43results about How to "Bonding" patented technology

A circuit board including conductive layers bonded to both surfaces of an insulating ceramic substrate, with a brazing material disposed therebetween. The conductive layers comprise at least 99.98% by mass of aluminum, and display an average crystal grain diameter within a range from 0.5 mm to 5 mm and a standard deviation σ for that crystal grain diameter of no more than 2 mm. Each conductive layer comprises at least 20 ppm of Cu, Fe and Si. The surface area of the crystal with the maximum crystal grain diameter within the conductive layers accounts for no more than 15% of the surface area of the insulating ceramic substrate.

A bumping process is disclosed. The bumping process comprises the steps of: providing a wafer having a plurality of bonding pads and a passivation layer, wherein the passivation layer exposes the bonding pads; forming an UBM layer over the wafer to cover the bonding pads; forming two or more photoresist layers over the wafer, wherein the photoresist layers have different exposure and development characteristics; forming at least one or more stair-shaped openings in the photoresist layers by a single exposure corresponding to the bonding pads; filling solder into the stair-shaped openings to form a plurality of solder bumps; removing the entire photoresist layer. The bumping process can provide bumps with higher heights, so that the connection between chips and carriers becomes more reliable.

The invention is a thin film composite solid (and a means for making such) suitable for use as an electrolyte, having a first layer of a dense, non-porous conductive material; a second layer of a porous ionic conductive material; and a third layer of a dense non-porous conductive material, wherein the second layer has a Coefficient of thermal expansion within 5% of the coefficient of thermal expansion of the first and third layers.

Systems and methods for electrical component, e.g., brush, manufacture are provided that control grain orientation. The systems and methods utilize hot pressing techniques to enhance the properties and functionalities of the electrical components / brushes. An intermediate work product characterized by a grain orientation is initially formed through a conventional pressing technique. The conventionally-pressed intermediates are positioned within a cavity / die with the grain orientation in a predetermined orientation relative to the hot press force to be applied thereto. The hot pressed final product exhibits superior resistivity, strength and apparent density / durability. Surface features may be formed on the face(s) of the final work product during the hot pressing step that cannot be achieved in conventional processing techniques. Multi-layered assemblies are provided that may be cross-linked or inter-bonded along an interface therebetween. Advantageous articles of manufacture, e.g., brushes and brush assemblies, are also disclosed.

In a lead frame used for manufacturing a semiconductor device by forming a circuit pattern group including unit lead frames having plural upper side terminal parts in the periphery of a semiconductor element mounting region in one line or plural lines and an outer frame surrounding the circuit pattern group in a state of having a gap in a lead frame material and then mounting a semiconductor element every the unit lead frame and carrying out necessary wiring and enclosing the entire surface of the circuit pattern group in which the semiconductor element is mounted and a part of the outer frame with a resin from an upper surface side and further etching from a lower surface side and forming lower side terminal parts joined to the upper side terminal parts of the circuit pattern group, the circuit pattern group and the outer frame are had and the inner edge of the outer frame is formed in an uneven portion in plan view and bonding between the resin and the outer frame is enhanced.

The invention provides a building block for a mechanical construction. The invention further provides a bearing, an actuator system, a housing, a hub, a mechanical connector and a gear box. The building block includes a first printed material being printed via an additive manufacturing process. The first printed material provides a framework of a second material different from the first printed material and at least partially embedded in the first printed material. The framework of the second material may be included in a hollow structure. Alternatively, at least a part of the framework of the second material may constitute at least a part of the inner wall of the hollow structure. The framework of the second material may be pre-fabricated or may also be generated via the additive manufacturing process. A benefit of this building block is that it allows an increase of strength while limiting the overall weight.

A leather-adhered baseball / softball, comprises a ball core, and a wrapping layer formed over the ball core by a mold, wherein the mold is engraved with raised lines of baseball / softball stitches, such that the molded wrapping layer has a raised baseball / softball stitch guide; the baseball / softball stitch guide is used to align a ball leather, such that the ball leather is aligned and adhered onto the wrapping layer except the baseball / softball stitch guide by an adhesive, so as to form a baseball / softball cover having the baseball / softball stitch guide; or the ball leather is aligned and molded on the wrapping layer except the baseball / softball stitch guide by a mold from a formulated leather raw material, so as to form a baseball / softball cover having the baseball / softball stitch guide. Also disclosed is a method for manufacturing a leather-adhered baseball / softball.

The invention discloses a dental prosthesis stent made of metal additives and a method for manufacturing the dental prosthesis stent made of the metal additives. The method includes: acquiring data of a three-dimensional maxillary model of a patient, selecting a maxillofacial surface of the dental prosthesis stent on the model, reconstructing the maxillofacial surface, stretching the maxillofacial surface until formation of an initial stent model, and repairing the initial stent model to meet design requirements for forming a stent CAD (computer aided design) model available for printing and manufacturing; adopting a selective laser melting 3D (three-dimensional) printer for printing and manufacturing to obtain a stent model, and subjecting the stent model to thermal treatment and surface treatment. The dental prosthesis stent comprises a body made of a metal material, and the body comprises a nesting portion and a supporting portion with a mesh structure. The dental prosthesis stent made of the metal additives and the method for manufacturing the dental prosthesis stent made of the metal additives have the advantages that the structure meeting clinical requirements is made by means of 3D printing technology, high precision, high surface quality and short manufacturing period are realized, and the clinical requirements are met better.