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89results about How to "Avoid long connections" patented technology

Method and Apparatus for Three-Dimensional Integration of Embedded Power Module

InactiveUS20070230221A1Reduces packaging overheadPackaging overhead is reducedTransformers/inductances coolingTransformers/inductances coils/windings/connectionsCo-fired ceramicInductor
A modified planar Low Temperature Co-Fired Ceramic (LTCC) high conductance inductor, embedding a large cross section conductor, supports a stacked arrangement of heat spreader, inductor and active device layers. Interlayer electrical connections connect the layers. Optionally, a DC-DC converter includes the modified planar LTCC high conductance inductor, embedding a large cross section conductor, supporting a stacked arrangement of heat spreader, capacitor and active device layers, the active devices layer including the switching transistors. The active devices layer may include semiconductor dies embedded in a substrate.
Owner:VIRGINIA TECH INTPROP INC

Opto-electronic board

An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.
Owner:IBM CORP

Connector connecting construction and a connector connecting method

A female connector (10) is assembled with a holder (20) on a dashboard (A) and a male connector (30) is assembled with an instrument panel (B). The male connector (30) has a receptacle 32 with a cut-out (35) for receiving the female connector (10). Guide pins (11) of the female connector (10) slide along guide grooves (25) of the holder (20) to displace the female connector (10) normal to an assembling direction and to connect the female connector (10) with the male connector (30). A movable protecting portion (40) is displaced from a protecting position where the movable protecting portion (40) covers the cut-out (35) to a retracted position RP where the movable protecting portion (40) is retracted from the cut-out (35) by sliding movements of guide pins (42) of the movable protection portion (40) along guide grooves (29) of the holder (20).
Owner:SUMITOMO WIRING SYST LTD

Interposer for decoupling integrated circuits on a circuit board

An interposer (20) is used for decoupling a microchip (10) on a circuit board (30). The interposer (20) contains on its upper and lower surfaces structured metal layers (26a-26d) for attachment to the microchip (10) and the circuit board (30), respectively. Inside the interposer, there are two sets of mutually isolated metal structures (21, 22) extending substantially perpendicular to the upper and lower surfaces of said interposer (20). The first set (21) extends closer towards the upper surface than the second set (22), while said second set (22) extends closer towards the lower surface than said first set (21).
Owner:ALCATEL LUCENT SAS
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