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173results about How to "Improve electromagnetic interference" patented technology

Vehicle drive module having improved cooling configuration

InactiveUS7177153B2Improve performanceSmall and light and efficient configurationSpeed controllerConversion constructional detailsModular unitModularity
An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
Owner:ROCKWELL AUTOMATION TECH

Power converter having improved terminal structure

A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
Owner:ROCKWELL AUTOMATION TECH

Cooled electrical terminal assembly and device incorporating same

A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
Owner:ROCKWELL AUTOMATION TECH

Thermally matched fluid cooled power converter

A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
Owner:ROCKWELL AUTOMATION TECH

Flat panel display and a method thereof

A flat panel display including a first mold frame and a bottom chassis. The first mold frame includes a first base plate with an inside region opened and a plurality of first coupling members protruding from a rear side of the first base plate. The bottom chassis includes a second base plate, a plurality of sidewalls extending from the second base plate and a plurality of second coupling members formed on the plurality of sidewalls and coupled with the plurality of first coupling members.
Owner:SAMSUNG DISPLAY CO LTD

Power converter having improved EMI shielding

EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
Owner:ROCKWELL AUTOMATION TECH

Control arrangement for a resonant mode power converter

The switching frequency of an LLC converter is controlled by a control unit to which a feedback circuit provides a first current dependent upon the output voltage of the converter. An oscillator circuit produces a sawtooth waveform at a frequency dependent upon the first current, up to a limit equal to a second current set by a resistor. Two complementary switch control signals are produced for controlling two switches of the converter for conduction in alternate cycles of the sawtooth waveform. A timer produces dead times between the two complementary switch control signals in dependence upon the second current. Another resistor provides a current constituting a minimum value of the first current, and a charging current of a capacitor in series with a resistor modifies the first current for soft starting of the converter.
Owner:POWER INTEGRATIONS INC

Simple zero voltage switching full-bridge DC bus converters

A method and circuit arrangement for achieving zero voltage switching (ZVS) in a 50% duty cycle full-bridge DC bus converter. The ZVS is obtained by increasing the transformer magnetizing current. During the small dead time between conductions of the two bridge legs, the increased magnetizing current supports the output inductor current, and resonates with MOSFET output capacitance, resulting in ZVS operation. With ZVS operation, body diode conduction and voltage spikes across the secondary synchronous rectifiers are reduced, full load efficiency is increased, and transformer flux balance is enhanced.
Owner:INTERNATIONAL RECTIFIER COEP

Semiconductor package having heat spreader and package stack using the same

A semiconductor package which can be stacked to form a package stack that includes a semiconductor chip with bonding pads, a board having contact pads on its upper surface and bump pads on its lower surface, a heat spreader attached to the rear side of the semiconductor chip and covering the upper surface of the board, and external contact terminals including ground terminals and signal terminals formed on the bump pads. The contact pads of the board include ground contact pads connected with the ground terminals and signal contact pads connected with the signal terminals. The heat spreader includes indented parts to expose the signal contact pads and protruded parts to cover the ground contact pads which are exposed through holes formed on the protruded parts on the peripheral part of the heat spreader. The semiconductor package can alternatively have the heat spreader attached to the lower surface of the board.
Owner:SAMSUNG ELECTRONICS CO LTD

Semiconductor package having heat spreader and package stack using the same

A semiconductor package which can be stacked to form a package stack that includes a semiconductor chip with bonding pads, a board having contact pads on its upper surface and bump pads on its lower surface, a heat spreader attached to the rear side of the semiconductor chip and covering the upper surface of the board, and external contact terminals including ground terminals and signal terminals formed on the bump pads. The contact pads of the board include ground contact pads connected with the ground terminals and signal contact pads connected with the signal terminals. The heat spreader includes indented parts to expose the signal contact pads and protruded parts to cover the ground contact pads which are exposed through holes formed on the protruded parts on the peripheral part of the heat spreader. The semiconductor package can alternatively have the heat spreader attached to the lower surface of the board.
Owner:SAMSUNG ELECTRONICS CO LTD

Flat panel display and a method thereof

A flat panel display including a first mold frame and a bottom chassis. The first mold frame includes a first base plate with an inside region opened and a plurality of first coupling members protruding from a rear side of the first base plate. The bottom chassis includes a second base plate, a plurality of sidewalls extending from the second base plate and a plurality of second coupling members formed on the plurality of sidewalls and coupled with the plurality of first coupling members.
Owner:SAMSUNG DISPLAY CO LTD

Resin Composition

The present invention provides a resin composition comprising a thermoplastic resin (A), an inorganic compound having a volume resistance of less than about 10−3 Ω·m and relative permeability of more than about 5,000 (B) and fiber filler (C). The resin composition of the present invention can have high impact strength and high electrical conductivity, and high electromagnetic interference (EMI) and radio frequency interference (RFI) shielding properties. The resin composition of the present invention can accordingly have multiple functions and can be used for electrical / electronic devices.
Owner:LOTTE ADVANCED MATERIALS CO LTD

Method for improving electromagnetic interference of liquid crystal display and time-sequence controller

A method for improving electromagnetic interference of liquid crystal display includes utilizing time sequence controller to provide the first frequency single and the second frequency signal in point to point transistor logic interface of time sequence controller and source electrode actuator, setting phase of the first frequency signal to be different to phase of the second frequency signal, transmitting a numbers of the first image data to source electrode actuator by time sequence controller according to the first frequency signal and transmitting a numbers of the second image data to source electrode actuator according to the second frequency signal.
Owner:AU OPTRONICS CORP

Voltage-type wireless power supply system load identification method

The invention discloses a voltage-type wireless power supply system load identification method. The voltage-type wireless power supply system load identification method comprises the following steps: establishing an inductively power transfer (IPT) system, a primary side circuit sampling circuit obtains 2N primary side resonance current peak values and system working frequency sampling values in a free resonance state and computes total active wear portion RX generated by a secondary side circuit. Whether a non-mutual-inductance-coupling value M exists or not can be judged by comparison of the RX with a primary side coil internal resistance value Rp. If the non-mutual-inductance-coupling value M exists, a load resistance value Re q can be computed. The voltage-type wireless power supply system load identification method has the obvious advantages of being capable of detecting changes of oscillation frequency and the primary side resonance current peak values in a period of a free resonance mode by utilizing two basic modes, namely energy filling and free resonance, and therefore whether load exists or not and power grades of the load when the load exists can be identified.
Owner:重庆前卫无线电能传输研究院有限公司

Vehicle drive module having improved terminal design

InactiveUS7032695B2Improve performanceSmall and light and efficient configurationSpeed controllerConversion constructional detailsDirect touchModular unit
A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
Owner:ROCKWELL AUTOMATION TECH

Drive device

When a drive signal that is a PWM input signal is small (when the drive duty component of the PWM drive signal is small), shoot-through (through state) between the upper transistor and lower transistor can occur when there is variation in the drive circuit or transistors. An upper switching device and lower switching device control current supply to a load, and an upper drive circuit and lower drive circuit respectively drive the upper switching device and lower switching device. The upper drive circuit has an input terminal that receives a control signal that turns the upper switching device on or off; an upper source circuit that SOURCE outputs a drive current to the control terminal of the upper switching device according to a first level or second level signal applied to the input terminal; an upper sink circuit that SINK outputs drive current to the control terminal of the upper switching device according to a second level or first level signal applied to the input terminal; an upper sink transistor that sinks capacitive current through the control terminal when the upper switching device is off; an upper interface circuit that generates a first input drive signal to the upper source circuit according to the input terminal signal, and a second input drive signal to the upper sink circuit or the upper sink transistor; and a selector that selectively supplies the second input drive signal to the upper sink circuit or the upper sink transistor based on a signal from the inverter. The lower drive circuit is identically configured.
Owner:PANASONIC CORP

Apparatus for filtering air

An air filtering apparatus includes a housing defining a top opening and having a front portion defining a bottom opening. A filter is positioned within the top opening and sealed to the housing so that air flowing into the housing passes through the filter. An expansion chamber is in fluid communication with the bottom opening. A motorized fan is located within the housing and is configured for drawing air through the filter, into the housing and out through the expansion chamber. The air output of the motorized fan is directed toward a bottom of the housing proximate a rear of the housing with the expansion chamber extending from the air output of the motorized fan to the front portion of the housing.
Owner:JARDINE KIP +1

Thermal type flow rate measuring apparatus

A flow rate sensor has a problem that a resistance value of a heat generating resistor itself varies and sensor characteristics are changed during use of the sensor for a long term. Also the temperature of the heat generating resistor must be adjusted on a circuit substrate with a resistance constituting one side of a fixed temperature difference control circuit, and this has been one of factors pushing up the production cost. All resistances used for fixed temperature difference control are formed on the same substrate as temperature sensitive resistors of the same material. This enables all the resistances for the fixed temperature difference control to be exposed to the same environmental conditions. Hence, even when the resistances change over time, the changes over time occur substantially at the same tendency. Since the resistances for the fixed temperature difference control change over time essentially at the same rate, a resulting output error is very small.
Owner:HITACHI ASTEMO LTD

Cooled electrical terminal assembly and device incorporating same

A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
Owner:ROCKWELL AUTOMATION TECH

Flat panel display device and data processing method for video data

A flat panel display includes first and second signal drivers which drive a first and second group signal lines of a display panel in accordance with an input first and second group video data respectively. A controller controls a timing of sending the first group video data to the first signal driver via the first data line, and a timing of sending the second group video data to the second signal driver via the second data line. A delay time generating section shifts a relative timing between a timing at which the first signal driver receives the first group video data and a timing at which the second signal driver receives the second video data by a determined time. The problem of the deterioration of the EMI caused by synchronization of the peak currents respectively generated in signal drivers for driving a flat panel display can be suppressed.
Owner:RENESAS ELECTRONICS CORP

High-voltage battery charging system architecture of electric automobile

The invention discloses a high-voltage battery charging system architecture of an electric automobile. The high-voltage battery charging system architecture is arranged in a car body and is used for receiving electric energy of alternating current input voltage so as to charge a high-voltage battery unit in the car body. The high-voltage battery charging system architecture comprises a rectification circuit, a power factor correcting circuit, and a non-isolated type DC-DC converting circuit, wherein the rectification circuit is connected with a common connection point and is used for rectifying the alternating current input voltage to generate rectified voltage; the power factor correcting circuit is connected with the rectification circuit and a bus, and is used for improving power factors and generating bus voltage; the non-isolated type DC-DC converting circuit is connected with the power factor correcting circuit and the high-voltage battery unit, and is used for converting the bus voltage into high-voltage charging voltage to charge the high-voltage battery unit; and an electric energy transmission path of the non-isolated type DC-DC converting circuit does not comprise a transformer. The high-voltage battery charging system architecture of the electric automobile can effectively reduce unnecessary consumption of a circuit to ensure that the charging time of the electric automobile or a hybrid power automobile is comparably short, the manufacturing cost is lower and the efficiency is higher; besides, the high-voltage battery charging system architecture of the electric automobile has the advantages of lower charging loss, shorter charging time and the like.
Owner:DELTA ELECTRONICS INC

Combinatorial mobile hotspot device and network service provision method thereof, network access device and wireless service power supply device

This invention discloses a combinatorial mobile hotspot device, a network service provision method thereof, a network access device and a wireless service power supply device. The network access device has a mobile internet access ability to provide an external host machine connecting to a wide area network through the network access device when the network access device is selectively and electrically coupled to the external host machine. A mobile hotspot device is formed while the network access device is electrically coupled to the wireless service power supply device. The wireless service power supply device supplies the power to the network access device. Further, by a wireless local network transceiver, a plurality of electronic devices in the hotspot covering region are able to connect to wide area network through the wireless access point service provided by the network access device.
Owner:QUANTA COMPUTER INC

High-temperature resistant FBG (fiber bragg grating) sheet type strain sensor and manufacturing method thereof

The invention discloses a high-temperature resistant FBG (fiber bragg grating) sheet type strain sensor and a manufacturing method thereof. The strain sensor consists of an FBG, a polyimide film, an armored cable and an optical fiber connector, wherein the FBG is connected with the polyimide film; the armored cable is connected with the FBG; the optical fiber connector is connected with the armored cable; and when the strain of a structural component is monitored, the surface of the monitored object needs to be milled by abrasive paper, and the polyimide and FBG composite sheet is stuck on the monitored object with adhesives. The method adopts a polyimide curing technology and comprises the following steps of: sealing the FBG and polyimide into a mould, and organically combining through heating, curing and cooling to form a polyimide and FBG composite sheet; leading out the armored cable from the end part of the polyimide and FBG composite sheet; and sticking the polyimide and FBG composite sheet on the surface of the structural component to be monitored by use of high-temperature resistant adhesives. The strain sensor disclosed by the invention resists high temperature, has good durability and high measurement accuracy, and is in quasi-distributed arrangement, free from electromagnetic interference and convenient to construct.
Owner:HARBIN INST OF TECH

Method and system for telemetering rotating machinery parameter based on wireless laser communication

Provided is a rotating machine parameter telemetering method and a system based on the wireless laser communication, including a rotor 1, a wireless laser communication transmitting module 2, a wireless laser communication receiving module 3, a signal transferring module 4, an optical fiber communication transmitting module 5, an optical fiber 6, a computer 7 with an optical fiber interface, a high speed cable 8 and a signal coding module 9 and the like. On the rotor, the wireless laser communication transmitting module performs the electro-optical transmission to the remote control data after being coded, on the ground, the wireless laser communication receiving module performs the electro-optical transmission to the received optical signals to obtain the remote metering signal without being coded, and further the signals are transmitted to the computer for coding and analysis through the signal transferring module, the optical fiber communication transmitting module and the optical fiber. The invention has the advantages of non-contact measurement, high data transmission rate, no electromagnetic interference and high reliability, which can satisfy the high speed parameter telemetering requirement of the rotating machine, such as the aeroengine and the like.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Array substrate, pixel driving method and display device

The invention provides an array substrate, a pixel driving method and a display device. A first pixel unit assemblage used for displaying first picture images is arranged in the array substrate, and pixel units in the first pixel unit assemblage are connected with a first grid line assemblage of a plurality of grid lines; a second pixel unit assemblage used for displaying second picture images is arranged in the array substrate, and pixel units in the second pixel unit assemblage are connected with a second grid line assemblage of the grid lines. The pixel units contained in the first pixel unit assemblage and the pixel units contained in the second pixel unit assemblage are arranged at intervals. According to the technical scheme of the embodiment, the limited pixel units in the array substrate are utilized to display the corresponding picture images, the consumed power of the display device is reduced through reducing of the driving frequency, and therefore the problem of electromagnetic interference can be effectively solved.
Owner:BOE TECH GRP CO LTD

Modular panel display device

The invention relates to a modularized flat display unit, comprising casing, display screen, display screen-drive functional module and external terminals, where the functional module is arranged in a box, and the box is removably installed on one side of the casing, and the external terminals are arranged on one side of the box. Thus, it reduces the design cost, and makes maintenance convenient. Besides, the external terminals are inclinedly arranged on the box to be able to effectively reduce parts of the wire projecting from the box so as to reduce the required installation space for the flat display unit; the flat display unit further adopts ''T''-shaped support device to effectively use vertical and cross bars to support the whole display unit, solving the problem that the support strength is not enough.
Owner:PROVIEW TECH SHENZHEN

Multi-level efficient inverter

The invention provides a multi-level efficient inverter and belongs to the technical field of inverters. The multi-level efficient inverter comprises a direct current power supply Vdc, an alternating current power supply Vac, a first switch tube S1, a second switch tube S2, a third switch tube S3, a fourth switch tube S4, a fifth switch tube S5, a sixth switch tube S6, a seventh switch tube S7, an eighth switch tube S8, a first diode D1, a second diode D2, a third diode D3, a fourth diode D4, a fifth diode D5, a sixth diode D6, a seventh diode D7, an eighth diode D8, a first filter inductor L1, a second filter inductor L2, a first bus capacitor C1, a second bus capacitor C1, a power frequency filter capacitor C0 and a microcontroller MCU. According to the multi-level efficient inverter, the efficiency of the inverter is improved, and the direct current electromagnetic interference can be reduced.
Owner:SUZHOU LUAN NEW ENERGY TECH CO LTD
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