54results about How to "Produce heat" patented technology

In an assembling structure for LED road lamp and heat dissipating module, the LED road lamp includes a partition board, an upper casing, a light transmitting lens and an LED lamp set. The upper casing and the light transmitting lens are set separately on upper and lower sides of the partition board. Each LED lamp set is contained in a space enclosed by the partition board and the light transmitting lens. The partition board has a plurality of through holes, and the LED lamp set includes a frame body and an LED module. The heat dissipating module includes a heat dissipating body, a heat pipe and an isothermal board. The heat dissipating body is set in a space enclosed by the partition board and the upper casing, and the heat pipe has a heat discharging end passing through and connecting the partition board and the heat dissipating body and a heat receiving end forming the bottom of the partition board. The isothermal board is fixed onto a frame body of the LED lamp and has two planes separately attached onto the heat receiving end and the LED module, so as to significantly enhance the overall heat conducting and dissipating performance, drive an LED to emit light at a lower temperature, and extend the life expectancy of the LED.

A useful energy product created by a process where a chemical species flow passes through a macroscopic artificial dielectric structure for a gas-permeable susceptor having (a) first regions in the structure that are primarily transparent to applied electromagnetic energy and (b) second regions in the structure that are not primarily transparent to applied electromagnetic energy.

A method of locally concentrating an applied electric field to promote chemical reaction having a dispersion of individual field concentrators on the surface of a substrate, embedded on a substrate, and embedded on the surface of a substrate, in which the individual field concentrators consists of shaped material and the shape and material are capable of producing a locally concentrated electric field in the vicinity of the field concentrator from interaction between the field concentrator and the applied electric field.

An ECU has an enclosure which is contained in the casing of an automatic transmission, which is formed of a material having low heat conductivity, and which provides liquid-tight containment of a substrate. A heat sink is attached to the substrate so as to dissipate heat from an electronic circuit on the substrate. The heat sink is attached in contact with an inner wall surface of the enclosure, so that heat produced by the electronic circuit is dissipated via the heat sink and the enclosure.

According to various illustrative embodiments of the present invention, a device for a light projection system includes a single light emitting diode array comprising at least one green die, at least one blue die, and at least one red die, a single light collection, integration, and etendue-matching optic element comprising a tapered light pipe capable of collecting substantially all light emitted by the single light emitting diode array and spatially integrating the substantially all the light emitted by the single light emitting diode array, and a telecentric relay using at least one of spherical and aspherical refractive and reflective components. The device also includes an illumination wedge prism, a digital micromirror device capable of modulating the substantially all the light emitted by the single light emitting diode array, and a projection total internal reflection prism, the projection total internal reflection prism disposed between the illumination wedge prism and the digital micromirror device. The device also includes a projection lens, wherein the telecentric relay provides the substantially all the light emitted by the single light emitting diode array through the illumination wedge prism and through the projection total internal reflection prism to the digital micromirror device that reflects the substantially all the light emitted by the single light emitting diode array back through the projection total internal reflection prism that totally internally reflects the substantially all the light emitted by the single light emitting diode array through the projection lens.

The present invention relates to a solid state lighting system comprising at least one light emitting semiconductor device, at least one driver for driving a predetermined current through the at least one light emitting semiconductor device. The lighting system furthermore comprises a first voltage supplying unit coupled to provide a first supply voltage to a first side of the at least one light emitting semiconductor device, and a second voltage supplying unit coupled to provide a second supply voltage for the at least one light emitting semiconductor device. The first and the second supply voltages are selected to optimize the voltage drop across the at least one light emitting semiconductor device.

A coated susceptor of electromagnetic energy for chemical processing made of a matrix material that surrounds a non-matrix material that is made from a material that is different from the matrix material, in which the matrix material is constructed of material having lower dielectric losses compared to the non-matrix material, the non-matrix material initially absorbs electromagnetic energy applied to the electromagnetic susceptor to a greater extent than the matrix material, the non-matrix material produces subsequent heat in the matrix material, and the surface of the susceptor is coated with a material that interacts with applied electromagnetic energy of at least one frequency and initially absorbs electromagnetic energy and produces heat.

An electromagnetic susceptor for chemical processing having a matrix material that surrounds a non-matrix material that is made from a material that is different from the matrix material, the matrix material is constructed of a sintered ceramic material having lower dielectric losses compared to the non-matrix material, the non-matrix material initially absorbs electromagnetic energy applied to the electromagnetic susceptor to a greater extent than the matrix material, and the non-matrix material produces subsequent heat in the matrix material.

Method and apparatus for heating and / or compressing plasmas to thermonuclear temperatures and densities are provided. In one aspect, at least one of at least two plasmoids separated by a distance is accelerated towards the other. The plasmoids interact, for instance to form a resultant plasmoid, to convert a kinetic energy into a thermal energy. The resultant plasmoid is confined in a high energy density state using a magnetic field. One or more plasmoids may be compressed. Energy may be recovered, for example via a blanket and / or directly via one or more coils that create a magnetic field and / or circuits that control the coils.

A laser power grid for operation with data networks employs WDM and incorporates wavelength addressing. The laser power grid (100) includes a laser power supply station (110) comprising a plurality of continuous-work laser sources (112, 114, 115, 116, 118), a laser distribution grid (130) for distributing light propagations of different wavelengths throughout a data network and an optical switching network (142, 144, 145, 146, 148) coupled to the laser distribution grid for locally turning the laser power on when it is needed. The laser power grid replaces systems of tunable lasers. It is considerably faster and cheaper than systems of tunable lasers and produces less waste heat within the data network surroundings. The laser power grid incorporates parallel fast optical communication in complex multi-node communication and computer networks and enables the implementation of burst switching and packet switching by wavelength addressing.

The present invention discloses a heat dissipating module applied to a low-level chip for dissipating the heat produced by the low-level chip. The heat dissipating module has a base, and the base accommodates a fan. The base includes first and second fin modules, and the first and second fin modules are comprised of a plurality of unidirectional fins. The first heat dissipating module is installed separately at two corresponding ends of the base, and the second fin module is disposed within the first fin module, and the fins on the second fin module are arranged in an outwardly ascending shape, and the fins at the farthest distance from the fan are bent inwardly. The invention not only allows outside air to enter into the base through the outwardly ascending fins without being blocked by the fins adjacent to the fan, but also increases the heat dissipating area.

A packaging structure and method for a light emitting diode is provided. The present invention uses flip-chip and eutectic bonding technology to attach a LED to a thermal and electrical conducting substrate. The flip-chip packaging structure comprises a thermal and electrical conducting substrate having an insulating layer formed in an appropriate area on the top surface of the substrate and a bonding pad formed on top of the insulating layer; and a LED reversed in a flip-chip style and joined to the substrate by eutectic bonding. A first electrode of the LED is eutectically bonded to an appropriate area on the top surface of the substrate via a eutectic layer, while a second electrode of the LED is electrically connected to the bonding pad.