A highly reliable three-dimensional heterogeneous integrated radio frequency analog-digital integrated microsystem

Abstract

The invention relates to a high-reliability three-dimensional heterogeneous integrated radio frequency analog-digital integrated micro system, which realizes three-dimensional heterogeneous integration through 3-level POP stacking. Inside the base, the high-density substrate is used as the wiring medium, and the ceramic base is used as the hermetic package and the signal fan-out medium. After the ceramic base is capped, the ceramic base and the polymer base are POP stacked and underfilled with glue The gap is filled, and the polymer base performs vertical signal transmission to form the final complete package structure, replacing the traditional multi-step multi-cavity multi-layer wiring integrated ceramic tube and shell package, which greatly simplifies the package design and solves the problem of the traditional ceramic package. When the shell and the PCB are directly welded, the excessive thermal stress caused by the large difference in the thermal expansion coefficient of the materials leads to the failure of the solder balls and pads, which reduces the difficulty of the process and achieves high-density integration and high reliability at the same time.

Description

technical field [0001] The invention is a highly reliable three-dimensional heterogeneous integrated radio frequency analog and digital integrated micro system, which belongs to the technical field of microelectronic packaging. Background technique [0002] Moore's law is close to the physical limit, but in the future, electronic information systems will continue to develop in the direction of higher integration, higher performance, and higher operating frequency. Traditional integrated packaging technologies are gradually unable to meet the requirements of new system integration. The future technology development trend will be the combination of continuing Moore's Law and surpassing Moore's Law, and realizing a higher-value system-microsystem through three-dimensional heterogeneous integration. Microsystem integration technology is the main means to achieve higher integration, higher performance, and higher operating frequency requirements through the use of heterogeneous i...

AI Technical Summary

Problems solved by technology

[0006] The traditional high-reliability airtight ceramic package RF microsystem uses a multi-step multi-cavity multi-layer wiring integrated ceramic shell package. The ceramic shell is used as both the package body and the wiring layer. Layer step bonding refers to design, multi-layer high-speed wiring and multi-cavity structure design. Due to the limited wiring accuracy of ceramic materials, the number of wiring layers is large, the overall design is complex, the process is difficult to realize, the processing cycle is long, and the production yield is low. The cost of the shell is high, and it is difficult to promote it on a large scale in engineering. In addition, no matter whether the circuit design needs to be modified or the structure of the shell needs to be modified, the ceramic shell needs to be redesigned and processed. The iteration cycle is too long, which is not conducive to the rapid launch of products and seize market opportunities.

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