Radio frequency module three-dimensional stacking structure and manufacturing method thereof
A three-dimensional stacking, radio frequency module technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as no solution, difficult wafer bonding process multi-layer stacking, etc., to achieve excellent performance and solve process temperature. Compatibility, good structural strength effect
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[0032] Such as Figure 1~6 As shown, a three-dimensional stacked structure of a radio frequency module includes a glass cap layer 1, a glass carrier layer 2, a glass interposer frame layer 3, a silicon-based carrier layer 4, a ceramic packaging layer 5 and a radio frequency chip 6; a glass carrier layer 2, a glass Both the transfer frame layer 3 and the silicon-based carrier layer 4 are provided with through holes 9 and interconnection lines 10; the glass cap layer 1, the glass carrier layer 2, the glass transfer frame layer 3, the silicon-based carrier layer 4, and the ceramic packaging layer 5 Stacked and interconnected sequentially from top to bottom; the radio frequency chip 6 is located on the upper surface of the silicon-based carrier layer 4 and the upper surface of the glass carrier layer 2, and is connected to the circuit pad on the carrier layer through a lead structure; the glass cap layer 1, the glass carrier The layer 2 and the glass transfer frame layer 3 form a ...
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