The invention relates to
diffusion technology for manufacturing solar cells, in particular to phosphoric
diffusion technology for metallurgical-grade polysilicon solar cells. The technology comprises the following steps: firstly, performing high temperature
grain boundary gettering, wherein high temperature is used to make
impurity atoms released at the prior
settling position and simultaneously diffused and move to the position of a
grain boundary defect to settle to form a clean area near the
grain boundary; secondly, performing medium-low temperature phosphoric deposition, wherein
diffusion deposition of fresh
phosphorus is performed for a short time at a medium low diffusion temperature to finish surface low concentration
phosphorus deposition to prepare for long time high temperature drive-in in a next step; thirdly, performing diffusion
passivation of high temperature deep grain boundary, wherein high temperature long time phosphoric source drive-in is performed to form deep PN junction at the position of the grain boundary so as to make
phosphor generate phosphoric gettering and
passivation of phosphoric
drift field at the position of the grain boundary; and finally, performing the diffusion again for adjusting to a needed
sheet resistance value. The technology greatly reduces the composite of minority carrier originally happening in the position of the grain boundary by utilizing the properties of the diffusion of impurities in the
polycrystalline silicon; and after the process is finished, the minority
carrier lifetime of a
silicon chip is improved compared with that of a
silicon clip produced by a normal process, which has an active effect on the final performance of the cells.