Multifunctional base plate based on PCB technology and manufacturing method thereof
A production method and multi-functional technology, applied in semiconductor/solid-state device manufacturing, instruments, electrical components, etc., can solve the problems of large packaging loss, complex electrical interconnection conduction, embargo, etc., and achieve strong anti-electromagnetic interference ability and production The effect of simple process and large transmission capacity
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[0024] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0025] A multifunctional substrate compatible with PCB technology, its structure is as follows figure 1 As shown, it includes a multilayer interconnection substrate 1 , a glass substrate 2 and an optical waveguide layer 3 .
[0026] Wherein the glass substrate 2 is pressed on the upper end surface of the multilayer interconnection substrate 1 , and the upper surface of the glass substrate 2 is etched with an upper layer pattern. An electronic device 5 is welded on the upper pattern on the upper surface of the glass substrate, and the electronic device is sealed with a glass cover.
[0027] The optical waveguide layer 3 is pressed on the lower end surface of the multilayer interconnection substrate 1. The optical waveguide layer 3 includes an upper cladding layer 31, an optical waveguide core layer 32, and a lower cladding layer 33; ...
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