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2199results about "Drying machines" patented technology
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Cast pedestal with heating element and coaxial heat exchanger
ActiveUS7327948B1High-temperature gradientHeat resistantSemiconductor/solid-state device manufacturingHigh-frequency/infra-red heating bakingHeat resistanceEngineering
The present invention provides a heat transfer assembly that, when coupled to an object, is capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. The assembly may be contained in a pedestal for use in a UV-cure chamber. The heat transfer assembly includes a heating element to control the wafer temperature and a cooling element to remove incident IR heat from the wafer and pedestal. A heat resistant layer having a calibrated heat resistance is located between the heating and cooling elements and between the wafer and the cooling elements. The heat resistant layer is able to sustain high temperature gradient from the wafer to the coolant so that the coolant does not boil while permitting enough heat to be conducted away from the wafer to maintain the desired set-point temperature.
Owner:NOVELLUS SYSTEMS
Heating apparatus, heat treatment apparatus, computer program and storage medium
ActiveUS8041197B2Efficient solutionRapidly heating up and coolingDomestic stoves or rangesDrying solid materials with heatLength waveSemiconductor
A heating apparatus for heating a target object W is provided with a plurality of heating light sources, including LED elements for applying heating light having a wavelength within a range from 360 to 520 nm to the object. Thus, a temperature of only the shallow surface of the object, such as a semiconductor wafer, is increased / reduced at a high speed in uniform temperature distribution, irrespective of the film type.
Owner:TOKYO ELECTRON LTD
Model-based predictive control of thermal processing
InactiveUS6207936B1Baking ovenSemiconductor/solid-state device manufacturingTemperature controlTemperature response
A nonlinear model-based predictive temperature control system is described for use in thermal process reactors. A multivariable temperature response is predicted using a nonlinear parameterized model of a thermal process reactor. The nonlinear parameterized model is implemented using a neural network. Predictions are made in an auto-regressive moving average fashion with a receding prediction horizon. Model predictions are incorporated into a control law for estimating the optimum future control strategy. The high-speed, predictive nature of the controller renders it advantageous in multivariable rapid thermal processing reactors where fast response and high temperature uniformity are needed.
Owner:ASM AMERICA INC
Unit for varying a temperature of a test piece and testing instrument incorporating same
ActiveUS7115838B2Easy to control temperatureUniform temperature distributionDrying solid materials with heatDomestic cooling apparatusInstrumentationCoolant
Owner:ESPEC CORP
Apparatus for processing a substrate including a heating apparatus
InactiveUS20030066826A1Drying solid materials with heatMuffle furnacesProduction rateDevice material
An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.
Owner:SAMSUNG ELECTRONICS CO LTD
Heat treating apparatus
ActiveUS7865070B2Minimal amountReliably preventing both slipsRespiratorsDrying solid materials with heatSurface roughnessHeat treating
To prevent both slips caused by damage from projections, and slips caused by adhesive force occurring due to excessive smoothing.The heat treating apparatus includes a processing chamber for heat treating wafers and a boat for supporting the wafers in the processing chamber. The boat further includes a wafer holder in contact with the wafer and a main body for supporting the wafer holder. The wafer holder diameter is 63 to 73 percent of the wafer diameter, and the surface roughness Ra of the portion of the wafer holder in contact with the wafer is set from 1 μm to 1,000 μm. The wafer can be supported so that the amount of wafer displacement is minimal and both slips due to damage from projections on the wafer holder surface, and slips due to the adhesive force occurring because of excessive smoothing can be prevented in that state.
Owner:KOKUSA ELECTRIC CO LTD +1
Heat Treating Apparatus
ActiveUS20080267598A1Minimal amountPrevent slipping or slippingRespiratorsDrying solid materials with heatSurface roughnessHeat treating
[Problems] To prevent both slips caused by damage from projections, and slips caused by adhesive force occurring due to excessive smoothing.[Means for Solving the Problems] The heat treating apparatus includes a processing chamber for heat treating wafers and a boat for supporting the wafers in the processing chamber. The boat further includes a wafer holder in contact with the wafer and a main body for supporting the wafer holder. The wafer holder diameter is 63 to 73 percent of the wafer diameter, and the surface roughness Ra of the portion of the wafer holder in contact with the wafer is set from 1 μm to 1,000 μm. The wafer can be supported so that the amount of wafer displacement is minimal and both slips due to damage from projections on the wafer holder surface, and slips due to the adhesive force occurring because of excessive smoothing can be prevented in that state.
Owner:KOKUSA ELECTRIC CO LTD +1
Substrate support
InactiveUS6917755B2Minimize damageProvide spaceDrying solid materials with heatMuffle furnacesSupport surfaceEngineering
An apparatus for supporting a substrate is described that has a ball adapted to minimize damage between the substrate support and the substrate supported thereon. In one embodiment, an apparatus for supporting a substrate includes ball disposed on an inclined ball support surface. The ball support surface is adapted to bias the ball toward one side of the ball support surface thereby providing space for the ball to roll as the substrate supported thereon changes in length when exposed to thermal influences. In another embodiment, the apparatus further comprises a cage adapted to capture the ball to the ball support surface.
Owner:APPLIED MATERIALS INC
Annealing apparatus
ActiveUS8246900B2Improve performanceLow efficiencyDomestic stoves or rangesDrying solid materials with heatLight energyLight emission
Provided is an annealing apparatus, which is free from a problem of reduced light energy efficiency resulted by the reduction of light emission amount due to a heat generation and capable of maintaining stable performance. The apparatus includes: a processing chamber 1 for accommodating a wafer W; heating sources 17a and 17b including LEDs 33 and facing the surface of the wafer W to irradiate light on the wafer W; light-transmitting members 18a and 18b arranged in alignment with the heating sources 17a and 17b to transmit the light emitted from the LEDs 33; cooling members 4a and 4b supporting the light-transmitting members 18a and 18b at opposite side to the processing chamber 1 to make direct contact with the heating sources 17a and 17b and made of a material of high thermal conductivity; and a cooling mechanism for cooling the cooling members 4a and 4b with a coolant.
Owner:TOKYO ELECTRON LTD
System and method for determining the temperature of a semiconductor wafer
InactiveUS7274867B2High precisionImprove convenienceDrying solid materials with heatSemiconductor/solid-state device testing/measurementTime segmentBack calculation
A system and method for determining the temperature of a semiconductor wafer at the time of thermal contact of the semiconductor wafer with a temperature sensing element. According to the invention, a temperature profile of the temperature sensing element is recorded from the time of thermal contact up to the time of thermal equilibrium between the semiconductor wafer and the temperature sensing element and the temperature of the semiconductor wafer at the time of thermal contact is determined on the basis of a time period between the time of thermal contact and the time of thermal equilibrium and the temperature TG of the semiconductor wafer reached at the time tG of thermal equilibrium is determined by back calculation with the aid of an equation derived from Newton's law of cooling.
Owner:POLARIS INNOVATIONS LTD
Heat treatment method, heat treatment apparatus and substrate processing apparatus
InactiveUS20090163038A1Improve reducibilityEfficient removalSemiconductor/solid-state device manufacturingHigh-frequency/infra-red heating bakingEngineeringHeat treated
Disclosed is a heat treatment unit 4 serving as a heat treatment apparatus, which includes a chamber 42 for containing a wafer W on which a low dielectric constant interlayer insulating film is formed, a formic acid supply device 44 for supplying gaseous formic acid into the chamber 42, and a heater 43 for heating the wafer W in the chamber 42 which is supplied with formic acid by the formic acid supply device 44.
Owner:TOKYO ELECTRON LTD
System and method for determining the temperature of a semiconductor wafer
InactiveUS20050042778A1High precisionImprove convenienceDrying solid materials with heatSemiconductor/solid-state device testing/measurementBack calculationThermal contact
A system and method for determining the temperature of a semiconductor wafer at the time of thermal contact of the semiconductor wafer with a temperature sensing element. According to the invention, a temperature profile of the temperature sensing element is recorded from the time of thermal contact up to the time of thermal equilibrium between the semiconductor wafer and the temperature sensing element and the temperature of the semiconductor wafer at the time of thermal contact is determined on the basis of a time period between the time of thermal contact and the time of thermal equilibrium and the temperature TG of the semiconductor wafer reached at the time tG of thermal equilibrium is determined by back calculation with the aid of an equation derived from Newton's law of cooling.
Owner:POLARIS INNOVATIONS LTD
Photoirradiation thermal processing apparatus and thermal processing susceptor employed therefor
ActiveUS7062161B2Avoid crackingAvoid actionLiquid surface applicatorsDrying solid materials with heatSusceptorEngineering
A susceptor is formed with a cavity having a tapered surface and a receiving surface. The gradient α of the tapered surface with respect to the receiving surface is set to at least 5° and less than 30°, so that a semiconductor wafer received by the susceptor can be located on the receiving surface through the tapered surface while the semiconductor wafer can be protected against excess stress also when the surface of the wafer abruptly thermally expands due to flashlight irradiation and can be prevented from cracking in thermal processing. Thus provided are a thermal processing susceptor and a thermal processing apparatus capable of preventing a substrate from cracking in thermal processing.
Owner:DAINIPPON SCREEN MTG CO LTD
LED heat lamp arrays for CVD heating
Owner:ASM AMERICA INC
Substrate processing apparatus and particle adhesion preventing method
ActiveUS20100111648A1Avoid stickingSecure performanceElectric discharge tubesTemperatue controlTemperature controlParticle adhesion
Owner:TOKYO ELECTRON LTD
Fast heating and cooling wafer handling assembly and method of manufacturing thereof
InactiveUS20060127067A1Muffle furnacesSemiconductor/solid-state device manufacturingElectrical resistance and conductanceThermal control
A thermal control device for wafer processing which comprises a) a platform for placement of an object of various sizes to be heated, b) at least a shaft extending substantially transverse to the platform; and c) a plurality of resistance heating elements patterned in a plurality of circuits defining at least one zone for independent controlled heating of objects of varying sizes on the platform.
Owner:GENERAL ELECTRIC CO
Movable radiant heat sources
ActiveUS7725012B2Semiconductor/solid-state device manufacturingHigh-frequency/infra-red heating bakingEngineeringRadiant heat
A semiconductor processing apparatus including a processing chamber and a plurality of radiant heat sources. The radiant heat sources heat a workpiece within the chamber. At least one of the radiant heat sources is movable during processing in an oscillatory motion along a path less than about 10 mm from a geometric center of the oscillatory motion.
Owner:ASM IP HLDG BV
Loading table and heat treating apparatus having the loading table
ActiveUS7718930B2Thermal diffusionPrevent heat from spreadingDrying solid materials with heatMuffle furnacesEngineeringContamination
A thermal processing system has a processing vessel 4, a support post 30 stood on the bottom wall of the processing vessel 4, and a support table 32 internally provided with a heating means 38 and supported on the support post 30. A workpiece W is placed on the upper surface of the support table 32 and is subjected to a predetermined thermal process. The upper, the side and the lower surface of the support table 32 are covered with heat-resistant covering members 72, 74 and 76 to prevent the thermal diffusion of metal atoms causative of contamination from the support table 32. thus, various types of contamination, such as metal and organic contamination, can be prevented.
Owner:TOKYO ELECTRON LTD
Rapid conductive cooling using a secondary process plane
A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and / or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.
Owner:APPLIED MATERIALS INC
Vacuum thermal annealer
A vacuum thermal annealing device is provided having a temperature control for use with various materials, such as semiconductor substrates. A vacuum is used to remove air and outgas residual materials. Heated gas is injected planar to a substrate as pressure is quickly raised. Concurrent with the heated gas flow, a chamber wall heater is turned on and maintains a temperature for a proper annealing time. Upon completion of the annealing process, the chamber wall heater shuts down and air is forced around the chamber wall heater. Additionally, cool gas replaces the heated gas to cool the substrate.
Owner:STEED TECH
Multilevel pedestal for furnace
A pedestal for use in a high temperature vertical furnace for the processing of semiconductor wafers provides a closure and heat insulation for the lower end of the furnace and is a wafer boat support. The pedestal, comprising quartz-enveloped insulation material, supports a wafer boat at a boat support level and is provided with an upper section disposed above the boat support level. The upper section comprises enveloped insulating material. The envelope of the upper section is also formed of quartz and the insulating material in the upper section has a lower thermal conductance than the insulating material in a lower quartz enveloped section.
Owner:ASM INTERNATIONAL
Industrial hopper with support
ActiveUS7475796B2Efficient configurationInexpensive materialsLarge containersLiquid transferring devicesSupporting systemEngineering
An industrial hopper and support system includes a hopper having a plurality of receivers complementally configured to receive the top ends of legs of a support. The hopper is particularly designed to receive and discharge both solid and liquid material by the mounting of a selected valve, and the receivers include recesses therein which inhibit the spread of the legs and provide a structural connection between the legs of the support when the hopper is mounted thereon. The hopper may be mounted to the legs without the use of tools, but a separate fastener may be used when it is desired to lift both the hopper and its support from above. The support is provided with openings through primary tubular members which align with crossmembers so that forks inserted into the openings pass longitudinally through the crossmembers.
Owner:TANK HLDG CORP
Substrate processing apparatus
ActiveUS20090197418A1Efficiently and uniformly cool and heat portionStable processingDomestic cooling apparatusDecorative surface effectsPlate heat exchangerEngineering
A method of using a heat exchanger efficiently and uniformly to cool or heats portions to be controlled to a prescribed temperature, and then continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.
Owner:CANON ANELVA CORP
Model-based predictive control of thermal processing
InactiveUS6373033B1Semiconductor/solid-state device manufacturingHigh-frequency/infra-red heating bakingTemperature controlTemperature response
A nonlinear model-based predictive temperature control system is described for use in thermal process reactors. A multivariable temperature response is predicted using a nonlinear parameterized model of a thermal process reactor. The nonlinear parameterized model is implemented using a neural network. Predictions are made in an auto-regressive moving average fashion with a receding prediction horizon. Model predictions are incorporated into a control law for estimating the optimum future control strategy. The high-speed, predictive nature of the controller renders it advantageous in multivariable rapid thermal processing reactors where fast response and high temperature uniformity are needed.
Owner:ASM AMERICA INC
Method and apparatus for curing a fiber having at least two fiber coating curing stages
InactiveUS7322122B2Maintenance savingImprove drawing speedOptical articlesPretreated surfacesTime delaysIrradiation
The present invention provides a method and apparatus for curing a coated fiber, comprising either two fiber coating curing stages separated by a cooling stage, or two fiber coating curing stages separated by a distinct time interval, or both. One of the two fiber coating curing stages responds to the coated fiber, and provides a partially cured fiber coating. The other of the two fiber coating curing stages responds to the partially cured coated fiber for further curing the coating of the fiber. In one embodiment of the invention, a cooling stage is placed between the two curing stages, while in the other the curing stages are placed a set distance apart such that polymerization of the coating initiated by the first curing stage has time to complete prior to the coating being irradiated by the second curing stage. The cooling stage is used to actively remove heat generated during the cure process from the fiber coating, while the time delay is used to allow complete polymerization to occur before subsequent irradiations. These embodiments of the present invention can be used separately or in combination to achieve optimal fiber coating cure.
Owner:DRAKA COMTEQ BV
Method and system for digital narrowband, wavelength specific cooking, curing, food preparation, and processing
ActiveUS20110002677A1Input energy efficientFunction increaseDomestic stoves or rangesDrying solid materials with heatEngineeringLength wave
A system for direct injection of selected thermal-infrared (IR) wavelength radiation or energy into food items for a wide range of processing purposes is provided. These purposes may include heating, raising or maintaining the temperature of the food articles. The system is especially applicable to operations that require or benefit from the ability to irradiate at specifically selected wavelengths or to pulse or inject the radiation. The system is particularly advantageous when functioning at higher speeds and in a non-contact environment with the target.
Owner:PRESSCO IP LLC
Processing multilayer semiconductors with multiple heat sources
ActiveUS20060018639A1Muffle furnacesSemiconductor/solid-state device manufacturingDistribution systemEngineering
A method and apparatus for rapid thermal annealing comprising a plurality of lamps affixed to a lid of the chamber that provide at least one wavelength of light, a laser source extending into the chamber, a substrate support positioned within a base of the chamber, an edge ring affixed to the substrate support, and a gas distribution assembly in communication with the lid and the base of the chamber. A method and apparatus for rapid thermal annealing comprising a plurality of lamps comprising regional control of the lamps and a cooling gas distribution system affixed to a lid of the chamber, a heated substrate support with magnetic levitation extending through a base of the chamber, an edge ring affixed to the substrate support, and a gas distribution assembly in communication with the lid and the base of the chamber.
Owner:APPLIED MATERIALS INC
Conditioner applicator for heated hair styling device
InactiveUS20090025247A1Easy to addReduce harmCurling-ironsCurling-tongsBiomedical engineeringHair conditioner
An attachment for a heated hair styling device, including a supply of hair conditioner disposed on the attachment so that the conditioner is dispensed upon the attachment contacting the hair.
Owner:WAHL CLIPPER
Thermal oxidation of silicon using ozone
A method and apparatus for oxidizing materials used in semiconductor integrated circuits, for example, for oxidizing silicon to form a dielectric gate. An ozonator is capable of producing a stream of least 70% ozone. The ozone passes into an RTP chamber through a water-cooled injector projecting into the chamber. Other gases such as hydrogen to increase oxidation rate, diluent gas such as nitrogen or O2, enter the chamber through another inlet. The chamber is maintained at a low pressure below 20 Torr and the substrate is advantageously maintained at a temperature less than 800° C. Alternatively, the oxidation may be performed in an LPCVD chamber including a pedestal heater and a showerhead gas injector in opposition to the pedestal.
Owner:APPLIED MATERIALS INC
Method and apparatus for making crystalline PET pellets
InactiveUS20050110182A1Reduce dwell timeIncrease speedMouldsDrying solid materials without heatSlurryCrystallinity
A method and apparatus for underwater pelletizing and subsequent drying of polyethylene terephthalate (PET) polymers and other high temperature crystallizing polymeric materials to crystallize the polymer pellets without subsequent heating. High velocity air or other inert gas is injected into the water and pellet slurry line to the dryer near the pelletizer exit. Air is injected into the slurry line at a velocity of from about 100 to about 175 m3 / hour, or more. Such high-speed air movement forms a vapor mist with the water and significantly increases the speed of the pellets into and out of the dryer such that the PET polymer pellets leave the dryer at a temperature sufficient to self-initiate crystallization within the pellets. A valve mechanism in the slurry line after the gas injection further regulates the pellet residence time and a vibrating conveyor after the dryer helps the pellets to achieve the desired level of crystallinity and to avoid agglomeration.
Owner:GALA INDUSTRIES INC
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