31results about How to "Ensure uniformity of light emission" patented technology

The preparation process of the LED signboard comprises the following steps: S1, forming a groove in an acrylic plate, wherein the shape of the groove is an identification pattern or an identificationcharacter; s2, preparing a PCB substrate matched with the groove in shape; s3, mounting an LED chip on the surface of the PCB substrate to obtain an LED light source assembly; s4, enabling the LED light source assembly to be subjected to glue pouring packaging; s5, enabling the LED light source assembly to be embedded into the groove, and then carrying out dispensing packaging; s6, electrically connecting the LED light source assembly with an external power supply device. The PCB substrate is prepared into a whole block, then the LED chips are mounted, the light emitting uniformity can be guaranteed, and after the LED chips at a certain point position break down, due to the fact that the mounting density of the LED chips is large, it can be guaranteed that light emitting of the whole signboard is not affected, meanwhile, the deformation resistance is enhanced, and the signboard manufactured through the technology is ingenious in structure and good in light emitting effect.

The invention relates to a method and device for coating fluorescent powder on a spiral fluorescent lamp tube, which adopts a functional device with rotation and revolution, uses normal temperature air as a hygroscopic agent, uses infrared radiation, oven baking and reciprocating air circulation for drying, The process of strengthening the coating makes the phosphor paste layer in the spiral curved glass tube evenly coated and solidified slowly, which can ensure that the thickness of the phosphor layer is uniform and not too thick, ensures the quality of the spiral fluorescent tube, and can save at least 10% Phosphor powder, increase the luminous efficiency by more than 3%. The device can be equipped with a considerable number of spirally curved glass tube mounting supports in the form of multiple heads and multiple stations at the same time. It rotates slowly, operates in sequence, and operates in cycles, which changes the traditional process of using special hot air at about 90 ° C to dehumidify. It has the positive technical effects of reducing production cost, improving work efficiency, reliable quality, convenient use and obvious energy-saving effect, and has strong practicability.

A backlight module (100) and a display device comprising the backlight module (100) and a display panel (101). The backlight module (100) comprises a back panel (110), a light guide plate (130), and a light source (120). The back panel (110) comprises multiple back panel protrusions (113) and back panel indentations (114) corresponding thereto. The light guide plate (130) comprises multiple indentations (134). The back panel protrusions (113) of the back panel (110) are embedded into the indentations (134) of the light guide plate (130). The light source (120) is arranged on at least one side of the light guide plate (130). The back panel indentations (114) can be utilized to improve heat-dissipation effects.

The invention discloses a preparation method of a light emitting diode epitaxial wafer, belonging to the field of light emitting diode manufacture. When the substrate is placed into the turntable of the organic chemical vapor deposition apparatus, the distance between the midpoint of the chord of the arcuate rounded edge surface and the axis of rotation is greater than the distance between the midpoint of the arc of the arcuate rounded edge surface and the axis of rotation, such an arrangement that the flat edge surface of the substrate faces the side away from the axis of rotation of the turntable. At this time, under the centrifugal force of the tray, the rounded edge surface portion of the substrate moves away from the flat edge surface, the friction between the peripheral portion of the epitaxial layer on the round edge surface and the sidewall of the circular groove is reduced, so that the temperature of the epitaxial layer of the part is not too high, the In in the InGaN well layer in the peripheral part is not excessively lost, the wavelength difference between the central part of the epitaxial layer grown on the round edge surface and the wavelength of the light wave emitted from the peripheral part is not too large, and the light emitting uniformity of the light emitting diode is further ensured.

Provided are an electric field emission display device and a method of manufacturing the same, capable of assembling a shielding electrode in such a manner that uniformity of light emission on a fluorescent surface (display surface) can be maintained without requiring high assembling accuracy. In this field emission display device (1), the opening width (W1) of the opening (11) of the control electrode (9) in a predetermined direction (x direction) is formed to be larger than the electron passing hole (W1) of the shielding electrode (23). 21) The opening width (W2) in the above-mentioned predetermined direction is large, and the entire range of the opening width (W2) in the above-mentioned predetermined direction of the electron passing hole (21) of the shielding electrode (23) overlaps the opening of the control electrode (9) (11) The shielding electrode (23) is arranged on the front side of the control electrode (9) so as to be within the range of the opening width (W1) in the predetermined direction.

Embodiments of the present invention provide a substrate, a preparation method thereof, and a display device, which relate to the field of display technology and can solve the problem of uneven thickness of a light-emitting functional layer formed in an opening area of ​​an existing pixel defining layer. The preparation method of the substrate includes: forming a pixel defining layer thin film on a base substrate; wherein, the material of the pixel defining layer thin film includes photoresist, an affinity material doped in the photoresist, an elastic material and auxiliary particles; The particles are used to release gas when decomposed, and the elastic material is used to expand the pixel defining layer film when the auxiliary particles release the gas; the molecular weight of the affinity material, photoresist and elastic material is greater than the molecular weight of the auxiliary particles; the pixel definition The layer film is heated to make the auxiliary particles move away from the substrate; the pixel defining layer film is processed to form a pixel defining layer, and the auxiliary particles are decomposed to release gas. For the preparation of the pixel definition layer.

The invention belongs to the technical field of automobile lamps, and particularly relates to a dual-function LED drive circuit. The dual-function LED drive circuit comprises a protective circuit module, a power supply module, a PWM signal generating module, a current adjusting module, a fault diagnosis module and an LED lamp. The protective circuit module, the power supply module, the PWM signal generating module and the current adjusting module are electrically connected in sequence. The output end of the protective circuit module and the output end of the current adjusting module are connected with the anode and the cathode of the LED lamp respectively, the input end of the fault diagnosis module is connected with the cathode of the LED lamp, and the output end of the fault diagnosis module is connected with the PWM signal generating module. The LED drive circuit is controlled by PWM, a constant flow source is adopted to control a field effect transistor in the LED drive circuit to enable the current flowing through the LED lamp to be constant, the uniformity and stability of LED brightness are ensured, two kinds of light with different kinds of brightness can be emitted by a series of LED lamps through the drive circuit, the number of the LED light sources on an automobile body is effectively reduced, and the space utilization rate of the automobile body is improved.

The invention provides an LED (Light Emitting Diode) lamp filament and a manufacturing method thereof. An LED chip is encapsulated on the edge top surface of a thin and long sheet metal support of the LED filament innovatively, meanwhile the sheet metal is inserted into a preformed transparent plastic model frame to produce a light source, and accordingly the automated continuous production of the LED lamp filament is implemented and the problem of the facing direction strength caused by the too thin and too long metal support is solved due to the transparent plastic model frame; meanwhile the lateral direction strength of the metal support is effectively utilized and accordingly the integral mechanical strength of the LED lamp filament is ensured; the heat dissipation characteristics of the metal is directly utilized, meanwhile the heat dissipation efficiency of the LED chip is maximized through the innovative encapsulation of thermal conductive coatings, and accordingly the problem of a heat dissipation bottleneck of the LED lamp filament is effectively solved, the LED lamp filament can work at the rated power for a long time, and the cost is reduced; the LED light extraction efficiency is improved, the light attenuation is reduced, the high lighting effect and ambient light of lamp filament light emission is implemented, and the market vacancy of the existing LED lamp filament is filled through innovative fluorescence encapsulation materials.

A backlight module (100) comprising a back panel (110) and a light source (120). The back panel (110) comprises multiple back panel protrusions (113) and back panel indentations (114) corresponding thereto. The light source (120) is arranged on the back panel (110) and among the back panel protrusions (113). Also disclosed is a display device. The display device comprises the backlight module (100) and a display panel (101). The backlight module (100) and the display device are capable of utilizing the back panel indentations (114) to improve heat-dissipation effects.

The invention discloses a multifunctional reusable slender through lamp and a mounting structure thereof. The slender through lamp comprises a movable rear lamp and fixed rear lamps symmetrically arranged on the left side and the right side of the movable rear lamp. The light-emitting module of the fixed rear lamp is composed of a first light-emitting module and a second light-emitting module, the first light-emitting module is composed of a plurality of brake lamp light sources and a plurality of position lamp light sources, and the second light-emitting module is composed of a plurality of steering lamp light sources and a plurality of position lamp light sources. The movable rear lamp comprises a fourth light-emitting module and third light-emitting modules arranged on the two sides of the fourth light-emitting module, each third light-emitting module is composed of a plurality of functional light sources and a plurality of position light sources, and the fourth light-emitting module is composed of a plurality of position light sources. A first thick-wall condenser is arranged above the first light-emitting module, the second light-emitting module and the third light-emitting module; and a second thick-wall condenser is arranged above the fourth light-emitting module. The slender through lamp can realize the function multiplexing of a position lamp, a steering lamp and a brake lamp, and can form a slender characteristic at the rear part of an automobile.

The invention provides a flip LED chip and a manufacturing method thereof. The flip LED chip comprises a substrate structure, an epitaxial layer, a contact layer, a first connecting electrode, a second connecting electrode, an insulating reflective layer, a first bonding pad, and a second bonding pad. The substrate structure of the flip LED chip comprises a support substrate, a lattice matching layer and a connecting dielectric layer which are sequentially formed, wherein the connecting dielectric layer is provided with periodically arranged columnar structures, the connecting dielectric layer provided with periodically arranged columnar structures exposes part of the lattice matching layer, and the crystal structure of the lattice matching layer is the same with the crystal structure of an N-type semiconductor layer. The internal quantum efficiency and the external quantum efficiency of the flip LED chip are improved.

The invention provides a light-focusing module and a backlight module using the light-focusing module. The light-focusing module comprises a light emitting face and a plurality of light-focusing microstructures; the light emitting face has a geometric center; the light of each light-focusing microstructure has the maximum emitting brightness in certain direction; when the inclined angle between the light emitting direction and the certain direction is a brilliance semi-range angle, the brightness decreases to half the maximum emitting brightness; the light-focusing microstructures change gradually from the geometric center of the light emitting face towards the direction far away from the geometric center, the farer from the geometric center of the light emitting face, the larger the brilliance semi-range angle of the light-focusing microstructures. A liquid crystal display using the light-focusing module and the backlight module seems to have more uniform brightness.