182results about How to "Maximize production efficiency" patented technology

Provided is a light emitting device including a Fresnel lens and / or a holographic diffuser formed on a surface of a semiconductor light emitter for improved light extraction, and a method for forming such light emitting device. Also provided is a light emitting device including an optical element stamped on a surface for improved light extraction and the stamping method used to form such device. An optical element formed on the surface of a semiconductor light emitter reduces reflective loss and loss due to total internal reflection, thereby improving light extraction efficiency. A Fresnel lens or a holographic diffuser may be formed on a surface by wet chemical etching or dry etching techniques, such as plasma etching, reactive ion etching, and chemically-assisted ion beam etching, optionally in conjunction with a lithographic technique. In addition, a Fresnel lens or a holographic diffuser may be milled, scribed, or ablated into the surface. Stamping, an alternative method for forming an optical element, can also be used to form a Fresnel lens or a holographic diffuser on the surface of a semiconductor light emitter. Stamping includes pressing a stamping block against the surface of a light emitting diode. The stamping block has a shape and pattern that are the inverse of the desired optical element. Optionally, stamping can be done before, after, or concurrently with wafer-bonding. Alternatively, a material can be stamped and later bonded to the semiconductor light emitter.

Provided is a method of producing D-psicose using a D-psicose epimerase derived from Agrobacterium tumefaciens. Provided are a protein having an amino acid sequence of SEQ ID NO:1 and having a psicose 3-epimerase activity, a gene encoding the protein, a recombinant expression vector containing the gene, and a method of producing D-psicose by reacting the protein produced on a mass scale with D-fructose. The method of producing D-psicose is an environmentally friendly method using a new enzyme, in which an inexpensive substrate is used, and the activity of the enzyme can be retained for a prolonged time period. Thus, the method can be efficiently used for the mass production of D-psicose.

A vegetable alga and microbe photosynthetic reaction system and method for the same is used for vegetable algae and microbe cultivation liquid and algae seeds infused herein to circularly conduct photosynthesis and discharge oxygen; the vegetable alga and microbe photosynthetic reaction system comprises a photosynthetic reaction unit, a pressure liquid infusion unit, and an oxygen discharge and regulation unit; the photosynthetic reaction unit is a light permeable pipeline; the oxygen discharge and regulation unit is assembled with an oxygen discharge can, a liquid collection can, and a regulation can for facilitating production and assembly, and many oxygen discharge points so that oxygen formed in the cultivation liquid can be quickly evaporated.

A vegetable alga and microbe photosynthetic reaction system and method for the same is used for vegetable algae and microbe cultivation liquid and algae seeds infused herein to circularly conduct photosynthesis and discharge oxygen; the vegetable alga and microbe photosynthetic reaction system comprises a photosynthetic reaction unit, a pressure liquid infusion unit, and an oxygen discharge and regulation unit; the photosynthetic reaction unit is a light permeable pipeline; the oxygen discharge and regulation unit is assembled with an oxygen discharge can, a liquid collection can, and a regulation can for facilitating production and assembly, and many oxygen discharge points so that oxygen formed in the cultivation liquid can be quickly evaporated.

Disclosed are a method and an apparatus for processing a wafer in manufacturing a semiconductor device and a method and an apparatus for etching a material formed on the wafer, wherein first and second cooling parts adjust an ambient temperature near a plurality of wafers to a first temperature, the wafers are processed by introducing a reaction gas at the first temperature, then, a heating part rapidly raises the temperature of the atmosphere near the wafers from the first temperature to the second temperature to partially separate by-products produced during the processing, the second temperature is maintained to separate most of the by-products from the wafers, and the processing steps are implemented in-situ within the same space. Accordingly, a native oxide layer formed on several wafers can be etched and the reaction by-products can be removed in-situ in the same chamber so productivity is improved.

Systems and methods for pre-aligning print head(s) to alignment adapter(s) to increase print resolution of printed matter, and to reduce offline time of a printing system due to print head alignment, include the use of an alignment adapter to which a print head is pre-aligned and which includes precision alignment features which precisely engage cooperating precision alignment features on the print head carriage mounting plate of the print head carriage. Print head(s) can be pre-aligned and fine-tuned to alignment adapter(s) even while the printing system is still in print production. Pre-aligned print head / alignment adapter assemblies can then be quickly mounted on the print head carriage using the cooperating precision alignment features of the adapter and print head carriage mounting plate. Duplicate sets of print head mounting sockets can include print heads aligned at different relative offsets (e.g., half a pixel) to increase the print resolution.

The invention relates to a system and a method for analyzing a production process. In order to make it possible to analyze the production process in an improved manner for the purpose of production planning, the invention proposes a method for analyzing a production process in which at least one production device that is controlled by a control program is involved, wherein the method has the following method steps: at least one part of the control program is simulated using a simulation program and instructions which are executed in this case are logged, and an associated data record, in which the real-time requirement of an action caused by the logged instruction on the production device is respectively assigned to the logged instructions, is generated.

A numbering device is disclosed for marking molded cast parts, the device including a plurality of concentric cylinders having indicia disposed on an end thereof, the cylinders being rotatingly indexable to cause the indicia to move as desired to form the desired mark, the mark is then impressed into a sand mold and subsequently reproduced on the cast part.

This invention relates to a method for production planning in which changing demands and current demands are combined and separated into fixed demands, time-flexible demands, and quantity-flexible demands before being prioritized according to a set of rules that optimize efficient handling of changing demands while minimizing changes in and maximizing flexibility of a production schedule.

An improvement in manufacturing and resulting structure of a torque transmitting assembly for use in a vehicle transmission which transmits torque from a first rotating member to a second rotating member wherein production efficiency is maximized and production costs are minimized.

The invention relates to an intelligent workshop management method and system, and the method comprises the steps: presetting a workshop standard database; collecting the personnel data, product data, environment data and equipment data; carrying out the analysis of the personnel data, product data, environment data and equipment data; judging whether each state of a workshop is normal or not; outputting an adjustment instruction, and carrying out the management of the personnel, products, environment and equipment of the workshop. The system comprises a presetting module which is used for presetting the workshop standard database; a collection module which is used for collecting the personnel data, product data, environment data and equipment data; an analysis module which is used for the analysis of the personnel data, product data, environment data and equipment data; a judgment module which is used for judging whether each state of the workshop is normal or not; and a management module which is used for outputting the adjustment instruction and carrying out the management of the personnel, products, environment and equipment of the workshop. The method and system achieve the comprehensive management of the personnel, products, environment and equipment of the workshop.

The invention discloses a method for calculating the power loss of a wind turbine generator system based on a reliability dimension, which comprises the following steps: 1) dividing the state of the wind turbine generator system into 14 kinds based on the reliability dimension; 2) collecting that historical data of the actual wind speed and the actual power of the unit in a preset period of time,filter the collected historical data and obtaining an average value; 3) fitting the filtered and averaged historical data with the least square method to obtain the wind speed; Power curve as reference curve; 4) through that real-time data of the reliability state of the wind turbine generator set, the time period in which the wind turbine generator set is in the non-resettable fault, the scheduled inspection, the maintenance, the dispatch power restriction, the power restriction shutdown, the on-site and off-site affected state being found out in the calculation time period; 5) the actual wind speed corresponding to the time period of each state being taken as a variable and substituted into a reference curve to obtain the correspond theoretical power po; 6) the calculated theoretical power po being subjected to statistical integral to obtain the corresponding power loss under each state of the wind turbine generator system.

Disclosed are a method and an apparatus for processing a wafer in manufacturing a semiconductor device and a method and an apparatus for etching a material formed on the wafer, wherein first and second cooling parts adjust an ambient temperature near a plurality of wafers to a first temperature, the wafers are processed by introducing a reaction gas at the first temperature, then, a heating part rapidly raises the temperature of the atmosphere near the wafers from the first temperature to the second temperature to partially separate by-products produced during the processing, the second temperature is maintained to separate most of the by-products from the wafers, and the processing steps are implemented in-situ within the same space. Accordingly, a native oxide layer formed on several wafers can be etched and the reaction by-products can be removed in-situ in the same chamber so productivity is improved.

The invention provides an adhesive composition which is useful for electronic assembly comprising a photopolymerizable acrylic resin containing polymerizable acrylate, a moisture-curable resin including an alkoxy or acyloxy silane terminated polymer, a photoinitiator for initiating polymerization of the acrylate, and a photoacid generator for catalyzing a moisture curing reaction of the alkoxy or acyloxy silane terminated polymer. Also provided are assemblies including such adhesives, such as electronic assemblies and radio frequency identification tags.