30results about How to "Improve the effect of laser processing" patented technology

A laminated body of the present invention includes a resin layer in which a core portion composed of a fiber base member having a thickness of 25 μm or less is embedded, the resin layer having two surfaces, and the resin layer through which at least one via-hole is adapted to be formed, and a metal layer bonded to at least one of the two surfaces of the resin layer, and the metal layer having at least one opening portion provided so as to correspond to the via-hole to be formed. Further, a method of manufacturing a substrate of the present invention includes preparing the above laminated body, forming the via-hole so as to pass through the resin layer by irradiating a laser beam onto the resin layer, and removing the metal layer from the resin layer after the via-hole is formed. Further, a substrate of the present invention is manufactured by using the above method. Furthermore, a semiconductor device of the present invention includes the above substrate, and a semiconductor element mounted on the substrate.

The invention discloses a multifunctional laser processing head. The processing head is formed by combining a scanning galvanometer type laser processing head and a spray nozzle type laser processing head into a closed structure through a connecting piece, and when the multifunctional laser processing head works, a laser beam can enter into the scanning galvanometer type laser processing head, be projected to the spray nozzle type laser processing head via the scanning galvanometer type laser processing head and be further converged on the surface of a workpiece on a two-dimensional worktable. The connecting piece can adopt a connecting cylinder and is positioned between a two-dimensional all-trans scanning galvanometer and a convergent lens or positioned between the convergent lens and a coaxial processing spray nozzle. The multifunctional laser processing head disclosed by the invention can overcome the defects of the existing two laser processing heads and fully utilize the advantages of the two laser processing heads. The invention provides the multifunctional laser processing head, which can realize more than two laser processing ways, reduce cost, improve efficiency and further enhance laser processing capability.

Provided is a resin composition for laser processing, which improves the laser processability of the resin composition while maintaining the resist performance of the resin after ultraviolet laser processing, and which can be used in It is used, for example, as a resist used when forming circuits in printed wiring boards. The resin composition for laser processing comprises a resin and an ultraviolet absorber, wherein the resin has a carboxyl group and is a thermoplastic resin having a softening point of 70 to 140° C., and the content of the ultraviolet absorber is 1 part based on 100 parts of the thermoplastic resin. to 30 servings.

The invention provides a device and method for wafer laser processing. The device comprises a laser unit, a beam expanding and collimating element, a phase-controlled-type silicon-based liquid crystal and a focusing element; the laser unit is used for emitting laser beams; the beam expanding and collimating element is used for beam expanding and collimating of the laser beams to form the parallel light beams; the phase-controlled-type silicon-based liquid crystal is used for conducing energy distribution modulation on the parallel light beams to form random customized multi-light-beam assemblies or conducting shape-correction treatment to form flattop light spots to be emitted to the focusing element; and the focusing element is used for emitting the random customized multi-light-beam assemblies or the flattop light spots to the upper surface of a wafer and removing Low-K materials of the upper surface of the wafer in the pre-set cutting way direction. According to the device and method for wafer laser processing, through the phase-controlled-type silicon-based liquid crystal, energy distribution modulation or shape-correction treatment is conducted on the parallel light beams to improve the work efficiency and accuracy of the processing method and the uniformity of wafer separation, and the device and method for wafer laser processing can be suitable for the requirements of the various flattop light spots.

The invention provides a wafer laser processing method and a device. The method comprises the steps of setting the required preset channel information formed by laser beams on a Low-K layer of the upper surface of a wafer after processing; matching topological pattern distribution required by the laser beams according to the preset channel information; performing beam splitting treatment, shape-correction treatment and focusing treatment to the laser beams according to the topological pattern distribution, and then forming laser spots with the topological pattern distribution for etching the Low-K layer of the upper surface of the wafer and forming the preset channel shape. According to the processing method, the required channel shape formed by the laser beams on the Low-K layer of the upper surface of the wafer after processing can be determined according to the subsequent processing requirements, and the channel information is formed; then, the preset channel information is set through setting elements, and the preset channel information is matched with the optimal topological pattern distribution through a controller, so that the grooves formed on the low-K layer of the surface of the wafer by etching is uniform, a heat-affected zone is small, and the uniformity is high.

The invention discloses a laser two-dimensional code ear tag modification material special for breeding stock. The modification material is characterized by comprising the following materials in part by weight: 97 to 99 parts of polyurethane, 1.5 to 2.5 parts of antimony trioxide, 0.01 to 0.03 part of dispersant and 0.05 to 0.09 part of coupling agent. By using the advantages of the thermoplasticpolyurethane such as oil resistance, toughness, abrasion resistance, ageing resistance and the like and adding a photo-oxidation stabilizing auxiliary agent, the weather resistance of the material isimproved, and the problems of ageing, brittleness, breakage, drop and the like under the actions of air, sunlight and oxygen after an ear tag is worn for long time are solved; and by adding a modifying material into the polyurethane, the laser processing performance of a thermoplastic polyurethane elastomer is enhanced, and batch production of laser processing on the thermoplastic polyurethane elastomer material is realized. Tested by the applicant, the drop, breakage or fracture rate of the ear tag made of the modification material does not exceed 2 percent when the ear tag is worn by the breeding stock in three years.

The invention provides a laser machining method and device for a wafer. The method comprises that at least two laser beams having different energy distribution respectively execute a hacking process and a grooving process on a predetermined cutting path on the upper surface of the wafer in sequence and are used for forming a groove in the predetermined cutting path on the upper surface of the wafer. The predetermined cutting path on the upper surface of the wafer can be hacked by the laser beams with lower energy, the surface of the predetermined cutting path is roughened to improve a light absorptivity, which is convenient for preparation for a subsequent machining process, and the wafer is prevented from being damaged by stripping of a Low-K material caused by a fact that a Low-K layer on the surface of the wafer is machined by adopting the laser beams with over high energy; and meanwhile, the control precision on the energy of the laser beams in a subsequent machining process is higher, and further a laser machining effect of the upper surface of the wafer is improved.

To provide a thermosetting electrically conductive paste excellent in laser processability and enabling an electrode having high electrical conductivity to be formed. According to the present invention, the thermosetting electrically conductive paste is provided. The thermosetting electrically conductive paste contains an electrically conductive powder, a thermosetting resin and a curing agent. The electrically conductive powder contains a non-agglomerated electrically conductive powder and an agglomerated electrically conductive powder different from each other in a degree of agglomeration expressed by a ratio (L-D 50 / SEM-D 50) between a number-basis average particle size (SEM-D 50) based on electron microscope observation and a volume-basis average particle size (L-D 50) based on a laser diffraction scattering particle size distribution measurement method. The degree of agglomeration of the non-agglomerated powder is 1.5 or smaller, the degree of agglomeration of the agglomerated powder exceeds 1.5 and is 3 or smaller, the L-D 50 of the agglomerated electrically conductive powder does not exceed L-D 50 of the non-agglomerated electrically conductive powder.

The invention relates to a controllable laser processing device based on wavefront modulation. The controllable laser processing device based on wavefront modulation comprises a laser processing head, an irradiation module and a photoelectric detection analysis module. The irradiation module and the photoelectric detection analysis module are located in different positions of the laser emitting mechanical edge of the laser processing head. Emitting beams of the irradiation module cover the laser processing working area and peripheral areas of the laser processing head, and light fields inside the emitting beam coverage area of the irradiation module are incident on the photoelectric detection analysis module. A light filed wavefront modulation element is arranged on a laser processing light path, so that shaping is achieved by focusing light spots, the laser processing performance is improved, and an optical material analysis technology and a photoelectric position detection technology are combined. Emitting light of the irradiation module irradiates the laser processing area and the peripheral areas of the laser processing head, material composition information and movement position information inside the irradiated areas are detected by the photoelectric detection analysis module, the phenomenon that a non-processing object enters the laser processing area is avoided, and laser of the laser processing device is safe and controllable.