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75results about How to "Sufficient transparency" patented technology

Light emitting diode with wavelength conversion

The invention relates to a wavelength-converting reaction resin compound into which a wavelength-converting luminescent material and a thixotroping agent are mixed, wherein the luminescent material contains inorganic luminescent particles. The thixotroping agent is present, at least in part, in the form of nanoparticles. Methods of producing the reaction resin compound and light-emitting diode elements having such reaction resin compounds are indicated.
Owner:OSRAM GMBH

Transparent solid oil cosmetics

A solid cosmetic comprising components (A), (B), (C), and (D) below: (A) a polyamide resin; (B) diisostearyl malate; (C) a polyglyceryl isostearate; and (D) a liquid oil; and not containing a wax when the component (A) comprises only an ester-terminated polyamide resin.
Owner:KOKYU ALCOHOL KOGYO

Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof

A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The passivation layer is patterned to define a plurality of first and second access openings which respectively describe on the first metal layer a plurality of first and second solder bump pads, each of which is interconnected to at least one of the second solder bump pads. The sensing portion's photo-sensing die is positioned with its photo-sensing area opposing the front surface region of the assembly portion's substrate, and has formed thereon a plurality of solder bump pads electrically coupled to the photo-sensing area. Each of the first solder joints extends between one of the sensing portion's solder bump pads and one of the assembly portion's first solder bump pads.
Owner:OPTOPAC

Illuminating devices and window glasses employing titanium dioxide photocatalysts

A titanium dioxide film (2) having at least photocatalytic activity, whose light linear transmittance corresponding to light having a wavelength of 550 nm is not less than 50% and whose thickness is 0.1 to 5 .mu.m or so, is formed on a transparent substrate (1) constituted by a glass plate or the like. Preferably, a precoat film (3), which has optical transmissivity and is constituted by a SiO.sub.2 film having a thickness of 0.02 to 0.2 .mu.m or so, is provided between the transparent substrate (1) and the titanium dioxide film (2). Thereby, excellent photocatalytic action and optical transmissivity can be obtained. Moreover, members composing various structures such as a glass window, which are especially required to have optical transparency, can be further provided with photocatalytic activities.
Owner:KANAGAWA ACADEMY SCI & TECH +1

Method of homo- or co-polymerization of alpha-olefin

The present invention relates to a method of homo- or co-polymerization of alpha-olefin by means of using a catalyst system which comprises the following components: (1) a solid complex titanium catalyst produced by means of a production method comprising the following steps: (a) preparing a magnesium compound solution by dissolving a magnesium halide compound and a compound of Group IIIA of the Periodical Table in a solvent of mixture of cyclic ester, one or more types of alcohol, a phosphorus compound, and an organic silane; (b) precipitating the solid particles by reacting said magnesium compound solution with a transitional metal compound, a silicon compound, a tin compound, or the mixture thereof; and (c) reacting said precipitated solid particles with a titanium compound and electron donors; (2) an organometallic compound of metal of Group IIIA of the Periodical Table; and (3) external electron donors comprising three or more types of organo-silicon compounds, wherein the melt flow rates of the homopolymers obtained from polymerization by individually using said organo-silicon compounds under the same polymerization conditions are 5 or less, 5~20, and 20 or higher, respectively. According to the present invention, it has an advantage of obtaining polymers of broad molecular weight distribution with high hydrogen reactivity and melt flow rates while maintaining high stereoregularity and yields for olefin homo- or co-polymers during homo- or co-polymerization of alpha-olefin having three or more carbon atoms.
Owner:SAMSUNG GENERAL CHEMICALS CO. LTD

Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof

A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The passivation layer is patterned to define a plurality of first and second access openings which respectively describe on the first metal layer a plurality of first and second solder bump pads, each of which is interconnected to at least one of the second solder bump pads. The sensing portion's photo-sensing die is positioned with its photo-sensing area opposing the front surface region of the assembly portion's substrate, and has formed thereon a plurality of solder bump pads electrically coupled to the photo-sensing area. Each of the first solder joints extends between one of the sensing portion's solder bump pads and one of the assembly portion's first solder bump pads.
Owner:OPTOPAC

Method of homo- or co-polymerization of alpha-olefin

The present invention relates to a method of homo- or co-polymerization of alpha-olefin by means of using a catalyst system which comprises the following components: (1) a solid complex titanium catalyst produced by means of a production method comprising the following steps: (a) preparing a magnesium compound solution by dissolving a magnesium halide compound and a compound of Group IIIA of the Periodical Table in a solvent of mixture of cyclic ester, one or more types of alcohol, a phosphorus compound, and an organic silane; (b) precipitating the solid particles by reacting said magnesium compound solution with a transitional metal compound, a silicon compound, a tin compound, or the mixture thereof, and (c) reacting said precipitated solid particles with a titanium compound and electron donors; (2) an organometallic compound of metal of Group IIIA of the Periodical Table; and (3) external electron donors comprising three or more types of organo-silicon compounds, wherein the melt flow rates of the homopolymers obtained from polymerization by individually using said organo-silicon compounds under the same polymerization conditions are 5 or less. 5~20, and 20 or higher, respectively. According to the present invention, it has an advantage of obtaining polymers of broad molecular weight distribution with high hydrogen reactivity and melt flow rates while maintaining high stereoregularity and yields for olefin homo- or co-polymers during homo- or co-polymerization of alpha olefin having three or more carbon atoms.
Owner:SAMSUNG GENERAL CHEMICALS CO. LTD

Ultraviolet and infrared absorptive greenish glass

The present invention relates to an ultraviolet and infrared absorptive greenish glass (the first glass) containing in weight % expression at least coloring components of 0.3-0.5% of total Fe2O3, 0.8-2.0% CeO2, 0.8-2.0% TiO2, and 0.10-0.25% of FeO. This first glass may be an ultraviolet and infrared absorptive greenish glass (the second glass) in which CeO2 amounts to 0.8-1.5% and TiO2 amounts to 0.8-1.5%, and which contains at least 0.1-0.7% SnO as a coloring component. Each glass is characterized in each glass at 5 mm thickness is 9% or less in ultraviolet transmittance (Tuv) according to ISO / DIS9050, 1% or less in 350 nm wavelength transmittance (T350), 70% or greater in 550 nm wavelength transmittance (T550), and 25% or less in 1100 nm wavelength transmittance (T1100).
Owner:CENT GLASS CO LTD

Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof

A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The passivation layer is patterned to define a plurality of first and second access openings which respectively describe on the first metal layer a plurality of first and second solder bump pads, each of which is interconnected to at least one of the second solder bump pads. The sensing portion's photo-sensing die is positioned with its photo-sensing area opposing the front surface region of the assembly portion's substrate, and has formed thereon a plurality of solder bump pads electrically coupled to the photo-sensing area. Each of the first solder joints extends between one of the sensing portion's solder bump pads and one of the assembly portion's first solder bump pads.
Owner:OPTOPAC

Transparent conductor

The present invention is a transparent conductor containing electrically conductive particles, a binder, and an ultraviolet absorber. The transparent conductor of the present invention is so arranged that the ultraviolet absorber in the transparent conductor absorbs ultraviolet light even during irradiation of the transparent conductor with ultraviolet light, and is thus able to suppress influence of ultraviolet light on the electrically conductive particles.
Owner:TDK CORPARATION

Fine particles of antimony tin oxide for sunscreen, dispersion thereof for sunscreen material formation, sunscreen material and transparent base material for sunscreen

Physical characteristics of ATO fine particles capable of exhibiting such optical properties as a high visible light transmittance, a low solar radiation transmittance, and a low haze value when the ATO fine particles are formed on a transparent substrate or in the substrate are clarified, and the ATO fine particles having the physical characteristics thereof are manufactured. The ATO fine particles having such physical characteristics that a size of a crystallite constituting the ATO fine particles is 4 to 125 nm, and that a specific surface area of the fine particles of 5 to 110 m2 / g can exhibit the above-described optical properties, and an example of a method for manufacturing thereof is to parallel-drop an antimony chloride alcoholic solution and an ammonium hydrogen carbonate aqueous solution in a tin chloride aqueous solution, thoroughly wash generated precipitates, dry and calcinate them in an atmosphere, thereby the ATO fine particles are manufactured.
Owner:SUMITOMO METAL MINING CO LTD
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