1580results about "High frequency current welding apparatus" patented technology

The system allows training and qualification of a user performing a skill-related training exercise involving body motion in a workspace. A training environment is selected through a computer apparatus, and variables, parameters and controls of the training environment and the training exercise are adjusted. Use of an input device by the user is monitored. The 3D angles and spatial coordinates of reference points related to the input device are monitored through a detection device. A simulated 3D dynamic environment reflecting effects caused by actions performed by the user on objects is computed in real time as a function of the training environment selected. Images of the simulated 3D dynamic environment in real time are generated on a display device viewable by the user as a function of a computed organ of vision-object relation. Data indicative of the actions performed by the user and the effects of the actions are recorded and user qualification is set as a function of the recorded data.

In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.

A method and apparatus for detecting a joint between workpieces is provided. At least one light line is recorded by the light section method to detect the three-dimensional course of the joint and a grey-level image of the joint is also recorded. The grey-level image is evaluated to assess the quality of the joint.

A volatile material vaporizing apparatus features a heating element and heating element controls supported in separate housings to avoid exposure of the controls to heat produced by the heating element. Another embodiment features an elongate heating element supported entirely within a housing having an open end sized to fit over the bowl of an existing smoking device so that drawing air through the smoking device induces airflow into an inlet opening of the housing, along the heating element disposed therein, and onward to the smoking device. In another embodiment, a housing includes a plug portion slidable into a cigarette lighter socket of a vehicle to establish connection with electrical contacts therein. A heating chamber opposite the plug portion is in fluid communication with a heating element in the housing, and an inlet opening allows airflow into the housing for flow along the heating element into the heating chamber.

The present invention suitably provides a method and apparatus for controlling the temperature of a liquid vaporizer heating element, and thereby the rate of evaporation and level of fragrance delivery from the same. In accordance with one exemplary embodiment of the present invention, the device may include a switch that suitably allows the temperature of various types of heating elements to be controlled for different levels of fragrance output. For example, an exemplary embodiment may include a two-pronged plug adaptable to typical outlets that might be found in residential homes or businesses. In accordance with another exemplary embodiment of the present invention, the electrical switch generally provides varying resistance values to the electric circuitry of the vaporizer such that, by changing the switch setting, the operating temperature of the wick is controlled and thus the rate of fragrance evaporation from the vaporizer.

Method and apparatus for melting a material and squeezing the melted material through casing perforations into a fault within the cement or formation of an oil or gas well. A heating tool carries solid material which is melted at depth within the well and adjacent to the casing perforations. The liquefied material is forced through the perforations and into the formation or the well cement. When the material cools and solidifies, the faults become sealed.

A method for joining concealed workpiece parts by an energy beam, wherein a lower workpiece part and an upper workpiece part are positioned relative to each other; the upper workpiece part contacts the lower workpiece part along a joining contour; the energy beam is directed onto an upper side of the upper workpiece part, moved along the joining contour by a controller, in order to join the upper workpiece part to the joining contour; an exploratory seam is produced on the upper work piece part, for detecting the joining contour; a detector detects a boundary at which a surface area of the upper work piece part borders a surface area of the upper work piece part which does have contact with the joining contour; the controller registers a position of the boundary and compares it with a target position of the boundary which is stored in the controller.

Method and device (2) for monitoring a welding area of an object (14) in connection with welding, which device includes arrangements (3) for reproduction of the welding area, at least one filter (4) arranged in front of or in the reproduction arrangement (3), and an illumination arrangement (5) of the welding area with ultraviolet radiation. The filter (4) consists of a band-pass filter which is adapted for filtering around a wavelength within the ultraviolet wavelength range.

Methods and devices are provided for improved large-scale solar installations. In one embodiment, a junction-box free photovoltaic module is used comprising of a plurality of photovoltaic cells and a module support layer providing a mounting surface for the cells. The module has a first electrical lead extending outward from one of the photovoltaic cells, the lead coupled to an adjacent module without passing the lead through a central junction box. The module may have a second electrical lead extending outward from one of the photovoltaic cells, the lead coupled to another adjacent module without passing the lead through a central junction box. Without junction boxes, the module may use connectors along the edges of the modules which can substantially reduce the amount of wire or connector ribbon used for such connections.

A method for using magnetic fields to heat magnetically susceptible materials within and / or adjacent to adhesives, so as to bond, bind, or fasten solid materials to one another. The system uses alternating magnetic fields that induce eddy currents and generate heat within susceptors. An induction heating tool is used to emit the magnetic field at its work coil, and an electronic controller measures the energy being used by a power converter that generates the alternating current driving the work coil which creates the magnetic field. The heating tool is used in a method of adhesive bonding in which the thickness of the conductive layer of the susceptor is in the range of 0.01-3.0 mils, or the heating event time interval is in the range of 0.05-10.0 seconds, or the average power density of the magnetic field at the susceptor is in the range of 10-5000 Watts per square inch.

A new apparatus for inductively soldering surface-mount, straddle-mount and through-hole type electronic components into a self-soldering PCB (printed circuit board) in an automated fashion utilizing localized Electromagnetic Induction Heating (E.I.H.). Current manufacture technology for packaging electronic components depends on the reflow and wave soldering processes. Both processes heat up to relatively high temperatures the entire assembly, namely its PCB and all the electronic components being soldered into it. Such harsh high-temperature environment frequently causes components damage resulting in rejects and / or demanding rework. With this invention reflow oven and / or wave soldering equipment is not required. During a soldering operation only the leads and pads being soldered are heated but neither the body of said electronic components nor the dielectric material forming said self-soldering PCB and its interconnecting traces are heated. Because of this selectively localized inductive heating, the invention permits to reduce cost and improve the quality and reliability of manufactured products. The invention consumes about 200 times less energy than the reflow and wave soldering processes. This invention can readily be utilized to complement and / or supplement the reflow and wave soldering processes by providing selective inductive self-soldering of odd-form and / or heat-sensitive components. The invention also allows in-process, and in-situ, testing of soldered joints quality thus permitting rework before final assembly of a self-soldering PCB is completed. This invention also provides for a useful inductive de-soldering apparatus.

The present invention provides a line pipe of, e.g., the API standard X60 to X100 class. The line pipe has an excellent deformability, as well as excellent low temperature toughness and high productivity, a steel plate used as the material of the steel pipe. Methods for producing the steel pipe and the steel plate are also provided. In particular, a high-strength steel plate excellent in the deformability has a ferrite phase is dispersed finely, and accounts for 5% to 40% in area percentage in a low temperature transformation structure mainly composed of a bainite phase. For example, most grain sizes of the ferrite phase are smaller than the average grain size of the bainite phase. A high-strength steel pipe excellent in deformability is also provided, in which a large diameter steel pipe is produced through forming the steel plate into a pipe shape. The steel pipe has the above-referenced structure, and satisfies the conditions that YS / TS is 0.95 or less and YSxuEL is 5,000 or more. Methods for producing such steel plate and steel pipe are also provided.