119 results about "Polymer encapsulation" patented technology

A method and circuit for implementing security protection with carbon nanotube based sensors for cryptographic applications, and a design structure on which the subject circuit resides are provided. A carbon nanotube layer is incorporated with a polymeric encapsulation layer of a security card. Electrical connections to the carbon nanotube layer are provided for electrical monitoring of electrical resistance of the carbon nanotube layer.

A process for packaging semiconductor devices for flip chip and wire bond applications, wherein specific materials of the semiconductor devices are protected during device processing sequences and dicing procedures, has been developed. After definition of copper interconnect structures surrounded by a low k insulator layer, a protective, first photosensitive polymer layer comprised with a low dielectric constant is applied. After definition of openings in the first photosensitive polymer layer exposing portions of the top surface of the copper interconnect structures, a dicing lane opening is defined in materials located between copper interconnect structures. Conductive redistribution shapes are formed on the copper interconnect structures exposed in the openings in the first photosensitive polymer layer, followed by application of a protective, second photosensitive polymer layer. An opening is defined in the second photosensitive polymer layer exposing a portion of the top surface of a redistribution shape followed by placement of a solder ball in this opening. A reflow anneal procedure results in the solder ball wetting and overlying only the portion of the redistribution shape exposed in the opening in the second photosensitive polymer layer. Separation of the solder ball, flip chip regions from the non-solder ball, wire bond regions is accomplished via a dicing procedure performed in the dicing lane.

System and method for a polymer encapsulated solder lid attach. A preferred embodiment comprises one or more metallic islands distributed throughout the combination attach, wherein each metallic island overlays one or more heat producing portions of the integrated circuit die, and a polymer encapsulant to encircle each metallic island and to bind the one or more metallic islands in place. The one or more metallic islands, with their high thermal conductivity, can effectively dissipate large amounts of heat, while the polymer encapsulant binds the one or more metallic islands in place, preventing (or reducing) movement occurring during thermal cycles that can lead to delamination and separation.

A tendon tensioning anchor has a base member having a tubular section extending therefrom, and a pair of flanges extending outwardly on opposite sides of the tubular section, and a polymeric encapsulation in generally air-tight juxtaposition with an exterior of the base member. A hole is formed through each of the pair of flanges. The polymeric encapsulation extends entirely through and fills the holes so as to integrally connect the polymeric material overlying one surface of the flange with the polymeric material overlying an opposite surface of the flange. The hole is formed adjacent to the tubular section.

A post-mold plated semiconductor device has an aluminum leadframe (105) with a structure including a chip mount pad and a plurality of lead segments without cantilevered lead portions. A semiconductor chip (210) is attached to the chip mount pad, and conductive connections (212) span from the chip to the aluminum of the lead segments. Polymeric encapsulation material (220), such as a molding compound, covers the chip, the connections, and portions of the aluminum lead segments without leaving cantilevered segment portions. Preferably by electroless plating, a zinc layer (301) and a nickel layer (302) are on those portions of the lead segments, which are not covered by the encapsulation material including the aluminum segment surfaces (at 203b) formed by the device singulation step, and a layer (303) of noble metal, preferably palladium, is on the nickel layer.

The present invention is drawn to pigment suspensions, methods of forming pigment suspensions, and ink sets. The pigment suspension can comprise an aqueous liquid vehicle and a polymer-encapsulated pigment suspended in the liquid vehicle. The polymer-encapsulated pigment can include a pigment core, a passivation layer formed from a passivation component including an amphiphilic polymer and deposited on a surface of the pigment core, and a polymer-encapsulation layer attached to or deposited on the passivation layer.

A process for packaging semiconductor devices for flip chip and wire bond applications, wherein specific materials of the semiconductor devices are protected during device processing sequences and dicing procedures, has been developed. After definition of copper interconnect structures surrounded by a low k insulator layer, a protective, first photosensitive polymer layer comprised with a low dielectric constant is applied. After definition of openings in the first photosensitive polymer layer exposing portions of the top surface of the copper interconnect structures, a dicing lane opening is defined in materials located between copper interconnect structures. Conductive redistribution shapes are formed on the copper interconnect structures exposed in the openings in the first photosensitive polymer layer, followed by application of a protective, second photosensitive polymer layer. An opening is defined in the second photosensitive polymer layer exposing a portion of the top surface of a redistribution shape followed by placement of a solder ball in this opening. A reflow anneal procedure results in the solder ball wetting and overlying only the portion of the redistribution shape exposed in the opening in the second photosensitive polymer layer. Separation of the solder ball, flip chip regions from the non-solder ball, wire bond regions is accomplished via a dicing procedure performed in the dicing lane.

A leadframe with a structure made of a base metal (105), wherein the structure has a plurality of surfaces. On each of these surfaces are metal layers in a stack adherent to the base metal. The stack comprises a nickel layer (201) in contact with the base metal, a palladium layer (202) in contact with the nickel layer, and an outermost tin layer (203) in contact with the palladium layer. In terms of preferred layer thicknesses, the nickel layer is between about 0.5 and 2.0 μm thick, the palladium layer between about 5 and 150 nm thick, and the tin layer less than about 5 nm thick, preferably about 3 nm. At this thinness, the tin has no capability of forming whiskers, but offers superb adhesion to polymeric encapsulation materials, improved characteristics for reliable stitch bonding as well as affinity to reflow metals (solders).

A moisture resistant housing assembly is provided, the housing defining an internal space and an ambient space surrounding said internal space, the housing constructed at least partially of a polymeric material and a moisture barrier layer covering a portion of the polymeric material, the moisture barrier layer having a moisture permeation coefficient that is lower than the moisture permeation coefficient of the polymeric material.

The present invention is drawn to pigment suspensions, methods of forming pigment suspensions, and ink sets. The pigment suspension can comprise a liquid vehicle and a polymer-encapsulated pigment suspended in the liquid vehicle. The polymer-encapsulated pigment can include a pigment core, a passivation layer of an alkoxy metal deposited on a surface of the pigment core, and a polymer encapsulation layer attached to or deposited on the passivation layer.

A coated pigment that includes polymer encapsulations which act as a pigment dispersant and film forming agent, coating systems that include the coated pigment and methods for producing the coated pigment and the coating system are described. The polymer encapsulations of the coated pigments allow the coated pigments that are included in the coating system to be dispersed without the addition of any other dispersants and / or resins. Thus, the disclosed coated pigments simplify the process of making coating systems. The disclosed coated pigments also extend the shelf-life of the coating systems, and provide a final coating with enhanced pigment orientation and aesthetics.