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Method for cutting ultrathin dimension stone in large specification by using small circular saw blade, and dedicated leveling splitting machine

A circular saw blade and large-scale technology, applied in the field of ultra-thin stone cutting, can solve the problems of unsatisfactory thickness uniformity of ultra-thin stone, difficulty in greatly improving performance, difficulty in processing ultra-thin stone slabs, etc., and achieve a high damage rate The effect of low cost, large reduction in production cost and reduction in geometric size

Inactive Publication Date: 2006-02-01
翦凝刚
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The larger the diameter of the circular saw blade, the thicker the thickness, the larger the gap for cutting stone, the greater the resistance, the greater the power consumption, and the greater the waste of stone.
Of course, the unit price of the product is higher, that is, the ultra-thin stone plate processed by the existing cutting method has a high product price, which makes it difficult for many people to accept it.
At the same time, the greater the radial runout and end face runout of the circular saw blade, the less uniform the thickness of the cut ultra-thin stone, and it is difficult to process ultra-thin stone plates with a large area and thinner thickness (for example, according to public information, Liaoning The thickness of the 3000mm×1500mm thin stone plate produced by a certain company is still not less than 5.5mm)
[0012] On the other hand, the current production of synthetic diamond circular saw blades is limited by the characteristics of the metal itself, and it is difficult to greatly improve the performance. Therefore, it is not possible to overcome the defects of the above cutting methods by improving the circular saw blade itself. realistic

Method used

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  • Method for cutting ultrathin dimension stone in large specification by using small circular saw blade, and dedicated leveling splitting machine
  • Method for cutting ultrathin dimension stone in large specification by using small circular saw blade, and dedicated leveling splitting machine
  • Method for cutting ultrathin dimension stone in large specification by using small circular saw blade, and dedicated leveling splitting machine

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Embodiment Construction

[0034] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0035] like figure 1 , figure 2 ,image 3, Figure 4 , Figure 5 Shown, the present invention cuts the method for large-scale ultra-thin stone with small circular saw blade, and its process step is as follows:

[0036] (1) According to the sum of the thicknesses of two stone slabs 18,17 to be obtained plus the thickness of the circular saw blade 2 plus the thickness of the circular saw blade 2 end face runouts, select the thickness of the required double-sided polished stone slab 1. For example: a double-sided polished 1600mm×800mm stone slab 1 is to be cut into one 1600mm×800mm×2mm and four 1600mm×200mm×4mm stone slabs. The circular saw blade 2 of φ500mm can be selected, the thickness of the circular saw blade 2 is 4mm, and the end face runout is 0.5mm, so the kerf 19 is 4.5mm, and the thickness of the selected stone plate 1 should be 10.5...

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Abstract

A method for preparing a large-area super-thin stone material by use of small circular saw blade includes such steps as cutting on the big stone slab according to the sizes of needed small stone slabs to form multiple ditches, fixing the big stone slab to the bench of a horizontal cutting machine, sucking the first needed small stone strip by a sucking unit, using small circular saw blade to saw the big stone slob for separating the first small stone strip from the big one, repeating said steps until all small stone strips are separated to obtain a large-area super-thin stone material and several small super-thin stone strips. Said horizontal cutting machine is also disclosed.

Description

technical field [0001] The invention relates to a method for cutting ultra-thin stone materials, specifically a method for cutting (processing) large-sized ultra-thin stone (plate) materials with a small (sized artificial diamond) circular saw blade. The invention also relates to a special horizontal cutting machine for carrying out the method. Background technique [0002] Since the 1990s, ultra-thin (so-called ultra-thin, defined internationally as its thickness less than 8 mm) stone (including granite and marble) panels have gradually replaced artificial tiles with their natural and gorgeous natural colors and patterns. The main force of decorative materials. [0003] Cutting (processing) ultra-thin stone slabs at home and abroad generally adopt the following methods: cutting with frame saws and band saws. Due to low processing efficiency and high processing costs, and band saws cannot cut granite, and frame saws are too bulky, Therefore, the above methods have been gra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/32B28D1/04B28D7/04
Inventor 翦凝刚
Owner 翦凝刚
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