The invention relates to a high-reliability three-dimensional heterogeneous integrated
radio frequency analog-digital integrated
microsystem. Three-dimensional heterogeneous integration is realized through three-level POP stacking, a high-density
radio frequency substrate and a high-density digital-analog substrate are stacked in a
ceramic base through internal BGA solder balls, the high-density substrate is used as a wiring medium, the
ceramic base serves as an airtight packaging body and a
signal fan-out medium, after the
ceramic base is sealed, POP stacking is conducted on the ceramic base and a
polymer base, a gap is filled with underfill glue, the
polymer base conducts vertical
signal transmission, and a final complete packaging body structure is formed. A traditional multi-step multi-cavity multi-layer wiring integrated ceramic tube shell packaging mode is replaced, packaging design is greatly simplified, meanwhile, the problems that when a traditional ceramic tube shell and a PCB are directly welded, due to the fact that thermal stress generated by large material
thermal expansion coefficient difference is large,
welding balls and bonding pads lose
efficacy are solved, the process difficulty is lowered, and meanwhile, high-density integration and high reliability are realized.