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Display panel processing system and method for transferring chips in batches

A technology for transferring chips and chips, which is applied in the direction of image data processing, instruments, electrical components, etc., can solve the problems affecting the transfer yield, achieve the effect of simple implementation, reduce the probability of failure, and improve the manufacturing yield

Inactive Publication Date: 2021-11-19
深圳铭创智能装备有限公司
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Problems solved by technology

In this process, Micro-LEDs need to be transferred in batches. The existing Micro-LED transfer technology generally transfers the chips to the transfer substrate first, aligns the transfer substrate and the target substrate, and then lifts the micro-LED by laser. However, in this process, how to ensure the precise alignment between the transfer substrate and the target substrate, so that the micron-sized core particles are just released to the definite position of the target substrate, which also affects the transfer yield. an important question of

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  • Display panel processing system and method for transferring chips in batches
  • Display panel processing system and method for transferring chips in batches
  • Display panel processing system and method for transferring chips in batches

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0042] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) in the embodiment of the present application, the directional indications are only used to explain the position in a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0043] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the...

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Abstract

The invention discloses a method for transferring chips in batches, and the method comprises the steps: obtaining a first image of a first image sensor, controlling a processing platform to move a target substrate and / or a transfer substrate according to the first image, and moving the transfer substrate to a position over the target substrate; obtaining a second image of a second image sensor, and identifying an electrode wire and a chip in the second image; controlling the processing platform to move and / or rotate the target substrate and / or the transfer substrate until the relative positions and / or relative angles of the electrode wire and the chip belong to a preset range; and releasing the chips from the transfer substrate. According to the method, when a display panel is processed, the chips can be accurately released to the reserved position of the target substrate, and the transfer yield and the display panel manufacturing yield are improved.

Description

technical field [0001] The present application relates to the technical field of laser processing, in particular to a display panel processing system and a method for transferring chips in batches. Background technique [0002] Micro-LED (micro-light-emitting diode) refers to an LED with an extremely small size. Its size can reach several microns, and thousands or hundreds of Micro-LEDs can be prepared in the millimeter range to form a Micro-LED array. Due to the advantages of localized light emission, uniform current expansion, high saturation current density, high output optical power density, and high photoelectric modulation bandwidth, Micro-LEDs have shown good application prospects in the fields of display, maskless lithography, and visible light communication. . Due to its self-illuminating properties, it is also easier to realize low-power and high-brightness displays. [0003] The preparation of Micro-LED display screens first needs to prepare thin-film, miniaturi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68H01L33/00H01L27/15G06T7/70
CPCH01L21/681H01L33/0095H01L27/156G06T7/70G06T2207/30148
Inventor 王祥李善基张志强
Owner 深圳铭创智能装备有限公司
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