999 results about "Dielectric body" patented technology

Circuit modules and methods of construction thereof that contain composite meta-material dielectric bodies that have high effective values of real permittivity but which minimize reflective losses, through the use of host dielectric (organic or ceramic), materials having relative permittivities substantially less than ceramic dielectric inclusions embedded therein. The composite meta-material bodies permit reductions in physical lengths of electrically conducting elements such as antenna element(s) without adversely impacting radiation efficiency. The meta-material structure may additionally provide frequency band filtering functions that would normally be provided by other components typically found in an RF front-end.

A manufacturing method of a top plate hermetically attached to an upper opening of a tubular shaped container body for forming a processing container of a plasma processing apparatus is provided. The manufacturing method includes the steps of; preparing a top plate body comprised of a dielectric body for transmitting an electromagnetic wave, and having a gas ejection hole for ejecting a gas into the processing container; forming a discharge prevention member having a discharge prevention member body comprised of a dielectric body having a permeability, and a dense member comprised of a dielectric body without a permeability covering at least a side face of the discharge prevention member body; and attaching the discharge prevention member in the gas ejection hole of the top plate body.

Embodiments of the present invention provide a cost effective electrostatic chuck assembly capable of operating over a wide temperature range in an ultra-high vacuum environment while minimizing thermo-mechanical stresses within the electrostatic chuck assembly. In one embodiment, the electrostatic chuck assembly includes a dielectric body having chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectric body.

The present invention relate to a horn antenna at a radar level gauge for determination of a level of a surface of a medium stored in a tank and a method of making a horn antenna which is mechanically constituted such that the horn antenna will withstand the environment of the tank interior. The antenna comprises a first conductive housing (7) having a wave guide port (8), which is connectable to a wave guide, a first aperture (10), which is separated from the wave guide port (8) and a fist divergent section between the wave guide port (8) and the first aperture (10). A dielectric body (11) is arranged inside and essentially filling the first conductive housing (7), which body (11) displays a free end (12) in the area of the first aperture (10). The horn antenna is characterized in that around the first aperture (10) is arranged a locking device (13), which is arranged to fix the dielectric body (11) in the first housing (7) and that in the area of the locking device (13) is arranged at least one flexible sealing element (16) between the dielectric body (11) and the first cover (7).

A first metal plate for transmission and a second metal plate for transmission are closely-attached to a first surface and a second surface of a dielectric body, respectively. An outer edge of the first metal plate substantially symmetrically faces an outer edge of the second metal plate via the dielectric body. A metal plate for matching is arranged inside a hole formed on the second metal plate, with a slit formed with an inner wall of the hole, and is fixed to the dielectric body. The metal plate for matching is electrically connected to the first metal plate via a through hole penetrating the dielectric body. An IC chip is surface-mounted to connect the second metal plate with the metal plate for matching.

Embodiments of the present invention provide a cost effective electrostatic chuck assembly capable of operating over a wide temperature range in an ultra-high vacuum environment while minimizing thermo-mechanical stresses within the electrostatic chuck assembly. In one embodiment, the electrostatic chuck assembly includes a dielectric body having chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectric body.

Implementations described herein provide a pixilated electrostatic chuck which enables both lateral and azimuthal tuning of the RF coupling between an electrostatic chuck and a substrate placed thereon. In one embodiment, the pixilated electrostatic chuck (ESC) may include a dielectric body having a workpiece support surface configured to accept a substrate thereon, one or more chucking electrodes disposed in the pixilated ESC, and a plurality of pixel electrodes. The plurality of pixel electrodes are switchable between a floating state and a grounded state, having variable capacitance to ground, or both. The pixel electrodes and the chucking electrodes form a circuit operable to electrostatically chuck the substrate to the workpiece support surface.

Circuit modules and methods of construction thereof that contain composite meta-material dielectric bodies that have high effective values of real permittivity but which minimize reflective losses, through the use of host dielectric (organic or ceramic), materials having relative permittivities substantially less than ceramic dielectric inclusions embedded therein. The composite meta-material bodies permit reductions in physical lengths of electrically conducting elements such as antenna element(s) without adversely impacting radiation efficiency. The meta-material structure may additionally provide frequency band filtering functions that would normally be provided by other components typically found in an RF front-end.

A multilayer feedthrough capacitor having a first internal conductor arranged in a dielectric body, an intermediate internal conductor arranged in the dielectric body and stacked with the first internal conductor via a ceramic layer, a second internal conductor arranged in the dielectric body and stacked with the intermediate internal conductor via a ceramic layer, a first terminal electrode formed at an outside surface of the dielectric body and connected to the first internal conductor, a second terminal electrode formed at the outside surface of the dielectric body and connected to the second internal conductor, and an intermediate terminal electrode formed at the outside surface of the dielectric body and connected to the intermediate internal conductor. The intermediate terminal electrode is connected to the ground, while the first terminal electrode and the second terminal electrode are connected to paths for transmitting signals. The first internal conductor and the second internal conductor have currents flowing through them in opposite directions.

The present disclosure pertains to a method for plasma etching a semiconductor patterning stack. The patterning stack includes at least one layer comprising either a dielectric-comprising antireflective material or an oxygen-comprising material. In many instances the dielectric-comprising antireflective material will be an oxygen-comprising material, but it need not be limited to such materials. In one preferred embodiment of the method, the chemistry enables the plasma etching of both a layer of the dielectric-comprising antireflective material or oxygen-comprising material and an adjacent or underlying layer of material. In another preferred embodiment of the method, the layer of dielectric-comprising antireflective material or oxygen-comprising material is etched using one chemistry, while the adjacent or underlying layer is etched using another chemistry, but in the same process chamber. Of particular interest is silicon oxynitride, an oxygen-comprising material which functions as an antireflective material. A preferred embodiment of the method provides for the use of a source of carbon and an appropriate halogen-comprising plasma, to achieve selective etch of one oxygen-containing material compared with another material which contains a more limited amount of oxygen.

A feedthrough filter capacitor assembly includes a capacitor having first and second sets of conductive electrode plates embedded within a dielectric body and mounted to the hermetic terminal of an implantable medical device. A laminar delamination gap is provided between the capacitor sealing materials and the hermetic terminal assembly to facilitate helium leak detection. At least one feedthrough terminal pin extends through the capacitor in conductive relation with the first set of electrode plates, and an outer ferrule is mounted about the capacitor in conductive relation with the second set of electrode plates. The mounting washer is spaced against the hermetic seal and is adhesively connected to the feedthrough capacitor. The mounting washer forms a laminar flow delamination through which helium molecules can flow during a helium leak detection test. Provision is made for a pre-connection to the gold braze so that the capacitor inside diameter termination is not electrically isolated from the lead wire.

A multi-band helical antenna of the present invention includes a dielectric body including a plurality of dielectric sheets stacked in a predetermined order and a first and a second metallic pattern sections provided in the dielectric body. The first metallic pattern includes a plurality of first partially opened metallic loop patterns and a plurality of first connection elements connecting the respective adjacent first partially opened metallic loop patterns to form a first spiral structure. The second metallic pattern section includes a plurality of second partially opened metallic loop patterns and a plurality of second connection elements connecting the respective adjacent second partially opened metallic loop patterns to form a second spiral structure. The first and the second metallic pattern sections having different entire lengths. Accordingly, the multi-band helical antenna of the present invention has a dual resonant frequency characteristic and operates in different frequency bands.

A connector assembly includes a contact module, signal contacts, and a ground contact. The contact module includes a dielectric body with mating and mounting edges and corresponding opposite back edges. The signal contacts are held within the contact module. The signal contacts include mating and mounting ends that protrude from the mating and mounting edges of the contact module, respectively. The signal contacts are arranged in a differential pair to convey differential signals. The ground contact is coupled to the contact module and includes mating and mounting ends that protrude from the mating and mounting edges of the contact module, respectively. The ground contact runs alongside the back edges of the contact module from the mounting edge to the mating edge.

An apparatus for filtering electromagnetic waves, the apparatus comprising a substrate having a surface relief structure containing at least one dielectric body with physical dimensions smaller than the wavelength of the filtered electromagnetic waves, such structures repeated in a two dimensional array covering at least a portion of the surface of the first substrate. Also disclosed is a material sensor utilizing this apparatus.

A header assembly includes an outer housing holding a center contact and a dielectric body. The outer housing has a rear shell and an outer contact extending forward from the rear shell. The outer contact has a catch extending therefrom positioned forward of the rear shell. The header assembly includes a nose cone coupled to the outer contact. The nose cone surrounds the outer contact. The nose cone has one or more keying ribs along an exterior thereof. The nose cone has a latch engaging the catch to secure the nose cone to the outer housing in one of at least two distinct rotational orientations.

A discoidal feedthrough capacitor has its active electrode plates disposed within a dielectric body so that an edge of the active electrode plates is exposed at a surface of a through-hole for a conductive lead. The conductive lead is conductively coupled to the exposed edge of the electrode plates without an intervening conductive termination surface. Similarly, a ground electrode plate set of the feedthrough capacitor may have an edge exposed at the outer periphery of the capacitor for conductively coupling the exposed edge of the ground electrode plate to a conductive ferrule without an intervening conductive termination surface.

A method is provided for integrating metal-containing cap layers into copper (Cu) metallization of semiconductor devices. In one embodiment, the method includes providing a planarized patterned substrate containing metal surfaces and dielectric layer surfaces with a residue formed thereon, removing the residue from the planarized patterned substrate, and depositing metal-containing cap layers selectively on the metal surfaces by exposing the dielectric layer surfaces and the metal surfaces to a deposition gas containing metal-containing precursor vapor. The removing includes treating the planarized patterned substrate containing the residue with a reactant gas containing a hydrophobic functional group, and exposing the treated planarized patterned substrate to a reducing gas.

In a dielectric resonator, a superconductor is formed on two neighboring surfaces of a cubic dielectric body, and the superconductors formed on each two neighboring surfaces are connected by a silver electrode formed in the vicinity of the edge where the neighboring two surfaces join.

A method for making coaxial cable connector components for assembly into either first or second different connector configurations may include forming center contacts for the first connector configuration and forming common connector components for either the first or second connector configuration. The common connector components may include common connector housings; common back nuts, each for clamping a coaxial cable outer conductor in cooperation with a respective common connector housing; and common forward dielectric bodies, each having a passageway therethrough. The common forward dielectric body is for supporting a respective center contact for the first connector configuration, and for alternatively supporting a respective forward portion of a coaxial cable inner conductor for the second configuration. The common forward dielectric bodies may provide impedance matching with a coaxial cable for both the first and second connector configurations.

The present invention is a semiconductor device comprising a semiconducting low doped vertical super-thin body (VSTB) formed on Dielectric Body Wall (such as STI-wall as isolating substrate) having the body connection to bulk semiconductor wafer on the bottom side, isolation on the top side, and the channel, gate dielectric, and gate electrode on opposite to STI side surface. The body is made self-aligned to STI hard mask edge allowing tight control of body thickness. Source and Drain are made by etching holes vertically in STI at STI side of the body and filling with high doped crystalline or poly-Si appropriately doped with any appropriate silicides / metal contacts or with Schottky barrier Source / Drain. Gate first or Gate last approaches can be implemented. Many devices can be fabricated in single active area with body isolation between the devices by iso-plugs combined with gate electrode isolation by iso-trenches. The body can be made as an isolated nano-plate or set nano-wire MOSFET's on the STI wall to form VSTB SOI devices.

Disclosed is a detection device for detecting a strength and a direction of an external force applied to a reference point, the detection device including: a first substrate having a plurality of first capacitor electrodes arranged around the reference point; a second substrate arranged to face the first substrate by interposing the first capacitor electrodes; a dielectric body arranged between the first and second substrates and made of an elastic body or fluid; a second capacitor electrode arranged to face the first capacitor electrodes by interposing the dielectric body between the first and second substrates; and a third substrate having an elastic projection which has a gravity center in a location overlapping with the reference point and is elastically deformed by the external force while a tip thereof abuts on the second substrate.

A contact module assembly includes a dielectric body having a mating end with a plurality of mating contacts and a mounting end with a plurality of mounting contacts. A lead frame is at least partially encased by the dielectric body, wherein the lead frame has a plurality of conductors representing both signal conductors and ground conductors extending alone a lead frame plane. The signal and ground conductors extend from respective ones of the mating contacts and the mounting contacts, wherein at least some of the ground conductors include a mating contact terminal proximate the respective mating contact and a mounting contact terminal proximate the respective mounting contact. The ground conductors extend only partially between the mating contact and the mounting contact associated with the respective ground conductor such that a gap exists between the mating contact terminal and the mounting contact terminal of the ground conductor. A commoning member electrically connects the mating contact terminal and the mounting contact terminal of at least one of the ground conductors, wherein the commoning member is oriented in a non-coplanar relation with the lead frame plane.

An electrical connector includes a housing and a plurality of contact modules and ground plates held by the housing. Each contact module includes left and right signal wafers stacked next to each other along a stack axis. The signal wafers include electrical terminals held by a dielectric body. The electrical terminals have mounting contacts protruding from the dielectric body at a mounting face of the housing. The electrical terminals of at least one of the signal wafers in each contact module are jogged toward the other signal wafer such that the mounting contacts of each contact module align in a column. Each of the ground plates is disposed along an outer side of a corresponding contact module.

An apparatus for generating uniform plasma across and beyond the peripheral edge of a substrate has a dielectric body with an upper electrode and an annular electrode embedded therein. The outer perimeter of the upper electrode overlaps the inner perimeter of the annular electrode. In one embodiment, the upper electrode and the annular electrode are electrically coupled by molybdenum vias. In one embodiment, the upper electrode is coupled to a DC power source to provide electrostatic force for chucking the substrate. In one embodiment, the upper electrode is coupled to an RF source for exciting one or more processing gasses into plasma for substrate processing.

An apparatus for filtering electromagnetic waves, the apparatus comprising a substrate having a surface relief structure containing at least one dielectric body with physical dimensions smaller than the wavelength of the filtered electromagnetic waves, such structures repeated in a two dimensional array covering at least a portion of the surface of the first substrate. Also disclosed is a material sensor utilizing this apparatus.

Disclosed is an input / output coupling structure for coupling a printed circuit board with a dielectric waveguide having a dielectric body and a conductive film covering the dielectric body. The coupling structure comprises a first conductive pattern formed on the bottom surface of the dielectric waveguide to serve as an input / output electrode, in such a manner as to be surrounded directly by an exposed portion of the dielectric body and further by the conductive film formed around the outer periphery of the exposed portion, a spacer having a surface made substantially entirely of a conductive material and a portion for defining a given space, and a second conductive pattern formed on a principal surface of the printed circuit board and electrically connected to the microstrip line. The bottom surface of the dielectric waveguide is joined to the principal surface of the printed circuit board through the spacer, to allow the first and second conductive patterns to be located in opposed relation to one another and define the space therebetween in cooperation with the spacer. The present invention can provide a simplified structure for mounting a dielectric waveguide on a printed circuit-wiring board to couple the dielectric waveguide with a microstrip line of the dielectric waveguide, and achieve a mode conversion mechanism operable in a wide frequency band and less subject to the influence of the possible displacement between the microstrip line and the dielectric waveguide.

A monolithic capacitor structure includes opposed and overlapping plates within a dielectric body, which are arranged to form a lower frequency, higher value capacitor. Other conductive structure is located either inside the dielectric body or on an external surface thereof and is effective to form a higher frequency, lower value capacitor in parallel with the lower frequency, higher value capacitor. The resulting array of combined series and parallel capacitors integral with the dielectric body provides effective wideband performance in an integrated, cost-effective structure.

A plasma processing apparatus performs a plasma processing on a substrate to be processed by generating plasma between a first electrode and a second electrode disposed to face each other in a processing chamber by applying a radio frequency power to the first electrode from a radio frequency power supply connected to the first electrode. The plasma processing apparatus includes a dielectric body disposed near the first electrode and a conductor provided in the dielectric body. Further, a radio frequency leakage line is connected to the conductor, and the radio frequency power applied to the first electrode leaks through the radio frequency leakage line to an earth ground. In addition, an impedance adjusting circuit is provided on the radio frequency leakage line and controls an amount of the radio frequency power flowing through the radio frequency leakage line by adjusting an impedance.

A heart beat / respiration measuring device comprising a sheet-like capacitance-type pressure sensor adapted to be pressed against the human body, and a measuring circuit for measuring a heart rate and / or respiration rate from the output of the sensor. The capacitance-type pressure sensor includes a sheet-like dielectric body elastically deformable in all directions and a pair of conductive clothes with stretchability disposed on opposite sides of the dielectric body. The measuring circuit comprises a resonant circuit wherein the capacitance-type pressure sensor serves as an oscillation capacitor, and a calculation processing circuit for detecting variations in the oscillation frequency of the resonant circuit and calculating the heart rate and / or respiration rate based on the frequency component or components of heart beats and / or respiration included in the variations.

An electrosurgical instrument for delivering radiofrequency (RF) electromagnetic (EM) energy and microwave frequency EM energy from a coaxial feed cable through an instrument tip into tissue. The instrument tip comprises a dielectric body separating first and second conductive elements, which act as active and return electrodes to convey the RF EM radiation by conduction, and as an antenna to radiate the microwave EM radiation. The instrument also has a fluid feed incorporated into its tip, e.g. in an additional dielectric element mounted on the underside of the tip, for delivering fluid. The delivered fluid may be a gas plasma to assist treatment or a liquid to plump up a tissue region before treatment. The instrument may fit in an endoscope.