The present invention provides a process for forming a
copper fine particle sintered
product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the
copper fine particles having a
surface oxide film layer, conducting a treatment for reducing the
copper fine particles with the
surface oxide film layer or
copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the
resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the
surface oxide film layer thereon or the
copper oxide fine particles with an average particle
diameter of 10 μm or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C. or lower under an
atmosphere containing a vapor and a gas of a compound having reducibility to reduce the
oxide film by a reduction reaction which used the compound having reducibility as a
reducing agent, subsequently repeating a heat treatment combining an oxidizing treatment of a short time with a re-reducing treatment, and
sintering the
resultant copper fine particles with each other to form a layer of the sintered product.