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43results about How to "Minimize build-up" patented technology

Electrochemical reduction of metal oxides

A process for electrochemically reducing a metal oxide, such as titania, in a solid state in an electrochemical cell that includes a bath of molten electrolyte, a cathode, and an anode, which process includes the steps of: a) applying a cell potential across the anode and the cathode that is capable of electrochemically reducing the metal oxide supplied to the molten electrolyte bath, b) continuously or semi-continuously feeding the metal oxide in powder and / or pellet form into the molten electrolyte bath, c) transporting the powders and / or pellets along a path within the molten electrolyte bath and reducing the metal oxide as the metal oxide powders and / or pellets move along the path, and d) continuously or semi-continuously removing metal from the molten electrolyte bath. Also disclosed and claims is an electrochemical cell for carrying out this process.
Owner:METALYSIS

Optical inspection equipment for semiconductor wafers with precleaning

A method for improving the measurement of semiconductor wafers is disclosed. In the past, the repeatability of measurements was adversely affected due to the unpredictable growth of a layer of contamination over the intentionally deposited dielectric layers. Repeatability can be enhanced by removing this contamination layer prior to measurement. This contamination layer can be effectively removed in a non-destructive fashion by subjecting the wafer to a cleaning step. In one embodiment, the cleaning is performed by exposing the wafer to microwave radiation. Alternatively, the wafer can be cleaned with a radiant heat source. These two cleaning modalities can be used alone or in combination with each other or in combination with other cleaning modalities. The cleaning step may be carried out in air, an inert atmosphere or a vacuum. Once the cleaning has been performed, the wafer can be measured using any number of known optical measurement systems.
Owner:THERMA WAVE INC

Method of printing a substrate with an inkjet printer, and an inkjet printer suitable for performing this method

The invention relates to a method of printing a substrate using an inkjet printer which includes a holder to rotatably receive a roll on which the substrate is wound, a downstream print zone and an inkjet printhead for printing the substrate at the print zone, a transport means for engaging and transporting the substrate to the print zone during which transport the substrate is unwound from the roll, and a guide element which is situated downstream of the roll in front of the transport means to guide the substrate from the roll to the transport means, the method including the steps of transporting the substrate over a predetermined distance with control of the transport means, during which transport the guide element is moved from a first position which the guide element occupies prior to the transport, to a second position such that the distance over which the substrate extends between the roll and the transport means is smaller as a result of the movement and after the substrate has been transported over the predetermined distance, printing a strip of the substrate with control of the inkjet printhead, and after printing of the strip, the re-transport of the substrate over a predetermined distance during which the guide element is moved, which transport is followed by printing a following strip of the substrate, wherein the guide element is brought into the first position prior to the re-transport of the substrate.
Owner:OCE TECH
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