The invention discloses a method for preparing a
semiconductor nanostructure through directional self-
assembly and
mask regulation and control. The method comprises: forming a double-layer
hard mask layer, a photoetching stacking layer and a buffer layer on a
semiconductor substrate, spin-
coating a block
copolymer (BCP) layer on the buffer layer, and annealing to form a self-
assembly template pattern; removing a certain block then to form a photoetching pattern, sequentially transferring the pattern to a buffer layer, a photoetching stacking layer and a second
hard mask layer, depositing a
dielectric layer on the patterned second
hard mask layer, flattening, removing the second hard
mask layer then, and transferring the pattern to a first
mask layer and a
semiconductor substrate by takingthe patterned
dielectric layer as a mask. According to the method, the problem of directional self-
assembly caused by the thickness of the block
copolymer and low
etching selectivity among different block molecules in the existing pattern transfer process can be greatly solved.