Black hot-melt adhesive tape, preparation process therefor and application of black hot-melt adhesive tape

A hot-melt tape and preparation process technology, applied in adhesives, heat-activated films/sheets, record carriers used in machines, etc., can solve problems such as chip damage, reduce operating costs, improve laser blocking performance, and achieve significant economic benefits. and social benefits

Active Publication Date: 2019-12-03
天津伟景诺兰达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, various telecom operators require laser coding on the back of the card, which often causes the laser to penetrate the PVC card body layer and damage the chip in the module.

Method used

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  • Black hot-melt adhesive tape, preparation process therefor and application of black hot-melt adhesive tape
  • Black hot-melt adhesive tape, preparation process therefor and application of black hot-melt adhesive tape
  • Black hot-melt adhesive tape, preparation process therefor and application of black hot-melt adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The present embodiment provides a kind of black hot-melt adhesive tape, comprises release layer and adhesive film layer; The upper surface of release layer is coated with adhesive film layer, and the thickness of adhesive film layer is 40 μ m, and adhesive film comprises following components by weight:

[0034]

[0035] Thermally conductive fillers are calcium carbonate and talcum powder.

[0036] The thixotropic agent is fumed silica.

[0037] The antioxidant is Antioxidant 1010.

[0038] The release layer is release paper, and the material of the release paper is double-sided silicone oil glassine paper.

[0039] The preparation technology of black hot-melt adhesive tape, comprises the steps:

[0040] S1. Blend the polyamide resin, polyurethane resin and carbon black in a twin-screw extruder first, the extrusion temperature is 140°C, and the screw speed of the twin-screw extruder is 20r / min, so that the carbon black is in the rubber particle system Evenly disper...

Embodiment 2

[0044] The present embodiment provides a kind of black hot-melt adhesive tape, comprises release layer and adhesive film layer; The upper surface of release layer is coated with adhesive film layer, and the thickness of adhesive film layer is 60 μ m, and adhesive film comprises following components by weight:

[0045]

[0046] The thermally conductive filler is zinc oxide.

[0047] Thixotropic agents are talc and paraffin.

[0048] The antioxidant is Antioxidant 1010.

[0049] The release layer is release paper, and the material of the release paper is double-sided silicone oil glassine paper.

[0050] The preparation technology of black hot-melt adhesive tape, comprises the steps:

[0051] S1. Blend the polyamide resin, polyurethane resin and carbon black in a twin-screw extruder first, the extrusion temperature is 160°C, and the screw speed of the twin-screw extruder is 30r / min, so that the carbon black is in the rubber particle system Evenly dispersed;

[0052] S2, t...

Embodiment 3

[0055] The present embodiment provides a kind of black hot-melt adhesive tape, comprises release layer and adhesive film layer; The upper surface of release layer is coated with adhesive film layer, and the thickness of adhesive film layer is 80 μ m, and adhesive film comprises following components by weight:

[0056]

[0057] The thermally conductive fillers are barium oxide and barium sulfate.

[0058] The thixotropic agent is rosin resin.

[0059] The antioxidant is Antioxidant 1010.

[0060] The release layer is release paper, and the material of the release paper is double-sided silicone oil glassine paper.

[0061] The preparation technology of black hot-melt adhesive tape, comprises the steps:

[0062] S1. Blend the polyamide resin, polyurethane resin and carbon black in a twin-screw extruder first, the extrusion temperature is 180°C, and the screw speed of the twin-screw extruder is 40r / min, so that the carbon black is in the rubber particle system Evenly dispers...

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Abstract

The invention relates to a black hot-melt adhesive tape, a preparation process therefor and an application of the black hot-melt adhesive tape. The black hot-melt adhesive tape comprises a release layer and an adhesive film layer, wherein the upper surface of the release layer is coated with the adhesive film layer, and an adhesive film comprises the following ingredients in parts by weight: 67-74parts of polyamide resin, 6-9 parts of polyurethane resin, 4-6 parts of tackifying resin, 0.3-0.7 part of heat-conducting fillers, 5-9 parts of thixotropic agent, 0.4-0.6 part of antioxidant and 7-13parts of carbon black. The preparation process for the black hot-melt adhesive tape comprises the following steps: S1. subjecting the polyamide resin, the polyurethane resin and the carbon black to extruded blending; S2. then, subjecting the carbon black added polyamide obtained in the S1 and polyurethane blended modified colloidal particles to extruded blending with the tackifying resin, the heat-conducting fillers, the thixotropic agent and the antioxidant; and S3. subjecting the blended colloidal particles to heated melt coating, coating the release paper with a melt adhesive film, carrying out cooling on a water cooling roller, and carrying out drying, thereby obtaining the black hot-melt adhesive tape. According to the black hot-melt adhesive tape, the preparation process therefor and the application of the black hot-melt adhesive tape, the adhesive tape can be used for effectively lowering laser penetration energy and protecting chips.

Description

technical field [0001] The invention relates to the technical field of adhesive materials, in particular to a black hot-melt adhesive tape and its preparation process and application. Background technique [0002] At present, in the production process of dual-interface bank cards, mobile phone SIM cards, and ordinary contact IC cards in China, transparent hot-melt adhesive films are used to complete the bonding of IC modules and card bodies. As the size requirements of mobile phones for SIM cards are getting smaller and smaller, from the original 2FF to 3FF to 4FF standards, and the overall thickness requirements for SIM cards are also getting thinner and thinner, the thickness of the card body is reduced from 0.8mm to 0.72mm thick. At present, various telecom operators require laser coding on the back of the card, which often causes the laser to penetrate the PVC card body layer and damage the chip in the module. For this reason, it is of great significance to propose a b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J7/35C09J177/00C09J175/04C09J11/04C09J11/08G06K19/077
CPCC08K2003/2206C08K2003/2296C08K2003/265C08K2003/3045C09J11/04C09J11/08C09J175/04C09J177/00C09J7/10C09J7/35C09J2301/304G06K19/07722C08L75/04C08L57/02C08K3/04C08K3/26C08K3/34C08K3/22C08K3/30
Inventor 韩贵麟
Owner 天津伟景诺兰达科技有限公司
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