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55results about How to "Suppresses light absorption" patented technology

Semiconductor device and its manufacturing method, and display device and electronic appliance

A semiconductor device having a light-emitting element with excellent light-emitting characteristics is provided. The semiconductor device is provided with a first depressed portion or opening portion formed in an insulating film; a first electrode which is formed over the insulating film around the first depressed portion or opening portion, which is positioned in the first depressed portion or opening portion, and which forms a second depressed portion together with the first depressed portion or opening portion; a semiconductor layer of a first conductivity type which is formed over the first electrode and which forms a third depressed portion together with the second depressed portion; a light-emitting layer which is formed over the semiconductor layer of the first conductivity type and which forms a fourth depressed portion together with the third depressed portion; a semiconductor layer of a second conductivity type which is formed over the light-emitting layer and which forms a fifth depressed portion together with the fourth depressed portion; and a second electrode formed over the semiconductor layer of the second conductivity type that forms a bottom surface and a side surface of the fifth depressed portion.
Owner:SEMICON ENERGY LAB CO LTD

Group iii nitride semiconductor light-emitting device and method of manufacturing the same, and lamp

Disclosed is a group III nitride semiconductor light-emitting device which suppresses electric current concentration in a light-transmitting electrode and a semiconductor layer directly below an electrode to enhance light emission efficiency, suppresses light absorption in the electrode or light loss due to multiple reflection therein to enhance light extraction efficiency, and has superior external quantum efficiency and electric characteristics. A semiconductor layer (20), in which an n-type semiconductor layer (4), a light-emitting layer (5) and a p-type semiconductor layer (6) are sequentially layered, is formed on a single-crystal underlayer (3) which is formed on a substrate (11). A light-transmitting electrode (7) is formed on the p-type semiconductor layer (6). An insulation layer (15) is formed on at least a part of the p-type semiconductor layer (6), and the light-transmitting electrode (7) is formed to cover the insulation layer (15). A positive electrode bonding pad (8) is provided in a position A corresponding to the insulation layer (15) provided on the p-type semiconductor layer (6), on a surface (7a) of the light-transmitting electrode (7). A sheet resistance of the n-type semiconductor layer (4) is lower than a sheet resistance of the light-transmitting electrode (7).
Owner:TOYODA GOSEI CO LTD

Optical modulator

This optical modulator includes a substrate and a phase modulation unit on the substrate, said phase modulation unit including: a first traveling-wave electrode, a second traveling-wave electrode, and an optical waveguide configured from a first cladding layer, a semiconductor layer, which is laminated on the first cladding layer, and has a refractive index that is higher than that of the first cladding layer, and a second cladding layer, which is laminated on the semiconductor layer, and has a refractive index that is lower than that of the semiconductor layer. The semiconductor layer is provided with: a rib section, which is formed in the optical axis direction of the optical waveguide, and is to be the core of the optical waveguide; a first slab section formed in the optical axis direction on one side of the rib section; a second slab section formed in the optical axis direction on the other side of the rib section; a third slab section formed in the optical axis direction on the first slab section side opposite to the rib section; and a fourth slab section formed in the optical axis direction on the second slab section side opposite to the rib section. The first slab section is formed thinner than the rib section and the third slab section, and the second slab section is formed thinner than the rib section and the fourth slab section.
Owner:NIPPON TELEGRAPH & TELEPHONE CORP

Vcsel with reduced light scattering within optical cavity

A VCSEL with a structure able to reduce the scattering within the optical cavity and its manufacturing method are disclosed. The VCSEL of the present invention provides, on the semiconductor substrate, the first DBR, the active layer, the p-type spacer layer, the heavily doped p-type mesa, the heavily doped n-type layer, the first n-type spacer and the second DBR in this order. The heavily doped n-type layer, which is formed so as to cover the p-type spacer layer and the heavily doped p-type mesa, forms the tunnel junction with respect to the heavily doped p-type mesa. Because the height, which is appeared in the surface of the n-type spacer layer, reflects the height of the heavily doped p-type mesa and is comparatively small, the light scattering between the second DBR and the n-type spacer layer is suppressed.
Owner:SUMITOMO ELECTRIC IND LTD

Organic electroluminescent element

A self-light-emitting type organic electroluminescence device which makes it possible to restrain to the utmost the absorption of light in an electrode layer, to efficiently take out the light and thereby to obtain sufficient luminance efficiency and the like, in the case of emitting the light through the electrode layer. In an organic electroluminescence device comprising a light-emitting layer ( 3 ) comprised of an organic material based the light-emitting layer ( 3 ) being sandwiched between a first electrode ( 2 ) and a second electrode ( 4 ), and light emitted from the light-emitting layer ( 3 ) being taken out to at least one of the side of the first electrode ( 2 ) and the side of the second electrode ( 4 ), the light absorbance of the electrode or electrodes on the side of taking out the light, of the first electrode ( 2 ) and the second electrode ( 4 ), is not more than 10%.
Owner:SONY CORP

Semiconductor device

Disclosed according to an embodiment is a semiconductor device comprising: a semiconductor structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first electrode electrically connected to the first conductive semiconductor layer; and a second electrode electrically connected to the second conductive semiconductor layer, wherein the semiconductor structure includes a third conductive semiconductor layer disposed between the second conductive semiconductor layer and the second electrode, the first conductive semiconductor layer includes a first dopant, the second conductive semiconductor layer includes a second dopant, the third conductive semiconductor layer includes the first dopant and the second dopant, and the concentration ratio between the first dopant and the second dopant included in the third conductive semiconductor layer ranges from 0.01:1.0 to 0.8:1.0.
Owner:SUZHOU LEKIN SEMICON CO LTD
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