The invention discloses a
grinding-free manufacturing method for buried hole plug resin of a high-density
interconnection laminated circuit board. The method comprises the following steps of: performing an early procedure, namely, performing shearing and
cutting work on supplied materials by using a shearing device according to a size requirement, and drilling a
cut circuit board blank by using a drilling device so as to form buried holes; and carrying out a
copper electroplating and thickening process,namely firstly carrying out
copper deposition work, then depositing a layer of thin
copper on the insulating hole wall of the drilled circuit board blank, completing the
copper deposition work after forming the thin copper, and then carrying out pattern
electroplating on the circuit board blank after
copper deposition. According to the method, the resin is leveled after buried in the holes, and then dried; and the dried resin does not need to be ground, so that the
grinding process is omitted; and therefore, manpower is saved, the production efficiency is improved, meanwhile,
grinding tools, electric resources,
water resources and the like will not be wasted for grinding work, and the production cost is greatly reduced.