effects of the abraded surfaces of the wafers not being precisely parallel to the platen abrading surface due to misalignment of the spindle tops. The resilient pads also compensate for two opposed flat surfaces of wafers not precisely parallel with each other. A mixture of the same types of chemicals that are used in the conventional CMP polishing of wafers with applied coolant water can be used with this abrasive lapping or polishing system to enhance abrading and to continually wash abrading debris from the wafers.

Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating workpiece holder carrier that is supported by a pressurized-air flexible elastomer sealed air-chamber device and is rotationally driven by a lug-pin device. The rotating wafer carrier rotor is restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. The range of abrading pressures is large and the device can provide a wide range of torque to rotate the workholder. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.

Flat-surfaced workpieces such as semiconductor wafers or sapphire disks are attached to a rotatable floating or rigid workpiece holder carrier that is supported by a pressurized-air flexible elastomer disk sealed air-chamber device and is rotationally driven by a flexible arm or a lug-pin device. The rotating wafer carrier rotor is horizontally restrained by a set of idlers that are attached to a stationary housing to provide rigid support against abrading forces. The abrading system can be operated at the very high abrading speeds used in high speed flat lapping with raised-island abrasive disks. A wide range of abrading pressures are applied uniformly across the surface of the workpiece. Vacuum can also be applied to the elastomer chamber to quickly move the wafer away from the abrading surface. Internal constraints limit the axial, lateral and circumferential motion of the workholder. Wafers can be quickly attached to the workpiece carrier with vacuum.

A braided protective sleeve and method of construction thereof is provided. The sleeve has a wall extending along a longitudinal axis of the sleeve. The wall includes a plurality of braided yarns forming inner and outer surfaces of the sleeve. The inner surface bounds an internal cavity and the outer surface is exposed to the surrounding environment. The yarns are braided with one another in a X / Y braid pattern with X and Y being different numerical values from one another. The numerical values of X and Y can be selected as desired to provide the sleeve with the enhanced physical performance characteristics desired. A plurality of yarns extending substantially parallel to the longitudinal axis can be interlaced with the braided yarns. The interlaced yarns can be exposed to the internal cavity and concealed from the environment; exposed to the environment and concealed from the internal cavity, or both.