40results about How to "Accurate electrical connection" patented technology

A patch antenna for operation within a high temperature environment. The patent antenna typically includes an antenna radiating element, a housing and a microwave transmission medium, such as a high temperature microwave cable. The antenna radiating element typically comprises a metallization (or solid metal) element in contact with a dielectric element. The antenna radiating element can include a dielectric window comprising a flame spray coating or a solid dielectric material placed in front of the radiating element. The antenna element is typically inserted into a housing that mechanically captures the antenna and provides a ground plane for the antenna. Orifices or passages can be added to the housing to improve high temperature performance and may direct cooling air for cooling the antenna. The high temperature microwave cable is typically inserted into the housing and attached to the antenna radiator to support the communication of electromagnetic signals between the radiator element and a receiver or transmitter device.

A drawer-type all-in-one card connector includes a housing defining an insertion chamber and an opening formed at an end of the insertion chamber and a plurality of terminal slots formed at the other end of the insertion chamber; a plurality of card contact terminals mounted at the terminal slots; a sliding box slidably mounted in the insertion chamber of the housing and having a card receiving chamber for receiving corresponding memory cards of different specifications; a cover covered on the housing; a first ejection spring having two ends contacting against an inner sidewall of the housing and the sliding box respectively; and a limiter provided between the housing and the sliding box.

A drawer-type all-in-one card connector includes a housing defining an insertion chamber; a plurality of card contact terminals; a sliding box slidably mounted in the insertion chamber of the housing and having a card receiving chamber for receiving one of memory cards of different specifications and a plurality of terminal slots accommodating the card contact terminals for contact with the memory card inserted into the card receiving chamber; and a cover covered on the housing, a first ejection spring stopped between the housing and the sliding box, a limiter provided between the housing and the sliding box for guiding movement of the sliding box relatively to the housing in course, and adapter means electrically connected between a circuit board and the card contact terminals of the sliding box.

A memory card connector includes a base member, a plurality of contacts held on the base member and a slide cover slidably engaging with the base member. The base member has a rear opening, a pair of longitudinal guiding slots respectively defined at two opposite sides thereof, and a pair of locking tab disposed thereon. The sliding cover has a card cavity for receiving a memory card, an engaging slot defined at a rear portion thereof corresponding to the rear opening, and a pair of slide arms for sliding in the corresponding guiding slots. Each slide arm extends forwards to form a resilient arm with a locking recess defined therein for engaging with the corresponding locking tab. Therefore, as used in a cellular phone, the memory card connector can facilitate insertion / extraction of the memory card and hold the memory card reliably and exactly therein.

A novel image sensor structure formed on a substrate of a first conductivity type includes a photosensitive device of a second conductivity type and a surface pinning layer of the first conductivity type. A trench isolation region is formed adjacent to the photosensitive device pinning layer. The structure includes a dopant region comprising material of the first conductivity type formed along a sidewall of the isolation region that is adapted to electrically couple the pinning layer to the substrate. The corresponding method facilitates an angled ion implantation of dopant material in the isolation region sidewall by first fabricating the photoresist layer and reducing its size by removing a corner, or a corner portion thereof, which may block the angled implant material. To facilitate the angled implant to the sidewall edge past resist block masks, two methods are proposed: 1) a spacer type etch of the imaged photoresist; or, 2) a corner sputter process of the imaged photoresist.

A wiring substrate is provided with an insulating resin film; and first and second conductive films provided on the back side and top side of the insulating resin film, respectively. The wiring substrate includes a via formed to fill a recess provided in the insulating resin film and electrically connecting the top side and back side of the insulating resin film. The via includes a first metal film formed to cover the side wall of the recess, an oxide film formed to cover the first meal film, and a second metal film formed on the metal oxide film.

A Subscriber Identity Module (SIM) card connecting device for a portable electronic device which is adapted to further reduce a thickness of the portable electronic device by limiting the height of the SIM card connecting device. The device includes: a printed circuit board (PCB); one or more patterned contacts provided on the PCB and being coupled with one or more contacts formed on the SIM card; and a housing mounted on the PCB for allowing the SIM card to be inserted into / extracted from the housing. The housing presses the inserted SIM card so that the contacts of the SIM card and the patterned contacts come into substantial pressurized contact and / or pressurized contact with each other, depending on a shape of the patterns. According to the present invention, the SIM card mounting space can be reduced, and the portable electronic device can have a further reduction in thickness.

The invention provides a fan which comprises a fan frame and a plug. The circumference of the fan frame is provided with a holding part and at least two fixing holes respectively arranged at two sides of the holding part; the plug comprises a terminal seat provided with at least two joint parts and an ambipolar blade terminal clamped and fixed between the terminal seat combined by an upper seat body and a lower seat body; the plug is combined and connected with the fixing hole of the fan frame by the joint parts to hole the plug in the holding part of the fan frame.

The invention relates to an electronic component moving test device and an electronic component moving test method applying the electronic component moving test device. The electronic component moving test device comprises a bearing jig and a detection instrument, and a conductive body is fixedly arranged on the bearing jig. The electronic component moving test method comprises the following steps: firstly, an electronic component is inserted to a component connecting end of the conductive body; secondly, the electronic component is electrically connected with a component contact part of the detection instrument, and the conductive body is electrically connected with an instrument contact part of the detection instrument to form a loop for testing; thirdly, the electronic component and the conductive body are respectively disconnected from the component contact part and the instrument contact part of the detection instrument after a test is completed; fourthly, the bearing jig inserted with the electronic component is moved to a workstation of the next detection instrument; fifthly, the electronic component is electrically connected with the component contact part of the next detection instrument, and the conductive body is electrically connected with the instrument contact part of the detection instrument to form the loop for testing; and sixthly, step two to step five are repeated until all tests are completed.

The invention relates to an electronic component moving test device and an electronic component moving test method applying the electronic component moving test device. The electronic component moving test device comprises a bearing jig and a detection instrument, and a conductive body is fixedly arranged on the bearing jig. The electronic component moving test method comprises the following steps: firstly, an electronic component is inserted to a component connecting end of the conductive body; secondly, the electronic component is electrically connected with a component contact part of the detection instrument, and the conductive body is electrically connected with an instrument contact part of the detection instrument to form a loop for testing; thirdly, the electronic component and the conductive body are respectively disconnected from the component contact part and the instrument contact part of the detection instrument after a test is completed; fourthly, the bearing jig inserted with the electronic component is moved to a workstation of the next detection instrument; fifthly, the electronic component is electrically connected with the component contact part of the next detection instrument, and the conductive body is electrically connected with the instrument contact part of the detection instrument to form the loop for testing; and sixthly, step two to step five are repeated until all tests are completed.

The invention relates to a pressure device supporting a test sorter for semiconductor device tests. In the pressure device for a test sorter, a pressurizing plate fixes a matching plate with one sideend of a matching plate and a corresponding opposite surface of a first guide rail having a first interval and the other side end of the matching plate and a corresponding opposite surface of a secondguide rail having a second interval, or, fixes the matching plate in a mode of being parallel to a mounting and dismounting movement direction of the matching plate and a virtual reference line passing the matching plate becoming a reference for thermal expansion or thermal contraction of the matching plate, the shortest distance between the virtual reference line and the central point of the matching plate being smaller than the shortest distance between the virtual reference line and two side ends of the matching plate, or the virtual reference line passing the central point. According to the press device for a test sorter, a semiconductor device and a tester can be ensured to be accurately electrically connected, and test sockets, insertion pieces, semiconductor devices and the like can also be prevented from being damaged.

The invention discloses a novel USB flash disk capable of being quickly pulled away. The USB flash disk comprises a main body and an outer cover. The main body is composed of a housing, an indicating lamp, a locking press button, a core assembly and a master control circuit; a power cut-off circuit is additionally installed in the main body and is used for cutting off electrical connection between the USB flash disk and a computer, and the on / off state of the power cut-off circuit is controlled by a power cut-off button arranged on the main body. The USB flash disk capable of being quickly pulled away revealed in the invention is additionally provided with the power cut-off circuit which can quickly and accurately cut off the electrical connection between the USB flash disk and the computer, so the speed of pulling the USB flash disk away from a computer case is increased; meanwhile, the power cut-off circuit is controlled by the externally arranged power cut-off button, and the power cut-off circuit is convenient to operate and use, is safe and reliable and greatly improves operating efficiency of computers by people.

The invention discloses a method for transferring chips in batches, and the method comprises the steps: obtaining a first image of a first image sensor, controlling a processing platform to move a target substrate and / or a transfer substrate according to the first image, and moving the transfer substrate to a position over the target substrate; obtaining a second image of a second image sensor, and identifying an electrode wire and a chip in the second image; controlling the processing platform to move and / or rotate the target substrate and / or the transfer substrate until the relative positions and / or relative angles of the electrode wire and the chip belong to a preset range; and releasing the chips from the transfer substrate. According to the method, when a display panel is processed, the chips can be accurately released to the reserved position of the target substrate, and the transfer yield and the display panel manufacturing yield are improved.

The invention provides a fan which comprises a fan frame and a plug. The circumference of the fan frame is provided with a holding part and at least two fixing holes respectively arranged at two sides of the holding part; the plug comprises a terminal seat provided with at least two joint parts and an ambipolar blade terminal clamped and fixed between the terminal seat combined by an upper seat body and a lower seat body; the plug is combined and connected with the fixing hole of the fan frame by the joint parts to hole the plug in the holding part of the fan frame.