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45results about How to "Simple and low-cost process" patented technology

Method for fabricating trench isolations with high aspect ratio

A method of fabricating a trench isolation with high aspect ratio. The method comprises the steps of: providing a substrate with a trench; depositing a first isolation layer filling the trench by low pressure chemical vapor deposition; etching the first isolation layer so that its surface is lowered to the opening of the trench; depositing a second isolation layer to fill the trench without voids by high density plasma chemical vapor deposition and achieving global planarization by chemical-mechanical polishing then providing a rapidly annealing procedure. Accordingly, the present invention achieves void-free trench isolation with high aspect ratio.
Owner:NAN YA TECH

Communication device and antenna structure therein

A communication device including an antenna structure is provided, wherein the antenna structure includes a ground element, an antenna element, and a circuit element group. The ground element has a notch at one of its edges, and a long edge of the notch is at least two times longer than a short edge of the notch. The antenna element includes a metal portion disposed in the notch. Two ends of the metal portion are extended away from each other and are positioned substantially at or around two opposite edges of the notch. One end of the metal portion is coupled to the ground element, and the other end of the metal portion is a feeding terminal of the antenna element. The circuit element group includes at least a capacitive element and an inductive element.
Owner:ACER INC
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