75results about How to "Prevent crack propagation" patented technology

The present invention is an implant for securing to a bone to form a plurality of cement cells. The implant has a bone engagement portion for engagement with the bone. The implant has surfaces defining a first plurality of cement compartments in the bone engagement portion for alignment with a second plurality of cement compartments in the bone to form a plurality of cement cells extending between the implant and the bone when the implant is secured to the bone. The cement cells receive cement therein to form plugs of cement extending between the implant and the bone to secure the implant to the bone.

Methods for increasing the fracture resistance of a polymer stent's drug-polymer coating and scaffolding including applying a coating and crimping using techniques that increase the resistance to fracture in the coating layer and scaffolding and scaffolding.

A semiconductor device includes a silicon substrate having a main surface, a memory cell formed on the main surface, and an interlayer insulating film formed on the main surface to cover the memory cell. The interlayer insulating film has a top surface and a peripheral edge. In the interlayer insulating film, grooves are formed to be placed between the memory cell and the peripheral edge, to extend in parallel with the main surface and to extend in a predetermined direction at a spacing with each other, and a groove is formed to diverge from the grooves and to extend in a direction different from the extending direction of the grooves. The semiconductor device further includes metal film filling the grooves. Thus, crack propagation from the peripheral edge to the inside of the interlayer insulating film can surely be prevented to provide a semiconductor device with high reliability.

The invention discloses an array substrate, a display panel and a display device. The array substrate includes a display area and a non-display area around the display area. The non-display area includes a peripheral circuit area and an edge area. The peripheral circuit area surrounds the display area, and the edge area surrounds the peripheral circuit area. The array substrate includes a substrate, at least one first protective figure arranged on the substrate at intervals, a first inorganic layer arranged on the substrate and the at least one first protective figure, and at least one secondprotective figure arranged on the first inorganic layer at intervals. The at least one first protective figure and the at least one second protective figure are located in the edge area. The orthographic projections of the geometric centers of the first protective figures in the plane of a flexible display plane do not overlap the orthographic projections of the geometric centers of the second protective figures in the plane of the flexible display plane. By using the array substrate, the problem of crack diffusion during display panel cutting can be prevented, and the production efficiency ofthe display panel can be enhanced.

An outer coating material (13) of a vacuum heat insulation material is a layered body made by layering, with adhesive agent layers (25, 26) in between, a sealant layer (21), a metal layer (22), a first plastic film layer (23), and a second plastic film layer (24), in that order from the inner side. When the vacuum heat insulation material is pierced by a foreign object, one layer in the inside of the layered body shuts off propagation of breakage caused by the piercing to prevent production of a through pin hole. By use of the outer coating material with high gas barrier ability and excellent pin hole resistance against piercing by a fine foreign object, a high-quality vacuum heat insulation material capable of maintaining excellent heat insulation performance for a long period is obtained.

The invention relates to a metal matrix ceramic composite and manufacturing method and application thereof. The metal matrix ceramic composite, is completely formed by permeating at least part of a matrix metal into an array of ceramic granules by means of squeeze-casting, and the volume percentage of the ceramic granules may be adjusted within a range of 10%-80% of the metal matrix ceramic composite according to the usage requirements. The metal matrix ceramic composites can not only retain high performance of anti-penetration, but also have the strong toughness of the metal; in addition, this composite has features of low density, resistance against ordinary mechanical cutting and flame cutting, and inhibition of crack propagation and the like. Therefore, said composite has broad application prospects in the protection of such important security facilities as safes, automatic teller machines and vault gates.

A method and structure prevents crack propagation to the active die circuitry of a main die area during sawing around the outer periphery of the main die area. Stress relief elements, such as dummy vias, are provided in the scribe line area between the saw lane and the main die area. The dummy vias prevent cracks induced by the sawing process from propagating to the main die area.

Aspects of the disclosure provide a method of inhibiting crack propagation in a silicon wafer. In one embodiment, a method of repairing an imperfection on a surface of a semiconductor device is disclosed. The method includes: screening for imperfections on a surface of a silicon wafer of a semiconductor device; and in response to at least one imperfection on the surface of the silicon wafer, depositing a material on the surface of the silicon wafer.

A semiconductor device includes: a substrate in which a product region and scribe regions are defined; a 1st insulation film formed above the substrate; a metal film in the 1st insulation film, disposed within the scribe regions in such a manner as to surround the product region; a 2nd insulation film formed on the 1st insulation film and the metal film; a 1st groove disposed more inside than the metal film in such a manner as to surround the product region, and reaching from a top surface of the 2nd insulation film to a position deeper than a top surface of the metal film; and a 2nd groove disposed more outside than the metal film in such a manner as to surround the metal film, and reaching from the top surface of the 2nd insulation film to a position deeper than the top surface of the metal film.

A structural element includes the following elements: a carrier element, a reinforcing element, and a sheathing element. At least a portion of the reinforcing element is enveloped by the sheathing element and the reinforcing element is embedded in the carrier element. Materials of the elements are selected to inhibit crack initiation or propagation in the elements and/or from one element to another. An intermediate layer of a different material may be added between elements to further inhibit crack initiation and propagation and to inhibit corrosion, such as galvanic corrosion.

A seal and method of making seals utilises folds in order to form creases in a length of material such that the creases reinforce individual seal elements or surfaces whilst perforations or slots in a seal edge allow air leakage from one side of the seal element or surface to the other. Thus, air pressurisation can take place between spaced seal elements or surfaces and this allows air flotation or riding of a rotating component relative to a static housing component. The perforations are typically graduated from the seal edge in order to provide the best pressurisation and air-riding effect for proximity or gap control between the sealing edge and the rotating component surface. The slots effectively provide flexibility to the sealing edge such that the seal component emulates a brush seal.

The invention is related to a semiconductor encapsulating structure, comprising: a wafer carrier that includes an upper surface and a lower surface, wherein the lower surface is provided with plural first conduction pads; a water which is arranged and electrically connected with the wafer carrier; and plural turriform projections that are correspondingly arranged on these first conduction pads, for welding outwards, each of the turriform projections includes at least a first crack suppression ring which is parallel to these first conduction pads and which is used for suppressing expansion of the welding crack. The invention can effectively prevent the expansion of crack at solder-welding interfaces and avoid the issue of electric breaking as the external terminals provided at the wafer carrier are the turriform projections and at least one crack suppression ring is contained in the invention. Furthermore, the invention also can increase welding fixation strength in order to achieve high production durability. The invention is particularly suitable for a stacked structure and extremely practicable owing to effective suppression of the crack expansion at micro-contact welding sites.

A crack-resistant member for preventing crack propagation, a method of preventing crack propagation, and method of assembly a tower are provided. The crack-resistant member includes at least one insert attached to at least one removed portion at a predetermined location along a girth weld and adjacent a heat affected zone of the tower. The at least one insert is positioned perpendicular to a weld direction and intersecting the girth weld. The at least one insert prevents crack propagation in the girth weld of the tower.

A seal and method of making seals utilises folds in order to form creases in a length of material such that the creases reinforce individual seal elements or surfaces whilst perforations or slots in a seal edge allow air leakage from one side of the seal element or surface to the other. Thus, air pressurisation can take place between spaced seal elements or surfaces and this allows air flotation or riding of a rotating component relative to a static housing component. The perforations are typically graduated from the seal edge in order to provide the best pressurisation and air-riding effect for proximity or gap control between the sealing edge and the rotating component surface. The slots effectively provide flexibility to the sealing edge such that the seal component emulates a brush seal.

A road wheel for a tracked vehicle is provided with a circular mounting flange having a dished wall extending radially outwards and circumferentially therefrom, a peripheral rim having a first edge and a second edge with the rim connected to an outer edge of the dished wall at an intermediate region of the rim, and a first lip extending from the first edge. Another road wheel for a tracked vehicle is provided with a mounting flange, a peripheral rim, at least one inner dished wall, at least one outer dished wall offset from the inner dished wall along the flange, and at least two connector walls with each connector wall extending between the inner dished wall, outer dished wall, and the peripheral rim.