The invention discloses a
monocrystalline silicon slicing device capable of freely adjusting size of a
wafer to be
cut, and belongs to the technical field of
monocrystalline silicon. The
slicing device comprises a working platform, wherein two groups of guide rollers are driven by a
conveyor belt, a
chip collecting box is installed in the center of an inner cavity of the working platform, and theend, away from fixing blocks, of a supporting rod is connected with a clamping device; and an electric telescopic rod is arranged in the center of the bottom of a rack, the bottom of the electric telescopic rod is connected with a fixing rod, the outer wall of the fixing rod is uniformly sleeved with sleeves, and
cutting blades are arranged in the centers of the bottoms of the sleeves. The spacingbetween the sleeves is adjusted in the device, so that the device can
cut the
monocrystalline silicon into different sizes; the monocrystalline
silicon is fixed by the clamping device, so that
cutting exists in errors caused by the movement of the monocrystalline
silicon are prevented; and meanwhile, the
cutting blades rotate, so that blocking blocks rotate like fan blades to generate
wind force,and chips generated by cutting on the working platform are blown to the
chip collecting box, and the chips are prevented from splashing onto the monocrystalline
silicon to damage the surface of the monocrystalline silicon.