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Heat Curable Conductive Paste

A heat curing, conductive technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, etc.

Active Publication Date: 2020-06-05
NORITAKE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the case of the printing method commonly used in the past when forming electrodes, it is difficult to form thin-line electrodes with high precision. Furthermore, electrodes of 50μm / 50μm or less

Method used

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Embodiment Construction

[0048] A preferred embodiment of the present invention will be described below. It should be noted that, other than the matters particularly mentioned in this specification (such as the composition of the heat-curable conductive paste), the matters necessary for the implementation of the present invention (such as the production method of the heat-curable conductive paste, the electrode ( The formation method of the conductive film) and the like) can be grasped as a matter of design by those skilled in the art based on the prior art in this field. The present invention can be implemented based on the contents disclosed in this specification and common technical knowledge in this field.

[0049]

[0050] The heat-curable conductive paste (hereinafter sometimes simply referred to as "paste") disclosed herein contains (A) conductive powder, (B) thermosetting resin, and (C) curing agent as essential components. And it is characterized in that said (A) contains at least two type...

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Abstract

To provide a thermosetting electrically conductive paste excellent in laser processability and enabling an electrode having high electrical conductivity to be formed. According to the present invention, the thermosetting electrically conductive paste is provided. The thermosetting electrically conductive paste contains an electrically conductive powder, a thermosetting resin and a curing agent. The electrically conductive powder contains a non-agglomerated electrically conductive powder and an agglomerated electrically conductive powder different from each other in a degree of agglomeration expressed by a ratio (L-D 50 / SEM-D 50) between a number-basis average particle size (SEM-D 50) based on electron microscope observation and a volume-basis average particle size (L-D 50) based on a laser diffraction scattering particle size distribution measurement method. The degree of agglomeration of the non-agglomerated powder is 1.5 or smaller, the degree of agglomeration of the agglomerated powder exceeds 1.5 and is 3 or smaller, the L-D 50 of the agglomerated electrically conductive powder does not exceed L-D 50 of the non-agglomerated electrically conductive powder.

Description

technical field [0001] The present invention relates to a heat-curable conductive paste. Background technique [0002] In recent years, various electrical and electronic devices have been enhanced in performance such as miniaturization, high density, and high-speed operation. Accordingly, for electronic components for electric-electronic devices, electrodes are required to be further densely thinned. However, in the case of the printing method commonly used in the past when forming electrodes, it is difficult to form thin-line electrodes with high precision. Furthermore, electrodes of 50 μm / 50 μm or less. [0003] Therefore, the utilization of the laser etching method using a laser is examined. In this method, first, a conductive paste is produced in the same manner as conventionally. Next, the manufactured conductive paste is printed on a desired substrate to form a conductive coating (conductive film). Next, the formed conductive film is irradiated with laser light so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22
CPCH01B1/22
Inventor 深谷周平垣添浩人铃木夕子
Owner NORITAKE CO LTD
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