The invention discloses an improvement process for a punch die. A punch tool is movably mounted in a mounting groove in the bottom of a substrate through a layer of the substrate with the mounting groove, the position of the punch tool is limited through fastening bolts, the surfaces, located between a top plate and a die holder, of guide columns and surfaces, located between the die holder and apressing plate, of the guide columns are sleeved with damping springs correspondingly, the guiding function on the punch die is achieved only through the four guide columns, and the damping effect isimproved; and condensation coils are embedded in the pressing plate, the punch tool is cooled by cold water circulation through the condensation coils, meanwhile, damping rubber pads are pasted to thebottom of the pressing plate, and sponge pads attached to the punch tool are pasted to the inner sides of the damping rubber pads. The punch die is simple and reasonable in structural design, convenient to dismount and mount and good in damping effect, achieves the radiating effect effectively, is capable of cleaning chips conveniently, safe, stable, diversified in function, good in punching effect, wide in application range and capable of being applied and popularized easily.