The invention relates to a designing method for LED
wafer tri-
laser-beam scribing equipment, in which the output end of a
laser is provided with a light gate, the output end of the light gate is connected with a
beam expander, a first total reflecting mirror is arranged at the output end of the
beam expander, the output end of the first total reflecting mirror is linked with a
laser beam splittingsystem used for splitting a single-
beam laser source into tri-laser-beams, the output end of the laser
beam splitting system is provided with a second total reflecting mirror which is linked with a focusing mirror, and the focusing mirror in right face of a
processing platform;
laser light coming out of the laser is emitted to the
beam expander via the light gate, the
laser light passing throughthe beam expander is emitted to the first total reflecting mirror, the
laser light passing through the first total reflecting mirror is emitted to the laser
beam splitting system, the laser
beam splitting system outputs triple
laser beams with equivalent dimension and energy, the triple
laser beams are emitted to the second total reflecting mirror, are emitted to the focusing mirror after the angle is intersected by the second total reflecting mirror, and are parallel focused on the
processing platform after permeating through the focusing mirror. The equipment realizes parallel scribing on the LED
wafer tri-laser-beam and can be widely used for
cutting LED wafers.