Printed circuit board and method for controlling impedance of through hole structure on same

Abstract

The invention relates to a printed circuit board and a method for controlling the impedance of a through hole structure on the same. In the method, an equivalent dielectric constant between through hole structures or between the through hole structure and a reference structure is changed by a nonmetal hole or a nonmetal groove formed on a dielectric between at least two through hole structures or between the through hole structure and the reference structure, the impedance of the through hole structure is further changed, and negative influence caused by increasing a distance between the through hole structure and the reference structure in the prior art on the wiring of other lines of the circuit board is avoided. Therefore, the purpose that the impedance of the through hole structure in the high-density and high-power printed circuit board can be controlled and is free from the technological level can be achieved.

Description

technical field [0001] The invention relates to printed circuit board technology, in particular to a printed circuit board and a method for controlling the impedance of a through-hole structure on the printed circuit board. Background technique [0002] In printed circuit boards, there are many reasons that affect the quality of long-distance transmission signals, but in the final analysis it is caused by loss. The two fundamental factors that cause loss are dielectric loss and impedance mismatch during transmission. [0003] The so-called dielectric loss, that is, because the signal needs to be transmitted in a certain insulating environment such as vacuum, air or the dielectric between two conductive layers on the printed circuit board, but the dielectric is not a theoretical insulator, in practice, especially in Under the action of the alternating signal, part of the energy will flow back to the signal source through the dielectric, so that the signal energy in transmiss...

AI Technical Summary

Problems solved by technology

[0008] The problem with the former method is that not only need to have enough space to design the reference structure of the through hole, but also for the installation hole of the crimping component, because this method often needs to set a relatively small space between the via structure and the reference structure. The large distance makes it impossible to realize the current high-density and high-power printed circuit boards

The problem with the latter method is that if the size of the through-hole structure is reduced, it cannot be realized due to the technical level; and the mounting hole diameter and relative position of the crimping components must not be changed, otherwise the device cannot be installed

Images