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Grinding-free manufacturing method for buried hole plug resin of high-density interconnection laminated circuit board

A high-density interconnection and manufacturing method technology, which is applied in the field of high-density interconnection laminated circuit board embedded hole plug resin grinding-free production, can solve the problems of increasing grinding costs, improve efficiency, save manpower, and reduce costs Effect

Inactive Publication Date: 2021-07-30
江门市奔力达电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-density interconnected laminated circuit board buried hole plug resin grinding-free manufacturing method, which solves the need to manually grind the resin after the buried hole plug resin of the current high-density interconnected laminated circuit board, and The use of electricity resources, water resources and grinding tools in the grinding process will increase the cost of grinding

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] First of all, the pre-process is to use a shearing device to cut and cut the incoming material according to the size requirements, and then use a drilling device to drill holes in the cut circuit board blanks to form buried holes, and then perform electroplating and thickening In the copper process, the copper sinking work is carried out first, and then a thin layer of copper is deposited on the insulating hole wall of the circuit board blank after drilling. After the thin copper is formed, the copper sinking work is completed, and then the copper sinking circuit board blank is patterned. Electroplating, electroplating the required thickness of the copper layer, followed by the image transfer process, the dry film is pasted on the surface of the circuit board blank after copper plating, and then exposed by ultraviolet light, after exposure, the dry film will transfer the pattern to the copper surface, In order to realize the image transfer, then carry out the AOI process...

Embodiment 2

[0040] In embodiment one, add following operation:

[0041] In step 1, it is necessary to confirm the size of the material and the material of the material plate before cutting the material to avoid the situation of wrong material or size. During the drilling process, check whether the drilling device is faulty.

[0042] First of all, the pre-process is to use a shearing device to cut and cut the incoming material according to the size requirements, and then use a drilling device to drill holes in the cut circuit board blanks to form buried holes, and then perform electroplating and thickening In the copper process, the copper sinking work is carried out first, and then a thin layer of copper is deposited on the insulating hole wall of the circuit board blank after drilling. After the thin copper is formed, the copper sinking work is completed, and then the copper sinking circuit board blank is patterned. Electroplating, electroplating the required thickness of the copper laye...

Embodiment 3

[0044] In embodiment two, add following operation:

[0045] In step 2, after electroplating is thickened, measure the thickness of the copper layer to ensure that there is no large gap in the thickness of the copper layer.

[0046]First of all, the pre-process is to use a shearing device to cut and cut the incoming material according to the size requirements, and then use a drilling device to drill holes in the cut circuit board blanks to form buried holes, and then perform electroplating and thickening In the copper process, the copper sinking work is carried out first, and then a thin layer of copper is deposited on the insulating hole wall of the circuit board blank after drilling. After the thin copper is formed, the copper sinking work is completed, and then the copper sinking circuit board blank is patterned. Electroplating, electroplating the required thickness of the copper layer, followed by the image transfer process, the dry film is pasted on the surface of the circ...

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Abstract

The invention discloses a grinding-free manufacturing method for buried hole plug resin of a high-density interconnection laminated circuit board. The method comprises the following steps of: performing an early procedure, namely, performing shearing and cutting work on supplied materials by using a shearing device according to a size requirement, and drilling a cut circuit board blank by using a drilling device so as to form buried holes; and carrying out a copper electroplating and thickening process,namely firstly carrying out copper deposition work, then depositing a layer of thin copper on the insulating hole wall of the drilled circuit board blank, completing the copper deposition work after forming the thin copper, and then carrying out pattern electroplating on the circuit board blank after copper deposition. According to the method, the resin is leveled after buried in the holes, and then dried; and the dried resin does not need to be ground, so that the grinding process is omitted; and therefore, manpower is saved, the production efficiency is improved, meanwhile, grinding tools, electric resources, water resources and the like will not be wasted for grinding work, and the production cost is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of manufacturing high-density interconnected laminated circuit boards, in particular to a non-wearing method for manufacturing high-density interconnected laminated circuit board buried hole plug resins. Background technique [0002] The rapid development of the electronics industry in today's world has prompted the printed circuit industry, as the leading industry of the electronics industry, to continuously transform and upgrade to improve the level of manufacturing technology to meet the needs of market development. Among them, after the high-density interconnected laminated circuit board is buried with resin, it is a common practice in the industry to do the board grinding process, which has both advantages and obvious disadvantages. [0003] Today's high-density interconnected laminated circuit boards need to grind the resin after the resin is buried in the hole. The resin is usually ground manually. Ma...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/46H05K3/0094
Inventor 张勇谢宇光
Owner 江门市奔力达电路有限公司
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