The invention provides a PCB production process based on laser direct writing exposure. The PCB production process comprises the steps of S1, vacuum pressing; s2, horizontal copper deposition; s3, VCP electroplating is carried out; s4, automatically pasting a dry film; s5, performing laser direct writing exposure; s6, developing the dry film; s7, carrying out acid etching; and S8, solder resist printing. According to the method, the PCB is produced in a mode of combining VCP electroplating and laser direct writing exposure, through pulse current VCP electroplating, the copper plating depth capacity reaches 100%, the thickness ratio of hole copper to surface copper of a plating layer is 1: 1, the product quality is remarkably improved, and the production cost is reduced. A circuit film does not need to be manufactured through laser direct writing exposure, the problem of circuit exposure deviation caused by expansion and shrinkage of a circuit negative film is solved, the problem of insufficient exposure or overexposure caused by insufficient energy is solved, the exposure speed is high, the efficiency is high, the quality of a final PCB product is remarkably improved through VCP electroplating, the production cost is reduced, and the economic benefit is improved; the method has market application prospects and market popularization values.