The invention discloses a
silicon controlled
rectifier module with a
sieve-aperture-shaped low-stress
copper lead electrode, and an assembling method for the
silicon controlled
rectifier module. The
silicon controlled
rectifier module comprises a
metal bottom plate, a
ceramic copper-coated plate substrate, a
chip and a
copper inner
lead electrode piece. The contact surface of the copper inner
lead electrode piece and the
chip is provided with one or more hollow-out long-strip and circular
sieve apertures. A leading-out part of the copper inner lead
electrode piece is provided with one or more stress buffering bent parts. The copper inner lead
electrode piece is directly welded with a
cathode, thereby improving the quick heat dissipation capability of the
chip, and improving the load capability of a product. The contact surface of the copper inner lead
electrode piece and the chip is provided with one or more hollow-out long-strip and circular
sieve apertures, thereby reducing the lateral stress between the copper inner lead electrode piece and the chip, improving the reliability of the product on the basis of
high heat dissipation, reducing the
workflow, and improving the efficiency. The leading-out end of the copper inner lead electrode piece and the chip is provided with one or more stress buffering bent parts, thereby reducing the stress of the product, and improving the reliability of the product.