The invention relates to a black hot-melt
adhesive tape, a preparation process therefor and an application of the black hot-melt
adhesive tape. The black hot-melt
adhesive tape comprises a release layer and an adhesive film layer, wherein the upper surface of the release layer is coated with the adhesive film layer, and an adhesive film comprises the following ingredients in parts by weight: 67-74parts of
polyamide resin, 6-9 parts of
polyurethane resin, 4-6 parts of tackifying resin, 0.3-0.7 part of heat-conducting fillers, 5-9 parts of thixotropic agent, 0.4-0.6 part of
antioxidant and 7-13parts of
carbon black. The preparation process for the black hot-melt adhesive tape comprises the following steps: S1. subjecting the
polyamide resin, the
polyurethane resin and the
carbon black to extruded blending; S2. then, subjecting the
carbon black added
polyamide obtained in the S1 and
polyurethane blended modified colloidal particles to extruded blending with the tackifying resin, the heat-conducting fillers, the thixotropic agent and the
antioxidant; and S3. subjecting the blended colloidal particles to heated melt
coating,
coating the release paper with a melt adhesive film, carrying out cooling on a
water cooling roller, and carrying out
drying, thereby obtaining the black hot-melt adhesive tape. According to the black hot-melt adhesive tape, the preparation process therefor and the application of the black hot-melt adhesive tape, the adhesive tape can be used for effectively lowering
laser penetration energy and protecting chips.