58results about How to "Play the role of heat conduction" patented technology

The invention discloses a carbon fiber-based coated sand material for selective laser sintering and a preparation method thereof; the components of the carbon fiber-based coated sand material are chopped carbon fiber, raw sand, an organic binder, a curing agent, a lubricant, an even Coupling agent and dispersant; its preparation method is: carry out surface modification treatment on chopped carbon fiber, and then prepare according to the following process: raw sand heating—adding resin—adding part of calcium stearate and the prepared coupling agent aqueous solution—adding Hexatropine curing agent containing chopped fibers—adding the remaining calcium stearate—cooling—sieving and sanding out to obtain the product. The advantages of the present invention are: (1) carbon fiber plays a role of heat conduction, which limits the overall shrinkage of the sintered part to a certain extent, and reduces the warping phenomenon in the molding process; The thermal stability of the coated sand can promote the curing reaction of the phenolic resin in the local part of the sintered layer and the joint between the layers, and obviously improve the green strength of the laser sintered formed part.

The invention discloses a high-efficiency patch triode with a good heat dissipation structure, relates to the technical field of patch triodes, and includes a packaging shell, a wear-resistant and crack-proof component and a heat dissipation component. Pins are installed under the package shell. And the outer side of the connection between the pin and the package shell is fixed with a sealing and waterproof component, the wear-resistant and crack-proof component is fixed on the outside of the package shell, the upper part of the package shell is integrally connected with a fixing plate, and the fixing plate A threaded hole is provided in the middle, a main chip is installed in the middle of the package shell, and a reinforced protective component is installed on the outside of the main chip, a conductive layer is welded at the connection between the main chip and the pin, and the upper and lower sides of the main chip Insulation is fixed on both sides. The beneficial effect of the present invention is that: the device facilitates the prevention of moisture aging at the connection position between the pin and the package shell through the arrangement of the sealed waterproof component, and facilitates the efficient heat dissipation of the chip transistor through the arrangement of the heat dissipation component.

The invention relates to an auxiliary heat transfer mechanism, an external load and a space station, which is used for conducting the heat of the heat dissipation surface of the external load to the cold plate of the bulkhead of the space station, including a heat conduction component and an electric driving mechanism, and the hot end of the heat conduction component is used to communicate with the space station The heat dissipation surface of the external load is connected. The cold end of the heat conduction component is located on the free side of the electric propulsion mechanism, and is driven by the electric propulsion mechanism to move towards the cold plate of the bulkhead of the space station. After the electric propulsion mechanism is powered on, the cold end of the heat conduction component is pushed towards the space station. When the cold plate of the bulkhead moves, when the cold end of the heat conduction component touches the cold plate, since the hot end of the heat conduction component is connected to the heat dissipation surface of the external load, the heat of the heat dissipation surface of the external load can be conducted to the heat conduction surface through the hot end of the heat conduction component. The cold end of the component is then transmitted to the cold plate of the bulkhead of the space station to realize the heat dissipation of the external load. The electric propulsion mechanism is used to realize unmanned external operation, and the heat dissipation of the external load is realized only by electrical signals.

The invention discloses a GaN-based power device with an inverted structure having a graphene heat dissipation layer and a preparation method of the GaN-based power device. The GaN-based power devicecomprises, distributed from bottom to top, a substrate, an insulating medium layer, an electrode bonding pad, a GaN-based HEMT device and graphene material, wherein the electrode bonding pad comprisesa source electrode bonding pad, a drain electrode bonding pad and a gate electrode bonding pad; the GaN-based HEMT device comprises an epitaxial layer structure, a gate electrode, a source electrodeand a drain electrode; and an electrode of the GaN-based HEMT device is bonded with the substrate through the electrode bonding pad, so that an inverted packaging structure is realized. The graphene material is adopted as a heat dissipation material on a substrate material of the inverted GaN-based HEMT device. The HEMT device is connected with the heat dissipation film through the electrode bonding pad, and graphene is adopted as a heat dissipation layer on the HEMT substrate in the inverted structure. The heat dissipation efficiency of the device is improved, and the long-term reliability ofthe device is ensured.