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995 results about "Dielectric body" patented technology

Electrostatic chuck assembly

Embodiments of the present invention provide a cost effective electrostatic chuck assembly capable of operating over a wide temperature range in an ultra-high vacuum environment while minimizing thermo-mechanical stresses within the electrostatic chuck assembly. In one embodiment, the electrostatic chuck assembly includes a dielectric body having chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectric body.
Owner:APPLIED MATERIALS INC

Method for etching silicon oxynitride and inorganic antireflection coatings

The present disclosure pertains to a method for plasma etching a semiconductor patterning stack. The patterning stack includes at least one layer comprising either a dielectric-comprising antireflective material or an oxygen-comprising material. In many instances the dielectric-comprising antireflective material will be an oxygen-comprising material, but it need not be limited to such materials. In one preferred embodiment of the method, the chemistry enables the plasma etching of both a layer of the dielectric-comprising antireflective material or oxygen-comprising material and an adjacent or underlying layer of material. In another preferred embodiment of the method, the layer of dielectric-comprising antireflective material or oxygen-comprising material is etched using one chemistry, while the adjacent or underlying layer is etched using another chemistry, but in the same process chamber. Of particular interest is silicon oxynitride, an oxygen-comprising material which functions as an antireflective material. A preferred embodiment of the method provides for the use of a source of carbon and an appropriate halogen-comprising plasma, to achieve selective etch of one oxygen-containing material compared with another material which contains a more limited amount of oxygen.
Owner:APPLIED MATERIALS INC

Multi-band helical antenna

A multi-band helical antenna of the present invention includes a dielectric body including a plurality of dielectric sheets stacked in a predetermined order and a first and a second metallic pattern sections provided in the dielectric body. The first metallic pattern includes a plurality of first partially opened metallic loop patterns and a plurality of first connection elements connecting the respective adjacent first partially opened metallic loop patterns to form a first spiral structure. The second metallic pattern section includes a plurality of second partially opened metallic loop patterns and a plurality of second connection elements connecting the respective adjacent second partially opened metallic loop patterns to form a second spiral structure. The first and the second metallic pattern sections having different entire lengths. Accordingly, the multi-band helical antenna of the present invention has a dual resonant frequency characteristic and operates in different frequency bands.
Owner:ATENNA TECH

Method for making coaxial cable connector components for multiple configurations and related devices

A method for making coaxial cable connector components for assembly into either first or second different connector configurations may include forming center contacts for the first connector configuration and forming common connector components for either the first or second connector configuration. The common connector components may include common connector housings; common back nuts, each for clamping a coaxial cable outer conductor in cooperation with a respective common connector housing; and common forward dielectric bodies, each having a passageway therethrough. The common forward dielectric body is for supporting a respective center contact for the first connector configuration, and for alternatively supporting a respective forward portion of a coaxial cable inner conductor for the second configuration. The common forward dielectric bodies may provide impedance matching with a coaxial cable for both the first and second connector configurations.
Owner:COMMSCOPE INC

Input/output coupling structure for dielectric waveguide having conductive coupling patterns separated by a spacer

ActiveUS7132905B2Less influenceReduce leakage and less of electromagnetic energyOne-port networksResonatorsCouplingConductive materials
Disclosed is an input / output coupling structure for coupling a printed circuit board with a dielectric waveguide having a dielectric body and a conductive film covering the dielectric body. The coupling structure comprises a first conductive pattern formed on the bottom surface of the dielectric waveguide to serve as an input / output electrode, in such a manner as to be surrounded directly by an exposed portion of the dielectric body and further by the conductive film formed around the outer periphery of the exposed portion, a spacer having a surface made substantially entirely of a conductive material and a portion for defining a given space, and a second conductive pattern formed on a principal surface of the printed circuit board and electrically connected to the microstrip line. The bottom surface of the dielectric waveguide is joined to the principal surface of the printed circuit board through the spacer, to allow the first and second conductive patterns to be located in opposed relation to one another and define the space therebetween in cooperation with the spacer. The present invention can provide a simplified structure for mounting a dielectric waveguide on a printed circuit-wiring board to couple the dielectric waveguide with a microstrip line of the dielectric waveguide, and achieve a mode conversion mechanism operable in a wide frequency band and less subject to the influence of the possible displacement between the microstrip line and the dielectric waveguide.
Owner:MURATA MFG CO LTD
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