69results about How to "Control impedance" patented technology

In a balanced / unbalanced type coupled FBAR filter 100, an area size of a first lower electrode 102 is generally equal to a total area size of second and third lower electrodes 104 and 106 and an area for isolating the second and third lower electrodes 104 and 106. An area size of a first upper electrode 103 is generally equal to a total area size of second and third upper electrodes 105 and 107 and an area for isolating the second and third upper electrodes 105 and 107. The third lower electrode 106 and the second upper electrode 105 are located to face each other, and the third upper electrode 107 and the second lower electrode 104 are located to face each other. Apart of the second lower electrode 104 and a part of the second upper electrode 105 are located to face each other.

An on die termination (ODT) control device includes a latency block for buffering an ODT control signal to output a latency control signal by selecting one of a plurality of intermediate control signals, which are generated by sequentially delaying the buffered ODT control signal in synchronization with an internal clock, based on first latency information; an enable signal generation block for comparing a first control signal with a second control signal in response to the latency control signal to thereby produce an ODT enable signal based on the compared result; and an ODT block for controlling a termination impedance based on the ODT enable signal.

An improved electronics assembly for integration with a tire structure includes an acoustic wave device such as a SAW sensor connected as a feedback element in an active amplifier and further coupled to an antenna element, thus forming an active transmitter configuration. Such a circuit configuration provides for the ability to actively transmit a combination of information from integrated tire electronics to a remote receiver location. The combination of information corresponds to the physical parameters sensed by the acoustic wave device as well as digital data superimposed on the RF signal emitted by the acoustic wave device by selectively switching the amplifier on and off. Optional integrated power sources configure the electronics assembly for operation as an actively transmitting device.

A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens / Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

A slot transmission line patch connector, capable of bridging one or more slot transmission lines is comprised of an elongated dielectric connector body. The dielectric connector body is formed to have one or more slot transmission lines. Each transmission line formed in the dielectric body has first and second ends, each of which mates with corresponding first and second slot transmission lines. Alternate embodiments contemplate a dielectric body to which is attached one or more slot transmission line substrates, each of which supports one or more slot transmission lines. Each of the slot transmission line substrates provide one or more slot transmission lines that each bridge or “patch” together two, separate slot transmission lines together.

A connector includes an elongated body having a plurality of contacts arranged in spaced relation along a length thereof and a shield member for shielding the body. The shield member includes a first shield portion for shielding first thicknesswise end of the body and a second shield portion for shielding a second thicknesswise end of the body. At least one of the first and second shield portions is partly or entirely embedded in the body.

A system, apparatus and method for controlled impedance at transitional via sites using barrel inductance minimization are provided. In one embodiment, one or more sidewalls of a via barrel are preferably processed such that conductive material disposed thereon is selectively removed thereby forming an inner-via trace connecting one or more conductive traces and / or pads on a first substrate layer to one or more conductive traces and / or pads on a second substrate layer. Removal of conductive material from a sidewall of the via barrel is done in a manner such that an inner-via trace traveling from a first surface to a second surface of one or more substrate layers possesses at least one electrical characteristic substantially approximating a corresponding electrical characteristic of those structures to which the inner-via trace is connected.

An electrical connector comprises a dielectric housing and a plurality of conductive contacts. The dielectric housing defines a receiving slot comprising opposite upper inner wall and lower inner wall, a pair of opposite side inner walls respectively intersecting the upper inner wall and lower inner wall, and a pair of fulcrums respectively defined on the pair of side inner walls. The plurality of conductive contacts is disposed in the dielectric housing with a contacting portion extending into the receiving slot from the upper wall or lower wall and disposed along a common line. Wherein, the fulcrums are disposed at the nearest places to the common line on the side inner walls.