35results about How to "High density wiring" patented technology

First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board includes a through hole for insertion of the Cu post therethrough, a connection terminal formed on a wiring layer on one surface of a substrate, and a second stopper layer that engages the first stopper layer and functions to suppress in-plane misalignment. The third wiring board includes a connection terminal formed on a wiring layer on one surface of a substrate. Then, the wiring boards are stacked up, as aligned with one another so that the wiring layers are interconnected via the Cu post and the connection terminals, to thereby electrically connect the wiring boards. Thereafter, resin is filled into gaps between the wiring boards.

The wiring substrate comprises: a recess section and a projecting section formed on at least one surface of the wiring substrate; and wires formed on both the recess section and the projecting section.

First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board includes a through hole for insertion of the Cu post therethrough, a connection terminal formed on a wiring layer on one surface of a substrate, and a second stopper layer that engages the first stopper layer and functions to suppress in-plane misalignment. The third wiring board includes a connection terminal formed on a wiring layer on one surface of a substrate. Then, the wiring boards are stacked up, as aligned with one another so that the wiring layers are interconnected via the Cu post and the connection terminals, to thereby electrically connect the wiring boards. Thereafter, resin is filled into gaps between the wiring boards.

The invention discloses a halogen-free high heat-conducting resin composition and a resin coated copper foil. The halogen-free high heat-conducting resin composition comprises the following components in part by mass: 10 to 40 parts of phosphoric epoxy resin, 0 to 10 parts of UV blocking multifunctional epoxy resin, 5 to 35 parts of phenoxy resin, 50 to 80 parts of high heat-conducting filler, 1 to 10 parts of amine curing agent and 0.2 to 2 parts of accelerator. The halogen-free high heat-conducting resin composition provided by the invention does not contain halogen, is environment-friendly, and has high heat resistance and peeling strength and good reliability. Moreover, the invention provides a resin coated copper foil manufactured by using the composition, which replaces a common prepreg and a common copper foil, is used for manufacturing printed circuit board materials of metal base plates, flexible plates and multilayer laminated plates, realizes higher heat conductivity, fills the domestic bank in the aspect of high heat conductance of the resin coated copper foil, provides possibility for the light, thin, short, small and multifunctional development of electronic products, and can realize a high-performance material with high-density wire arrangement, thin shape, superfine aperture and high heat dissipation property.

According to one embodiment, a printed wiring board structure comprises a printed wiring board having first and second component mounting surfaces at front and back sides thereof, respectively, each for mounting a semiconductor package loading a semiconductor chip loaded on a substrate as a mounting component, a first semiconductor package mounted on the first component mounting surface, and a second semiconductor package mounted on the second component mounting surface, wherein the first and second semiconductor packages have a positional relationship such that the substrates are partially overlapped via the printed wiring board, and the semiconductor chips are not overlapped.

The wiring substrate having a recess section and a projecting section formed on at least one surface of the wiring substrate, and wires formed on both the recess section and the projecting section.

A hinge board having a hinge bending part and a rigid part includes: not less than two flexible wiring boards including a polyimide sheet layer, a conductor layer having a circuit formed on both sides or one side of the polyimide sheet layer, and a coverlay film layer covering the conductor layer; and a bonding material for bonding the flexible wiring boards. At least one of the flexible wiring boards is a flexible double-sided wiring board including the conductor layers on both sides of the polyimide sheet layer. Moreover, the flexible wiring boards are bonded to each other in the rigid part by use of the bonding material in such a manner that a space part is formed between the flexible wiring boards in the hinge bending part.

A semiconductor device, includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face of the semiconductor substrate; an external connection terminal electrically connected to the first electrode and provided on or above the active face of the semiconductor substrate; and a connection terminal provided on or above the active face of the semiconductor substrate, wherein any of a gold plated film, a silver plated film, and a palladium plated film is formed on at least one of the external connection terminal and the connection terminal.

A multilayer wiring board includes at least two wiring boards having wiring layers containing wiring patterns formed on both sides. A pair of fin-shaped bumps are formed at desired positions on wiring patterns on the surfaces facing each other, of the wiring boards, so that the bumps assume a slender shape as seen in plan view and that the bumps intersect each other. The pair of fin-shaped bumps are electrically connected to form an inter-board connection terminal. Further, an insulating layer is formed between the wiring boards, and protection films are formed to cover the entire surface except pad areas defined at predetermined positions on outer wiring layers of the wiring boards.

The liquid ejection head comprises: a plurality of pressure chambers connected to a plurality of nozzles from which liquid is ejected, the pressure chambers being arranged in a two-dimensional configuration; a diaphragm which constitutes a wall of each of the pressure chambers, the wall being located opposite to the nozzles; a plurality of piezoelectric elements disposed at positions corresponding to the pressure chambers on a surface of the diaphragm which is on an opposite side of the diaphragm from the pressure chambers, the piezoelectric elements causing portions of the diaphragm corresponding to the pressure chambers to deform; an intermediate plate which is located on a piezoelectric element side of the diaphragm where the piezoelectric elements are disposed and which forms a space around a periphery of each of the piezoelectric elements; electrical wires for electrically connecting drive circuits which drives the piezoelectric elements with drive electrodes of the piezoelectric elements, the electrical wires being disposed in the intermediate plate; and an ink pool section which is located across the intermediate plate from the diaphragm and which supplies the liquid to the pressure chambers.

A bonding structure including bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+σ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for the bonding procedure.

A technical object of the present invention is to devise a glass sheet that facilitates position alignment with a substrate to be processed and is less liable to be broken during conveyance, or processing treatment of the substrate to be processed, to thereby contribute to an increase in density of a semiconductor package. In order to achieve the technical object, the glass sheet of the present invention includes, in a contour thereof: a contour portion; and a position alignment portion, in which all or part of an end edge region of the position alignment portion where a surface thereof and an end surface thereof intersect is chamfered.

A technical object of the present invention is to devise a glass substrate that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and enables correct recognition of production information and the like, and a laminate using the glass substrate. In order to achieve the technical object, the glass substrate of the present invention has a total thickness variation of less than 2.0 μm and includes an information identification part formed of a plurality of dots.

The liquid ejection head for ejecting liquid from nozzles includes: pressure chambers connecting to the nozzles; a common liquid chamber which is connected to the pressure chambers, is arranged across the pressure chambers from the nozzles, and is defined by at least a multi-layer wiring substrate which has a recess-shaped structure including a base section forming one of a ceiling and a floor of the common liquid chamber and a projecting section forming a side wall of the common liquid chamber; electrical wires which are formed at least partially inside the multi-layer wiring substrate; and a connection electrode which is provided in a top of the projecting section of the multi-layer wiring substrate.

A technical object of the present invention is to devise a glass sheet that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and has high end surface strength, and a method of manufacturing the glass sheet, to thereby contribute to an increase in density of a semiconductor package. The glass sheet of the present invention has a total thickness variation of less than 2.0 μm, all or part of an end surface of the glass sheet including a melt-solidified surface.

A method of manufacturing a printed circuit board includes forming a through hole 2 in an insulating layer 1 having upper and lower faces so as to penetrate between the upper and lower surfaces; allowing a first plated conductor 4 to be deposited at least in the through hole 2 and on the upper and lower surfaces around the through hole; removing the first plated conductor overlying and underlying a periphery of the through hole by etching the first plated conductor 4, while leaving at least the first plated conductor 4 in a mid-portion in a vertical direction within the through hole 2; and forming by semi-additive method a second plated conductor 6 that fills an outer portion than the first plated conductor 4 in the through hole 2, and forms a wiring conductor on the upper and lower surfaces.