The invention relates to a substrate-free full
powder ultra-thin
diamond saw blade. A matrix is prepared by
powder and
diamond through a
powder metallurgy method. The powder includes
copper powder which is 35-55% of the total
mass,
cobalt powder which is 8-12% of the total
mass,
tin power which is 8-12% of the total
mass, nickle powder which is 2-4% of the total mass,
titanium powder which is 1-3%of the total mass,
chromium powder which is 1-3% of the total mass,
molybdenum powder which is 1-3% of the total mass,
iron powder which is 5-20% of the total mass,
tungsten powder which is 1-10% ofthe total mass, silver powder which is 0.5-1.5% of the total mass,
silicon powder which is 0.3-0.5% of the total mass,
phosphorus powder which is 0.2-0.3% of the total mass, and carbon power which is0.2-0.3% of the total mass. The
volume concentration of the
diamond is 2%-60% and the particle size is 0.04-0.25 mm. Because the technical scheme is used in the invention, the substrate-free full powder ultra-thin diamond saw blade has the following advantages: firstly, the substrate-free full powder ultra-thin diamond saw blade has no a substrate, which greatly reduces the waste of the substrate;secondly, the thickness can reach 0.3-1.0 mm; and thirdly, the height of a cutter head reaches 45% of the outer
diameter of the saw blade, and so the service life of the product is long, the cuttingefficiency is high, the saw kerf is small, and the energy and the resources can be saved.