69results about How to "Control impedance" patented technology

A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens / Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

A wireless power transmitter for transmitting power to a wireless power receiver in a wireless scheme includes a transmitting coil configured to transmit power, which is supplied by a power source, to a receiving coil of the wireless power receiver using resonance; and a detecting unit configured to detect a coupling state between the transmitting coil and the receiving coil using an input impedance of the wireless power transmitter.

Slot transmission lines are formed in dielectric substrates. Several of such substrates can be stacked together. When stacked together, the conductive surfaces that form the transmission lines can be terminated in the same plane whereat the conductive surfaces form contact terminals. The co-planar contact terminals can be coupled to contact points on a circuit board. Signals on the circuit board can thereby be coupled into the slot transmission lines that extend through the dielectric substrates.

Disclosed herein is a semiconductor device having a self-refresh mode in which a refresh operation of the storage data is performed. The semiconductor device activates an input buffer circuit that receives an impedance control command to control an impedance of the data terminal even in the self-refresh mode so that the semiconductor device can change an impedance of the data terminal during the self-refresh mode.

In a balanced / unbalanced type coupled FBAR filter 100, an area size of a first lower electrode 102 is generally equal to a total area size of second and third lower electrodes 104 and 106 and an area for isolating the second and third lower electrodes 104 and 106. An area size of a first upper electrode 103 is generally equal to a total area size of second and third upper electrodes 105 and 107 and an area for isolating the second and third upper electrodes 105 and 107. The third lower electrode 106 and the second upper electrode 105 are located to face each other, and the third upper electrode 107 and the second lower electrode 104 are located to face each other. Apart of the second lower electrode 104 and a part of the second upper electrode 105 are located to face each other.

An on die termination (ODT) control device includes a latency block for buffering an ODT control signal to output a latency control signal by selecting one of a plurality of intermediate control signals, which are generated by sequentially delaying the buffered ODT control signal in synchronization with an internal clock, based on first latency information; an enable signal generation block for comparing a first control signal with a second control signal in response to the latency control signal to thereby produce an ODT enable signal based on the compared result; and an ODT block for controlling a termination impedance based on the ODT enable signal.

An on die termination (ODT) control device includes a latency block for buffering an ODT control signal to output a latency control signal by selecting one of a plurality of intermediate control signals, which are generated by sequentially delaying the buffered ODT control signal in synchronization with an internal clock, based on first latency information; an enable signal generation block for comparing a first control signal with a second control signal in response to the latency control signal to thereby produce an ODT enable signal based on the compared result; and an ODT block for controlling a termination impedance based on the ODT enable signal.

An improved electronics assembly for integration with a tire structure includes an acoustic wave device such as a SAW sensor connected as a feedback element in an active amplifier and further coupled to an antenna element, thus forming an active transmitter configuration. Such a circuit configuration provides for the ability to actively transmit a combination of information from integrated tire electronics to a remote receiver location. The combination of information corresponds to the physical parameters sensed by the acoustic wave device as well as digital data superimposed on the RF signal emitted by the acoustic wave device by selectively switching the amplifier on and off. Optional integrated power sources configure the electronics assembly for operation as an actively transmitting device.

An output buffer includes first and second circuit portions coupled between input and output terminals. Each circuit portion includes a capacitive element; an output transistor having a gate coupled to the capacitive element, and a drain that drives a voltage at the output terminal; and a current generator configured to generate a charging current that is directed to the capacitive element responsive to a logic transition at the input terminal, wherein the charging current causes a substantially linear ramp voltage to form at the gate of the output transistor, whereby the ramp voltage controls a slew rate of the output terminal voltage.

The invention relates to carrier communication test equipment, which is characterized by comprising test bench body and a computer body, wherein the test bench body is connected with the computer body by Ethernet; and the computer body is operated to control the test bench body, change channel parameters and acquire test information. The equipment tests the performance of communication between an acquisition terminal and a carrier electric meter; and a design scheme of constructing low voltage power line carrier communication channels in the test equipment is put forward, so that a system counts communication results and measures the channel parameters in a continuous communication state to obtain index parameters of a current carrier communication channel, low voltage power line carrier communication equipment meets the requirements of related standards, and technical support is provided for the acceleration of construction of a power consumer power consumption information acquisition system and a robust smart power grid.

A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens / Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

A printed wiring board includes a board made of insulator; a wiring pattern to transfer an electric signal which is made of patterned metallic conductor and formed on at least one of a main surface and a rear surface of the board; and an electric power layer formed on at least one of the main surface and the rear surface of the board; wherein the electric power layer includes a mechanism for controlling a characteristic impedance of the printed wiring board.

The invention discloses a humidity sensor of combination of polyelectrolyte and intrinsic conducting polymer and the fabricating method. It adopts glass ceramic as substrate and multiple pairs of interdigital golden electrodes are set on it. Humidity film of combination of poly 4-vinypyridine with cross-linking quaternary amination and polypyrole is coated on surface of glass ceramic and interdigital golden electrode. The invention is provided with simple preparing process and low cost. It is suitable for mass production especially. Prepared humidity sensors are all provided with moderate resistance, high sensitivity, good linearity, quick response, good recurrence, strong stability and measuring in room temperature so on in wide humidity range, especially in circumstance with middle-low humidity (0-60%). It can be applied in production process of industry and agriculture, storage and accurate measurement and control for circumstance humidity when air circumstance is monitored.

An antenna assembly includes a cable assembly having at least one wire and a circuit board assembly having a ground plane and a plurality of mounting locations. The wire(s) is electrically connected to corresponding mounting locations. A plurality of antenna elements are mounted to the circuit board at corresponding mounting locations. Each antenna element has a feed finger and a ground finger, where the ground finger is electrically connected to the ground plane and the feed finger is electrically connected to the corresponding wire. Each antenna element has a first portion extending from the circuit board along a first plane and a second portion extending from the first portion along a second plane that is transverse to the first plane. Each antenna element provides hemispherical coverage and wide frequency bandwidth.

A system, apparatus and method for controlled impedance at transitional via sites using barrel inductance minimization are provided. In one embodiment, one or more sidewalls of a via barrel are preferably processed such that conductive material disposed thereon is selectively removed thereby forming an inner-via trace connecting one or more conductive traces and / or pads on a first substrate layer to one or more conductive traces and / or pads on a second substrate layer. Removal of conductive material from a sidewall of the via barrel is done in a manner such that an inner-via trace traveling from a first surface to a second surface of one or more substrate layers possesses at least one electrical characteristic substantially approximating a corresponding electrical characteristic of those structures to which the inner-via trace is connected.

An output buffer includes first and second circuit portions coupled between input and output terminals. Each circuit portion includes a capacitive element; an output transistor having a gate coupled to the capacitive element, and a drain that drives a voltage at the output terminal; and a current generator configured to generate a charging current that is directed to the capacitive element responsive to a logic transition at the input terminal, wherein the charging current causes a substantially linear ramp voltage to form at the gate of the output transistor, whereby the ramp voltage controls a slew rate of the output terminal voltage.

A reduced-cross-sectional area, triad transmission line is formed by plating or metallizing surface area of a substrate, along the edge of a slot cut through the substrate. The cross-sectional area of such conductors that faces each other is reduced, reducing the signal coupling between them when they are carrying high-frequency signals. An intervening ground plane between them is provided by metallization on the slot bottom that is held at ground potential.

A slot transmission line patch connector, capable of bridging one or more slot transmission lines is comprised of an elongated dielectric connector body. The dielectric connector body is formed to have one or more slot transmission lines. Each transmission line formed in the dielectric body has first and second ends, each of which mates with corresponding first and second slot transmission lines. Alternate embodiments contemplate a dielectric body to which is attached one or more slot transmission line substrates, each of which supports one or more slot transmission lines. Each of the slot transmission line substrates provide one or more slot transmission lines that each bridge or “patch” together two, separate slot transmission lines together.

A slot transmission line patch connector, capable of bridging one or more slot transmission lines is comprised of an elongated dielectric connector body. The dielectric connector body is formed to have one or more slot transmission lines. Each transmission line formed in the dielectric body has first and second ends, each of which mates with corresponding first and second slot transmission lines. Alternate embodiments contemplate a dielectric body to which is attached one or more slot transmission line substrates, each of which supports one or more slot transmission lines. Each of the slot transmission line substrates provide one or more slot transmission lines that each bridge or “patch” together two, separate slot transmission lines together.

A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. The conductive surface on the opposing surfaces is gradually receded along a length of the slot. An equivalent amount of metallization is applied on the substrate's surface and electrically continuous with conductive surfaces on the slot's opposing sidewalls. The metallization on the substrate's surface provide solder lands. Dielectric in the slot prevents solder wicking.

A terminal contact arrangement for a connector promotes reduction in deviation of the impedance of the connector when mated to an opposing connector and energized. The connector has an insulative housing with a plurality of terminal-receiving passages disposed in it. Conductive terminals are supported in some, but not all of the passages. The terminal contain distinct terminal sets that include a pair of differential signal terminals and at least two associated ground reference terminals. The two associated ground reference terminals are interconnected together so that electrically, they act as a single ground terminal having a width equal to the sum of the widths of the two connected ground reference terminals. The ground reference terminals of the sets are disposed in a single row of terminals, while the differential signal terminals of the same terminal set are disposed in another row of terminals spaced apart from the row of ground reference terminals. The differential signal terminals are separated from each other within their terminal row by an empty passage so that the two differential signal terminals of each terminal set are spaced farther apart from each other than they are spaced apart from their associated ground reference terminals.

A system, apparatus and method for controlled impedance at transitional via sites using barrel inductance minimization are provided. In one embodiment, one or more sidewalls of a via barrel are preferably processed such that conductive material disposed thereon is selectively removed thereby forming an inner-via trace connecting one or more conductive traces and / or pads on a first substrate layer to one or more conductive traces and / or pads on a second substrate layer. Removal of conductive material from a sidewall of the via barrel is done in a manner such that an inner-via trace traveling from a first surface to a second surface of one or more substrate layers possesses at least one electrical characteristic substantially approximating a corresponding electrical characteristic of those structures to which the inner-via trace is connected.

A portable, free standing air blower capable of generating a user directed exhaust air stream is provided. The device includes an air blower assembly located within an air director housing rotatably coupled to a base about a horizontal axis of rotation. The air blower device includes a pre-determined range of rotation of the air director housing around the axis of rotation and the air director housing is able to rotate about the axis of rotation within the pre-determined range of rotation substantially unimpeded by the base. Preferably, the at least one air outlet can be positioned so as to direct a flow of exhaust air at an angle below an imaginary plane through the air outlet and parallel to the support surface.

An electrical connector comprises a dielectric housing and a plurality of conductive contacts. The dielectric housing defines a receiving slot comprising opposite upper inner wall and lower inner wall, a pair of opposite side inner walls respectively intersecting the upper inner wall and lower inner wall, and a pair of fulcrums respectively defined on the pair of side inner walls. The plurality of conductive contacts is disposed in the dielectric housing with a contacting portion extending into the receiving slot from the upper wall or lower wall and disposed along a common line. Wherein, the fulcrums are disposed at the nearest places to the common line on the side inner walls.

The invention relates to a printed circuit board and a method for controlling the impedance of a through hole structure on the same. In the method, an equivalent dielectric constant between through hole structures or between the through hole structure and a reference structure is changed by a nonmetal hole or a nonmetal groove formed on a dielectric between at least two through hole structures or between the through hole structure and the reference structure, the impedance of the through hole structure is further changed, and negative influence caused by increasing a distance between the through hole structure and the reference structure in the prior art on the wiring of other lines of the circuit board is avoided. Therefore, the purpose that the impedance of the through hole structure in the high-density and high-power printed circuit board can be controlled and is free from the technological level can be achieved.

A display adapter for a digital connector and an analog connector. The display adapter includes a PCB (printed circuit board). A first connector and a second connector are both mounted on the PCB. The first connector and second connectors can be VGA, DVI-I, DVI-D, or HDMI format. The PCB is configured to communicatively couple video signals between the first connector having one format and the second connector having a different format.

A plasma system includes an RF generator and a matchbox including an impedance matching circuit, which is coupled to the RF generator via an RF cable. The plasma system includes a chuck and a plasma reactor coupled to the matchbox via an RF line. The RF line forms a portion of an RF supply path, which extends between the RF generator through the matchbox, and to the chuck. The plasma system further includes a phase adjusting circuit coupled to the RF supply path between the impedance matching circuit and the chuck. The phase adjusting circuit has an end coupled to the RF supply path and another end that is grounded. The plasma system includes a controller coupled to the phase adjusting circuit. The controller is used for changing a parameter of the phase adjusting circuit to control an impedance of the RF supply path based on a tune recipe.

To regulate the electrical output of a generator, a signal is received indicative of at least one characteristic of the electrical output. A first, relatively fast-response sub-controller is configured to provide a first control signal on the basis of the at least one characteristic and a second, relatively slow-response sub-controller is configured to provide a second control signal on the basis of the at least one characteristic. An output provides a combined control signal to adjust the electrical output based on the first and second control signals.