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Circuit base board and method for mfg. same

A technology of circuit substrate and manufacturing method, which is applied in the direction of printed circuit manufacturing, circuit substrate material, multi-layer circuit manufacturing, etc., can solve the problems of insufficient conductor connection, uneven thickness, uneven density, etc., and achieve high-density wiring discrete sexual effect

Inactive Publication Date: 2002-07-24
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it has been clarified that this is because sufficient compressive force is not applied in the longitudinal direction of the inner passage, and the connection between the conductors cannot be sufficiently performed, so the conductive connection resistance becomes large.
[0012] There is the following problem: the discreteness of the above-mentioned conductive connection resistance appears not only in glass cloth impregnated with epoxy resin, but also in non-woven fabrics, sheets, and films, due to uneven thickness in the plane direction or Density unevenness also appears

Method used

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  • Circuit base board and method for mfg. same
  • Circuit base board and method for mfg. same
  • Circuit base board and method for mfg. same

Examples

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Embodiment 1

[0074] figure 1 is a schematic plan view of the circuit board of the first embodiment. In this embodiment, a case where a glass epoxy substrate is used as an insulator layer including reinforcing material sheets 101 having a density distribution in the planar direction will be described. exist figure 1 In the figure, for the sake of explanation, the weft yarn 102a and the warp yarn 102b of the glass woven cloth inside the base material are shown in the figure. The cross-sectional area of ​​the inner passage 103 provided outside the overlappingly woven portion of the glass fiber (the portion with high density of the reinforcing material sheet) is larger than that of the inner passage provided at the overlappingly woven portion (the portion with high density of the reinforcing material sheet) 104 has a large cross-sectional area. In the above, the ratio of the cross-sectional area of ​​the passage is preferably 1.15 times or more, more preferably 1.4 times, between the overla...

Embodiment 2

[0099] Image 6 It is a cross-sectional schematic diagram of the multilayer circuit board of the second embodiment of the present invention. The multilayer substrate of this embodiment has a structure in which the circuit substrate described in Embodiment 1 is laminated on at least one side of a core substrate made of a compressible insulating base material. In the figure, double-sided substrates 401 made of aramid epoxy material are used as the core substrate, and circuit boards 402 made of glass epoxy material having the structure described in the first embodiment are laminated on both sides of the core substrate. side structure.

[0100] The multilayer circuit board of this example can be manufactured as follows.

[0101] First, a double-sided circuit board was produced using an aramid epoxy prepreg. Regarding the production method of the double-sided circuit board, firstly, cover films are temporarily crimped on both surfaces of an aramid epoxy prepreg to form through h...

Embodiment 3

[0107] Figure 7 It is a cross-sectional schematic diagram of the multilayer substrate of the third embodiment of the present invention. The multilayer substrate of this embodiment has the circuit substrate 501 of the first or second embodiment as a core substrate, and a circuit substrate 502 in which an insulator layer thinner than the insulator layer of the core substrate is laminated on at least one side of the core substrate . Finer internal vias can be formed with low resistance on thin insulator layers. This is because, even with the same hole diameter, if the length of the inner via is reduced, that is, the thickness of the insulator layer is reduced, the connection resistance is reduced.

[0108] The case where the four-layer multilayer substrate of Example 2 is used as the core substrate and the polyimide film is used as the insulator layer thinner than the insulator layer of the core substrate will be described.

[0109] The multilayer substrate of this embodiment...

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PUM

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Abstract

A circuit board includes an electrical insulator layer formed of a reinforcer sheet (101) with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes (104) provided in a high-density portion of the reinforcer sheet (101) are formed to have a smaller cross-section than the inner via holes (103) provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass cloth formed of warps (102b) and wefts (102a) is used for an insulator layer.

Description

technical field [0001] The present invention relates to a circuit substrate and a manufacturing method thereof. In particular, it relates to a circuit board using a reinforcing material sheet having a density difference in a plane direction and a method for manufacturing the same. Background technique [0002] In recent years, along with the miniaturization and weight reduction of electronic devices, high function and high performance, not only in the field of industrial use, but also in the field of extensive consumer devices, there is a strong demand for low-cost supply of large-scale integrated circuits that can be mounted at high density. (LSI) and other semiconductor chip multilayer circuit boards. [0003] In response to such market demands, technological development has been carried out to make a resin multilayer circuit board that can be supplied at a lower cost different from conventional ceramic multilayer boards into a board (high-density wiring board) suitable f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K1/11H05K3/00H05K3/40H05K3/46
CPCH05K3/4652Y10S428/901H05K2201/094H05K2201/0287H05K3/0047H05K2201/0355H05K3/4069H05K2203/1461H05K2201/029H05K3/0032H05K1/115H05K3/4614H05K1/0366Y10T29/4913Y10T29/49126Y10T428/24322Y10T428/24802Y10T428/24917Y10T29/49128Y10T29/49165Y10T29/49155Y10T428/249953Y10T428/24994
Inventor 铃木武西井利浩留河悟越后文雄
Owner PANASONIC CORP
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