The invention discloses a shell material for electronic products and a manufacturing method thereof. The material is composed of 0.5% to 4% by weight of Mg, 5% to 9% of Zn, 0.1% to 2% of Cu, the balance is Al and unavoidable impurities, wherein the content of impurity elements is less than 0.1% . The production method is as follows: preheat the furnace temperature, put pure Al in the smelting furnace and raise the temperature to 790-830°C, after the pure aluminum is melted, the temperature rises to 1100-1200°C, add pure Zn and pure Cu, and put Lower the temperature to 650-700°C, add pure Mg, heat up to 730-750°C after melting, add hexachloroethane to refine and remove slag, let stand for 15-30min before pouring. After the ingot is homogenized, it is extruded to form a profile with equiaxed crystal grains, isotropic grain orientation and 101 texture in the [010] direction. Cold-rolling the profile to make the aluminum alloy generate internal stress and act as the driving force for subsequent recrystallization, and then perform solution and aging treatment to restore the coarse-grained layer to recrystallize into a fine grain while maintaining the state of equiaxed crystal grains. of grains.