51results about How to "Reduce reflected power" patented technology

An electromagnetic surgical ablation probe having a coaxial feedline and cooling chamber is disclosed. The disclosed probe includes a dipole antenna arrangement having a radiating section, a distal tip coupled to a distal end of the radiating section, and a ring-like balun short) or choke, which may control a radiation pattern of the probe. A conductive tube disposed coaxially around the balun short includes at least one fluid conduit which provides coolant, such as dionized water, to a cooling chamber defined within the probe. A radiofrequency transparent catheter forms an outer surface of the probe and may include a lubricious coating.

The invention provides a high-power microwave hole interior fracturing device for an engineering rock mass. The high-power microwave hole interior fracturing device comprises a high-power microwave generator, a high-power microwave coaxial heater, a high-power low-loss microwave coaxial transmission line and a microwave power self-adaption adjusting and controlling system; the high-power microwavegenerator comprises a continuous wave magnetron, a permanent magnet, a wave guide excitation cavity, a coaxial annular device, a coaxial matched load, a coaxial coupling converter, a wave guide coaxial converter and an output wave guide; the high-power microwave coaxial heater comprises a transmission line interior conductor, a transmission line exterior conductor, a microwave input joint, a microwave short circuit seal cover and a conductor supporting cylinder; the high-power low-loss microwave coaxial transmission line comprises an input end coaxial line, middle segment coaxial lines and anoutput end coaxial line, wherein the input end coaxial line is connected with the output end coaxial line through a plurality of middle segment coaxial lines which are connected in series; the microwave power self-adaption adjusting and controlling system comprises an impedance matching adjuster, a microwave power controller and a temperature sensor, and the real-time matching of impedance is carried out on the microwave power through the impedance matching adjuster.

A variable-frequency oscillator 1, a semiconductor power amplifier 2 for amplifying the output of the variable-frequency oscillator 1; a radiator 3 for radiating an electromagnetic wave for heating based on the output of the semiconductor power amplifier 2; a reflected wave monitoring circuit 5 for detecting a reflected wave of the electromagnetic wave for heating; and a controller 7 for controlling the oscillation frequency of the variable-frequency oscillator 1 are provided. The controller 7 changes the oscillation frequencies of the variable-frequency oscillator 1 discontinuously, thereby getting a frequency-hopping spread-spectrum radiation done by the radiator 3. The electromagnetic wave radiated by the radiator 3 irradiates an object 9 to be heated (which is usually food) inside a heating chamber 8, thereby heating the object.

A physical vapor deposition system may include an RF generator configured to supply a pulsing AC process signal to a target in a physical vapor deposition chamber via the RF matching network. A detector circuit may be coupled to the RF generator and configured to sense the pulsing AC process signal and to produce a corresponding pulsing AC voltage magnitude signal and pulsing AC current magnitude signal. An envelope circuit may be electrically coupled to the detector circuit and configured to receive the pulsing AC voltage and current magnitude signals and to produce a DC voltage envelope signal and a DC current envelope signal. A controller may be electrically coupled to the envelope circuit and the RF matching network and configured to receive the DC voltage and current envelope signals and to vary an impedance of the RF matching network in response to the DC voltage and current envelope signals.

An electromagnetic surgical ablation probe having a coaxial feedline and cooling chamber is disclosed. The disclosed probe includes a dipole antenna arrangement having a radiating section, a distal tip coupled to a distal end of the radiating section, and a ring-like balun short, or choke, which may control a radiation pattern of the probe. A conductive tube disposed coaxially around the balun short includes at least one fluid conduit which provides coolant, such as dionized water, to a cooling chamber defined within the probe. A radiofrequency transparent catheter forms an outer surface of the probe and may include a lubricious coating.

The present specification relates to a wireless power transmission device. The present specification provides a wireless power transmission device comprising: a power supply unit for supplying power to the wireless power transmission device; at least one first coil for transmitting power to a wireless power reception device; and first and second condensers configured so as to be connected respectively to different both ends of the power supply unit and the first coil.

A vacuum processing apparatus is provided, in which a deposition characteristic is easily adjusted, and occurrence of difference in deposition characteristic between deposition chambers can be suppressed, and reduction in equipment cost can be achieved, and a deposition method using the vacuum processing apparatus is provided. The vacuum processing apparatus is characterized by having a plurality of discharge electrodes (3a to 3h) that are supplied with high-frequency power from a power supply unit (17a) through both ends (53) thereof, and form plasma with respect to a substrate (8) respectively, and a plurality of matching boxes (3a to 3ht) which tune phases and amplitudes of the high-frequency power supplied to the plurality of discharge electrodes (3a to 3h) at the ends (53) respectively; wherein impedance of the plurality of matching boxes (3a to 3ht) are set to approximately the same value, and the impedance value is a value at which reflected power is approximately minimized, the reflected power being returned to the power supply unit (17a) from one discharge electrode among the plurality of discharge electrodes (3a to 3h).

The invention discloses a method for reducing reflection power in plasma etching. The method comprises the following steps of: performing a stabilization process, performing a transformation process, an insulating antireflection layer etching process, an adhesive layer removing process, a main etching process, a bottom adhesive layer removing process, an over-etching process and a charge releasing process on a wafer to be etched in turn; and etching a metal layer of the wafer. By the method, the reflection power can be effectively reduced, and the yield of a product is improved.