54results about How to "Keep width" patented technology

A method keeps the width of the manufactured sheet substantially the same by attaching edge directors for the formed sheet to the manufacturing apparatus structure instead of to the forming block. Thus, sheet glass may be manufactured to specification for a longer time with the same forming block. An additional method adjusts the width of the manufactured sheet by changing the distance between the edge directors. Thus sheet glass may be manufactured to different width specifications with the same forming block.

A manufacturing method for a semiconductor device includes a hole portion formation step for forming hole portions whose entire width is substantially identical to the width of the opening portion in a part of the active surface side of the substrate on which electronic components are formed, a curved surface formation step for curving the bottom surface of the hole portion while maintaining the width of the bottom surface in the hole portions substantially identical to the width of the opening portion, a connecting terminal formation step for forming connecting terminals that serve as the external electrodes of the electronic circuits by burying metal in the hole portions, and an exposure step for exposing a part of the connecting terminals by carrying out processing on the back surface of the substrate.

Optical analytical devices and their methods of use are provided. The devices are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The devices include optical waveguides for illumination of the optical reactions. The devices further provide for the efficient coupling of optical excitation energy from the waveguides to the optical reactions. Optical signals emitted from the reactions can thus be measured with high sensitivity and discrimination using features such as spectra, amplitude, and time resolution, or combinations thereof. The devices of the invention are well suited for miniaturization and high throughput.

The invention relates to a sport shoe (1) with an outer shell (2) made from injection molded plastic, comprising a front foot shell (4) and a shoe cuff (5) adjoining it. At least partially accommodated in the shell (2) is a relatively soft elastic inner shoe (3). In particular, a ski shoe with at least one strap-shaped clamping means (12) disposed at least in a top end portion of the shoe cuff (5) and extending round the top end portion of the shoe cuff (5) is proposed. This strap-shaped clamping means (12) is of a non-stretch design within its entire longitudinal extension and the strap-shaped clamping means (12) is supported on at least one elastically flexible element (15) in the usage or active state, which is disposed between the shoe cuff (5) and the strap-shaped clamping means (12). Alternatively, the strap-shaped clamping means (12) is provided as a clamping means (12) extending at least partially round the shoe cuff (5) and is secured by at least one of its ends to an elastically flexible element (15) permanently mounted on the shoe.

A multiuse vehicle comprises a frame having longitudinal portions forming a central opening for supporting an engine and end portions extending forward and rearward from said longitudinal portions, each of the end portions having a downwardly extending leg portion with one or more hitches. A suspension system includes the use of pivoting arms that carry trunnion-mounted differentials. An operator's cab is mounted on a forward portion of the frame to provide the operator with increased visibility. The frame behind the operator's cab is configured to receive any of a variety of devices such as a dump bed, a sprayer tank, a salt spreader, or a flat bed.

Provided are an image projection system and method, the image projection system including: a light source for providing illumination light; an illumination optics for receiving and illuminating the illumination light; a Spatial Light Modulator (SLM) having 2 rows of modulation devices formed to be offset from each other, each of the modulation devices modulating the light illuminated from the illumination optics; a frame scanner for scanning the modulated light from the SLM onto a screen to thereby generate a two-dimensional (2D) image corresponding to one frame on the screen; and a projection optics for projecting and focusing the modulated light transmitted from the frame scanner onto the screen.

A laminate film including a first core polylactic acid layer, a coating receiving-layer of polylactic acid, and coated on one side of the coating receiving-layer with PVOH, EVOH, a blend of crosslinked EVOH / PVOH, vinyl alcohol-vinylamine (PVAm) copolymer, anionic carboxylated styrene-butadiene copolymer (SBR) emulsion, or blends thereof. This coating may be applied after the machine-direction orientation step and dried and oriented in a transverse direction orientation oven if in-line coating is desired; or applied to the film in an off-line coating method and dried in an air flotation oven. The dried coating layer can be metallized. This laminate film exhibits excellent gas and moisture barrier properties, appearance, and metal adhesion. It may also optionally include a heat sealable or winding improving layer on the side opposite the coating receiving-layer of the core layer.

A manufacturing method for a semiconductor device includes a hole portion formation step for forming hole portions whose entire width is substantially identical to the width of the opening portion in a part of the active surface side of the substrate on which electronic components are formed, a curved surface formation step for curving the bottom surface of the hole portion while maintaining the width of the bottom surface in the hole portions substantially identical to the width of the opening portion, a connecting terminal formation step for forming connecting terminals that serve as the external electrodes of the electronic circuits by burying metal in the hole portions, and an exposure step for exposing a part of the connecting terminals by carrying out processing on the back surface of the substrate.

A method keeps the width of the manufactured sheet substantially the same by attaching edge directors for the formed sheet to the manufacturing apparatus structure instead of to the forming block. Thus, sheet glass may be manufactured to specification for a longer time with the same forming block. An additional method adjusts the width of the manufactured sheet by changing the distance between the edge directors. Thus sheet glass may be manufactured to different width specifications with the same forming block.

A discharge valve mechanism has a plurality of discharge openings. The discharge openings are placed in an open or closed state by a plate-like valve element. Each of the discharge openings is formed at a respective location between a base end side and a leading end side of the valve element. The number of discharge openings to be placed in the open state is varied depending on the pressure and the flow rate of gas refrigerant discharged from a compression chamber.

A semiconductor device includes: an interlayer insulation film; a lower interconnection layer; an upper interconnection layer; and a via hole extending through the interlayer insulation film to establish electric connection between the lower and upper interconnections; wherein a plurality of interconnection lines is provided in the lower interconnection layer, and a contact region is formed for contact with the via hole by partially joining at least two interconnection lines, and a void exists in a first region of the interlayer insulation film located between adjacent interconnection lines, and no void exists in a second region of the interlayer insulation film located between a contacting portion of the via hole in the contact region and an interconnection line adjacent to the contact region, whereby reliably preventing any contact between a via hole and a void formed in an interlayer insulation film even when the via hole is greatly displaced.

To maintain the width of a vehicle body structure for a motorcycle wherein the rigidity of a vehicle body may be increased without increasing the width of the vehicle. Alternatively, to enable to restrain an increase in the weight of the vehicle body by realizing a vehicle body structure for a motorcycle in which the problem wherein the weight of the vehicle body increases when the rigidity of the vehicle body is increased. In a motorcycle including main pipes extending rearwardly from a head pipe, a pair of left and right down tubes are provided that extend from the head pipe obliquely downwardly. The down tubes are formed to be tapered from the head pipe toward an engine when viewed from the side of the vehicle body and to be constant in width from the head pipe toward the engine when viewed from the front of the vehicle body.

A collapsible and portable chair for storage in a container. The chair includes two separate components: a seat portion and back portion. The back portion is received within an aperture of seat portion and supported by a collar. The back portion and the seat portion are connected with a tether and sized to be placed within a standard bucket during storage and for placement on the top of the bucket during use.

A touch panel including a transparent substrate having an active area and an inactive area on a circumference of the active area; a plurality of X-axis and Y-axis electrodes; a first controller attached to a first side of the transparent substrate including the inactive area, and including a driving IC configured to control the X-axis and Y-axis electrode sensors; a second controller attached to a second side of the transparent substrate including the inactive area, in which the second side is opposite to the first side; a plurality of lead lines provided to the inactive area and connecting each of the X-axis and Y-axis electrode sensors with one of the first and second controllers; and a signal channel connecting the second controller to the driving IC of the first controller and being spaced away from the transparent substrate including the X-axis and Y-axis electrode sensors and the lead lines.