81results about How to "Solve the shift" patented technology

An electronic device detects a discontinuous figure in an old-new connection portion between old and new data and performs shape correction so as to restore the continuous figure. In this case, only the old data is corrected. Particular shape correction methods are as follows: (a) only the old-data side shape point P1 in the old-new connection portion is moved to match the new-data side shape point SP1; (b) other shape points P2 to P5 are moved in parallel by the same amount as that of movement of the shape point P1 in the old-new connection portion; and (c) among the old-data side shape points P1 to P5, the farthest shape point P5 from the shape point P1 in the old-new connection portion is not moved as a reference, and the other shape points P1 to P4 are moved in accordance with distance from the farthest shape point P5.

The invention relates to a wafer level fan-out chip packaging method, comprising the following technological processes: a stripping foil and a film dielectric layer I are sequentially covered on the surface of the wafer of a carrier, a photoetching pattern opening I is formed on the film dielectric layer I; a metal electrode and a re-wiring metal routing wire which are connected with a base plateend are arranged on the photoetching pattern opening and the surface thereof, a film dielectric layer II is covered on the surface of the metal electrode, the surface of the re-wiring metal routing wire, and the surface of the film dielectric layer I which are connected with the base plate end, and a photoetching pattern opening II is formed on the film dielectric layer II; a metal electrode connected with a chip end is arranged on the photoetching pattern opening II, after a chip is arranged on the metal electrode connected with the chip end in an inverting way, the injection molding of packaging material and solidification are carried out, so as to form a packaging body with plastic-packaging material; the wafer of the carrier and the stripping foil are separated from the packaging bodywith plastic-packaging material, so as to form a plastic-packaging wafer; a welding sphere back returns to form a welding ball salient point; cutting is carried out by uniwafers for forming the finalstructure of the fan-out chip. The method has low cost and a carrying function, and can well solve the problem that the chip is shifted in the technological process.

The invention relates to a wafer level fan-out chip packaging structure, comprising a film dielectric layer I (101), a photoetching pattern opening I (1011) is formed on the film dielectric layer I (101), a metal electrode (102) and a re-wiring metal routing wire (103) which are connected with a base plate end are arranged on the photoetching pattern opening and the surface of the film dielectriclayer I (101), a photoetching pattern opening I (1011) is formed on the film dielectric layer I, a film dielectric layer II (104) is covered on the surface of the metal electrode, the surface of the re-wiring metal routing wire, and the surface of the film dielectric layer I which are connected with the base plate end, and a photoetching pattern opening II (1041) is formed on the film dielectric layer II; a metal electrode (105) connected with a chip end is arranged on the photoetching pattern opening II, a chip (106), a metal column / metal salient point (107) and a welding flux are arranged on the metal electrode connected with the base plate end in an inverting way, so as to form a wafer with an inverted chip, packaging material (109) is injected on the surface of the wafer, and a welding ball salient point (110) is arranged on the metal electrode (102) connected with the base plate end. The packaging is low, has a carrying function and can well solve the problem that the chip is shifted in the technological process.